Datasheet

ManualsBrandsINFINEON TECHNOLOGIES ManualsDiodesBGX 50 A (Bridge) NF Diode Case type SOT 23 I(F) 140 mA

2007-03-27

BGX50A...

Silicon Switching Diode Array

• Bridge configuration

• High-speed switching diode chip

• Pb-free (RoHS compliant) package

• Qualified according AEC Q101

BGX50A



, 

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Type Package Configuration Marking

BGX50A SOT143 bridge U1s

Maximum Ratings at T

= 25°C, unless otherwise specified

Parameter

Symbol Value Unit

Diode reverse voltage V

50 V

Peak reverse voltage V

Forward current I

140 mA

Non-repetitive peak surge forward current I

FSM

Total power dissipation

≤ 74°C

tot

210 mW

Junction temperature T

150 °C

Storage temperature T

stg

-65 ... 150

Thermal Resistance

Parameter

Symbol Value Unit

Junction - soldering point

BGX50A

thJS

360

K/W

Pb-containing package may be available upon special request

For calculation of R

thJA

please refer to Application Note Thermal Resistance

Summary of content (6 pages)

PAGE 1
BGX50A...
PAGE 2
BGX50A... Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values min. typ. max. DC Characteristics Breakdown voltage V(BR) Reverse current IR Unit µA VR = 50 V - - 0.2 VR = 50 V, TA = 150 °C - - 100 VF - - 1.3 V CT - - 1.5 pF trr - - 6 ns Forward voltage IF = 100 mA AC Characteristics Diode capacitance VR = 0 V, f = 1 MHz Reverse recovery time IF = 10 mA, IR = 10 mA, measured at IR = 1mA , RL = 100 Ω Test circuit for reverse recovery time D.U.
PAGE 3
BGX50A... Reverse current IR = ƒ (TA) Forward Voltage VF = ƒ (TA) IF = Parameter VR = Parameter ΙR 10 5 nA BGX 50A EHB00146 BGX 50A 1.0 V Ι F = 100 mA VF V R = 70 V 10 4 EHB00149 max. 5 10 mA 25V 70V 10 3 1 mA 0.5 5 0.1 mA typ. 10 2 5 10 1 0 50 100 ˚C 0 150 0 50 100 ˚C TA TA Forward current IF = ƒ (VF) Peak forward current IFM = ƒ (tp) TA = 25°C TA = 25°C 150 ΙF BGX 50A EHB00147 10 2 Ι FM mA BGX 50A EHB00148 A D= tp T 10 1 100 tp T D= 0.005 0.01 0.
PAGE 4
BGX50A...
PAGE 5
Package SOT143 BGX50A... 2 0.1 MAX. 10˚ MAX. 1 1 ±0.1 0.2 0.8 +0.1 -0.05 0.4 +0.1 -0.05 A 5 0...8˚ 0.2 M A 0.25 M B 1.7 0.08...0.1 1.3 ±0.1 3 2.4 ±0.15 4 B 10˚ MAX. 2.9 ±0.1 1.9 0.15 MIN. Package Outline Foot Print 1.2 0.8 0.9 1.1 0.9 0.8 1.2 0.8 0.8 Marking Layout (Example) RF s 56 Manufacturer Pin 1 2005, June Date code (YM) BFP181 Type code Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel 0.2 2.6 8 4 Pin 1 3.15 1.
PAGE 6
BGX50A... Edition 2006-02-01 Published by Infineon Technologies AG 81726 München, Germany © Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”).