Datasheet

Parameter Max. Units
V
CES
Collector-to-Emitter Breakdown Voltage 600 V
I
C
@ T
C
= 25°C Continuous Collector Current 22
I
C
@ T
C
= 100°C Continuous Collector Current 12 A
I
CM
Pulsed Collector Current 44
I
LM
Clamped Inductive Load Current 44
V
GE
Gate-to-Emitter Voltage ± 20 V
E
ARV
Reverse Voltage Avalanche Energy 5.0 mJ
P
D
@ T
C
= 25°C Maximum Power Dissipation 66
P
D
@ T
C
= 100°C Maximum Power Dissipation 26
T
J
Operating Junction and -55 to + 150
T
STG
Storage Temperature Range
Soldering Temperature, for 10 seconds 300 (0.063 in. (1.6mm) from case )
°C
Mounting torque, 6-32 or M3 screw. 10 lbf•in (1.1N•m)
IRG4RC20F
Fast Speed IGBT
INSULATED GATE BIPOLAR TRANSISTOR
E
C
G
Features
• Fast: Optimized for medium operating
frequencies (1-5 kHz in hard switching, >20
kHz in resonant mode).
• Generation 4 IGBT design provides tighter
parameter distribution and higher efficiency than
previous generation IGBTs.
Industry standard TO-252AA package
Combines very low V
CE(on)
with low switching
losses
• Generation 4 IGBTs offer highest efficiency
Optimized for specific application conditions
High power density and current rating
Benefits
V
CES
= 600V
V
CE(on) typ.
= 1.82V
@V
GE
= 15V, I
C
= 12A
Thermal Resistance
Absolute Maximum Ratings
W
2/22/01
D-Pak
TO-252AA
°C/W
Parameter Typ. Max. Units
R
θJC
Junction-to-Case ––– 1.9
R
θJA
Junction-to-Ambient (PCB mount)* ––– 50
Wt Weight 0.3 (0.01) ––– g (oz)
* When mounted on 1" square PCB (FR-4 or G-10 Material).
For recommended footprint and soldering techniques refer to application note #AN-994
N-channel
PD - 91731A

Summary of content (8 pages)