Datasheet

Data Sheet BTS50085-1TMB
Infineon Technologies AG Page 3 2008-Jan-24
Thermal Characteristics
Parameter and Conditions Symbol Values Unit
min typ max
Thermal resistance chip - case:
R
thJC
7
)
-- -- 0.75
K/W
junction - ambient (free air): R
thJA
--
60 --
SMD version, device on PCB
8
)
: -- 33 --
Electrical Characteristics
Parameter and Conditions Symbol Values Unit
at Tj = -40 ... +150 °C, V
bb
= 24 V unless otherwise specified
min typ max
Load Switching Capabilities and Characteristics
On-state resistance (Tab to pins 1,2,6,7, see
measurement circuit page 7)
I
L
= 20 A, T
j
= 25 °C:
V
IN
= 0, I
L
= 20 A, T
j
= 150 °C:
R
ON
-- 7.2
14.6
9
17
mΩ
I
L
= 80 A, T
j
= 150 °C: -- 17
V
bb
=6V, I
L
=20A, T
j
=150°C: R
ON(Static)
17 22
Nominal load current
9
)
(Tab to pins 1,2,6,7)
ISO 10483-1/6.7: V
ON
= 0.5 V, T
c
= 85 °C
10
)
I
L(ISO)
38 44 -- A
Nominal load current
9)
, device on PCB
8)
T
A
= 85 °C, T
j
≤ 150 °C V
ON
≤ 0.5 V, I
L(NOM)
9.9 11.1 -- A
Maximum load current in resistive range
(Tab to pins 1,2,6,7) V
ON
= 1.8 V, T
c
= 25 °C:
see diagram on page 13 V
ON
= 1.8 V, T
c
= 150 °C:
I
L(Max)
185
105
--
--
--
--
A
Turn-on time
11
)
I
IN
to 90% V
OUT
:
Turn-off time I
IN
to 10% V
OUT
:
R
L
= 1 Ω , T
j
=-40...+150°C
t
on
t
off
50
30
--
--
400
110
µs
Slew rate on
11)
(10 to 30% V
OUT
)
R
L
= 1 Ω
dV/dt
on
1.0 1.5 2.2 V/µs
Slew rate off
11)
(70 to 40% V
OUT
)
R
L
= 1 Ω
-dV/dt
off
1.1 1.9 2.6 V/µs
7
)
Thermal resistance R
thCH
case to heatsink (about 0.5 ... 0.9 K/W with silicone paste) not included!
8
)
Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm
2
(one layer, 70µm thick) copper area for V
bb
connection. PCB is vertical without blown air.
9
)
not subject to production test, specified by design
10
)
T
J
is about 105°C under these conditions.
11
)
See timing diagram on page 14.