Datasheet
IFX4949
General Product Characteristics
Data Sheet 7 Rev. 1.0, 2012-05-07
4.2 Functional Range
Note: Within the functional or operating range, the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the Electrical Characteristics table.
4.3 Thermal Resistance
Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go
to www.jedec.org.
Table 1
Pos. Parameter Symbol Limit Values Unit Conditions
Min. Max.
4.2.1 Input Voltage Range for Normal
Operation
V
IN
5.5 28 V –
4.2.2 Extended Input Voltage Range
V
IN
3.5 40 V –
1)
2)
1) The output voltage will follow the input voltage for input voltages below V
OUT
+ V
DR
, i.e device is in tracking mode until
V
OUT
+ V
DR
is reached.
2) Input voltages ranging from > 28 V up to 40 V may only be applied for transient periods
t
TR
< 1s.
Pos. Parameter Symbol Limit Values Unit Conditions
Min. Typ. Max.
IFX4949SJ (PG-DSO-8)
4.3.3 Junction to Soldering Point
1)
1) Not subject to production test, specified by design.
R
thJSP
–71–K/W–
4.3.4 Junction to Ambient
1)
R
thJA
– 116 – K/W –
2)
2) Specified R
thJA
value is according to Jedec JESD51-2,-7 at natural convection on FR4 2s2p board; The Product
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).
4.3.5 – 172 – K/W Footprint only
3)
3) Specified R
thJA
value is according to JEDEC JESD 51-3 at natural convection on FR4 1s0p board; The Product
(Chip+Package) was simulated on a 76.2 × 114.3 × 1.5 mm
3
board with 1 copper layer (1 x 70µm Cu).
4.3.6 – 145 – K/W 300 mm
2
heatsink
area on PCB
3)
4.3.7 – 139 – K/W 600 mm
2
heatsink
area on PCB
3)
Thermal Shutdown
4.3.8 Junction Temperature
T
JSD
– 165 – °C
1)