Datasheet
1999-09-22
Page 2
BSP308
Preliminary data
Thermal Characteristics
Parameter Symbol UnitValues
min. max.typ.
Characteristics
Thermal resistance, junction - soldering point 25 K/W-
R
thJS
-
SMD version, device on PCB:
@ min. footprint
@ 6 cm
2
cooling area
1)
R
thJA
-
-
-
-
110
70
K/W
Electrical Characteristics, at
T
j
= 25 °C, unless otherwise specified
Parameter Symbol Values Unit
min. typ. max.
Static Characteristics
Drain- source breakdown voltage
V
GS
= 0 V,
I
D
= 250 µA
V
(BR)DSS
30 - V-
Gate threshold voltage,
V
GS
=
V
DS
I
D
= 20 µA
1.2 1.6 2
V
GS(th)
Zero gate voltage drain current
V
DS
= 30 V,
V
GS
= 0 V,
T
j
= 25 °C
V
DS
= 30 V,
V
GS
= 0 V,
T
j
= 125 °C
µA
1
100
I
DSS
0.1
10
-
-
I
GSS
- 10 100Gate-source leakage current
V
GS
= 20 V,
V
DS
= 0 V
nA
Drain-Source on-state resistance
V
GS
= 4.5 V,
I
D
= 3.9 A
R
DS(on)
- 0.05 0.075
Ω
Drain-Source on-state resistance
V
GS
= 10 V,
I
D
= 4.7
R
DS(on)
- 0.03 0.05
Ω
1
Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm
2
(one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.