Datasheet

Data Sheet 6 Rev. 1.1, 2013-01-08
IFX20001
General Product Characteristics
4.2 Functional Range
Note: Within the functional or operating range, the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the Electrical Characteristics table.
4.3 Thermal Resistance
Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go
to www.jedec.org.
Pos. Parameter Symbol Limit Values Unit Remarks
Min. Max.
4.2.1 Input voltage
V
I
4.0 45 V IFX20001MBV33
4.2.2 Input Voltage
V
I
5.5 45 V IFX20001MBV50
4.2.3 Inhibit Voltage
V
INH
-0.3 40 V
4.2.4 Junction temperature
T
j
-40 125 °C–
Pos. Parameter Symbol Limit Values Unit Conditions
Min. Typ. Max.
4.3.5 Junction to Ambient
R
thJA
– 81 – K/W 2s2p board
1)
1) Specified R
thJA
value is according to JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The product
(chip+package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).
Where applicable a thermal via array under the package contacted the first inner copper layer.
4.3.1 – 217 – K/W Footprint only
2)
2) Package mounted on PCB FR4; 80 x 80 x 1.5 mm; 35 µm Cu, 5 µm Sn; horizontal position; zero airflow.
Not subject to production test; specified by design.
4.3.2 – 117 – K/W 300 mm
2
PCB
heatsink area
2)
4.3.3 – 103 – K/W 600 mm
2
PCB
heatsink area
2)
4.3.4 Junction to Soldering Point R
thJSP
– 30 – K/W Pins 2, 5 fixed to T
A