Datasheet

IFX2931
General Product Characteristics
Data Sheet 6 Rev. 1.13, 2011-02-10
4.3 Thermal Resistance
Pos. Parameter Symbol Limit Values Unit Conditions
Min. Typ. Max.
IFX2931GV50, IFX2931GV33 (PG-DSO-8)
4.3.1 Junction to Soldering Point
1)
1) not subject to production test, specified by design
R
thJSP
– 39 – K/W measured to group
of pins 2, 3, 6, 7
4.3.2 Junction to Ambient
1)
R
thJA
– 96 – K/W Footprint only
2)
2) Specified R
thJA
value is according to Jedec JESD51-2,-7 at natural convection on FR4 2s2p board; The Product
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).
4.3.3 – 67 – K/W 300mm
2
heatsink
area on PCB
2)
4.3.4 – 66 – K/W 600mm
2
heatsink
area on PCB
2)