Datasheet

High Current H-Bridge
BTM7752G
General Product Characteristics
Data Sheet 8 Rev. 2.0, 2010-05-28
5.3 Thermal Resistance
Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go
to
www.jedec.org.
Pos. Parameter Symbol Limit Values Unit Conditions
Min. Typ. Max.
Thermal Resistance
Junction to Soldering Point, Low Side Switch
R
thjSP(LS)
= ΔT
j(LS)
/ P
v(LS)
R
thjSP(LS)
– – 29 K/W
1) Not subject to production test, specified by design.
Thermal Resistance
Junction to Soldering Point, High Side Switch
R
thjSP(HS)
= ΔT
j(HS)
/ P
v(HS)
R
thjSP(HS)
– – 29 K/W
1)
Thermal Resistance
Junction to Soldering Point, both switches
R
thjSP
= max[ΔT
j(HS)
, ΔT
j(LS)
] /
(P
v(HS)
+ P
v(LS)
)
R
thjSP
– – 29 K/W
1)
Thermal Resistance
Junction-Ambient
R
thja
– 46 – K/W
1)
2) Specified R
thja
value is according to Jedec JESD51-2, -7 at natural convection on FR4 2s2p board; The product
(chip+package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu).
;
2)
1)
Transient thermal impedance Z
thja
Figure 5 is showing the typical transient thermal impedance of high side or low side switch of BTM7752G mounted
according to JEDEC JESD51-7 at natural convection on FR4 2s2p board. The device (chip+package) was
simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu). For the
simulation each chip was separately powered with 1W at an ambient temperature
T
a
of 85°C.
0
5
10
15
20
25
30
35
40
45
50
0,001 0,01 0,1 1 10 100 1000
t
pulse
[s]
Z
th-ja
[K/W]
High side sw itch / Low side sw itch
Figure 5 Typical transient thermal impedance of BTM7752G on JESD51-7 2s2p board
(1W each chip (separately heated), T
a
= 85°C, single pulse)
5.3.1
5.3.2
5.3.3
5.3.4