Datasheet

Smart High-Side Power Switch
BTS50080-1TEA
General Product Characteristics
Datasheet 8 Rev. 1.0, 2008-08-28
Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are
not designed for continuous repetitive operation.
4.2 Thermal Resistance
Pos. Parameter Symbol Limit Values Unit Conditions
Min. Typ. Max.
4.2.1 Junction to Case
1)
1) Not subject to production test, specified by design.
R
thJC
–-1.1K/W–
4.2.2 Junction to Ambient
1)
free air
device on small PCB
2)
device on standard PCB
3)
2) Device mounted on PCB (50 mm x 50 mm x 1.5mm epoxy, FR4) with 6 cm
2
copper heatsinking area (one layer, 70 µm
thick) for V
bb
connection. PCB is vertical without blown air.
3) Specified R
thJA
value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product
(Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).
Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.
R
thJA
-
-
-
80
45
22
-
-
-
K/W –