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Title Page O P E R A T I N G M A N U UHV Bakeable Sensor PN 074-154N ® www.inficon.com ©2014 INFICON re achus@inficon.
Trademarks The trademarks of the products mentioned in this manual are held by the companies that produce them. RateWatcher™ is a registered trademark of INFICON GmbH. ConFlat® is a registered trademark of Varian Corporation. Inconel® is a registered trademark of Inco Alloys International, Huntington, WV. Swagelok® is a registered trademark of Swagelok Company. VCR® is a registered trademark of Cajon Company. Scotch-Brite™ is a trademark of 3M. Teflon® is a registered trademark of E.I.
Warranty WARRANTY AND LIABILITY - LIMITATION: Seller warrants the products manufactured by it, or by an affiliated company and sold by it, and described on the reverse hereof, to be, for the period of warranty coverage specified below, free from defects of materials or workmanship under normal proper use and service.
UHV Bakeable Sensor Operating Manual Table Of Contents Cover Page Title Page Trademarks Disclaimer Copyright Warranty Chapter 1 Introduction and Specifications 1.1 1.2 1.3 1.3.1 1.4 1.4.1 1.5 1.5.1 1.5.2 1.5.3 1.5.4 1.6 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1 Definition of Notes, Cautions and Warnings. . . . . . . . . . . . . . . . . . . . . . . . . 1-2 How to Contact INFICON . . . . . . . . . . . . . . . . . . . . . . . . . . .
UHV Bakeable Sensor Operating Manual Chapter 3 Solenoid Valve Assembly Installation 3.1 3.2 3.3 3.4 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 Installation with the UHV Bakeable Sensor . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 Pneumatic Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2 Electrical Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
UHV Bakeable Sensor Operating Manual Chapter 1 Introduction and Specifications 1.1 Introduction The INFICON UHV Bakeable Sensor (see Figure 1-1) is designed to withstand continuous bakeout temperatures up to 450°C (for bakeout only, water flow required for actual deposition monitoring). The front load design allows for easy insertion of the crystal holder in applications lacking sufficient room for side insertion. All UHV Bakeable Sensors are welded to a CF40 (2-3/4 in. ConFlat®) feedthrough.
UHV Bakeable Sensor Operating Manual 1.2 Definition of Notes, Cautions and Warnings Before using this manual, please take a moment to understand the Cautions and Warnings used throughout. They provide pertinent information that is useful in achieving maximum instrument efficiency while ensuring personal safety. NOTE: Notes provide additional information about the current topic. CAUTION Failure to heed these messages could result in damage to the instrument.
UHV Bakeable Sensor Operating Manual 1.3.1 Returning the UHV Bakeable Sensor to INFICON Do not return any sensor component to INFICON without first speaking with a Customer Support Representative and obtaining a Return Material Authorization (RMA) number. UHV Bakeable Sensors will not be serviced without an RMA number. Packages delivered to INFICON without an RMA number will be held until the customer is contacted. This will result in delays in servicing the UHV Bakeable Sensor.
UHV Bakeable Sensor Operating Manual 1.4.1 UHV Bakeable Sensor Configuration Overview and Parts UHV Bakeable Sensor . . . . . . . . . . . . . . BK-AXF (see Figure 1-2) Figure 1-2 UHV Bakeable Sensor configurations B K – Length of Sensor Type of Sensor (crystals sold separately) Standard (water lines parallel to crystal face) F A None Shuttered sensors From 17 to 101.6 cm (6.7 to 40 in.) Non-shuttered sensors From 10.2 to 101.6 cm (4 to 40 in.
UHV Bakeable Sensor Operating Manual 1.5 Specifications for the UHV Bakeable Sensor Figure 1-3 UHV Bakeable Sensor 1.5.1 UHV Bakeable Sensor without Shutter (PN BK-A0F) Maximum Temperature. . . . . . . . . . . 450°C continuous bakeout NOTE: Water flow recommended for deposition. Sensor Head Size (maximum envelope) . . . . . . . . . . . . 34 x 35 x 24 mm (1.35 x 1.38 x 0.94 in.) Tubes Water . . . . . . . . . . . . . . . . . . . . . 3.2 mm (0.125 in.) OD (vacuum side) 6.4 mm (0.25 in.
UHV Bakeable Sensor Operating Manual 1.5.2 UHV Bakeable Sensor with Shutter (PN BK-A1F) Maximum Temperature . . . . . . . . . . 400°C continuous bakeout NOTE: Water flow recommended for deposition. Sensor Head Size (maximum envelope) . . . . . . . . . . . . 34 x 35 x 31 mm (1.35 x 1.38 x 1.21 in.) Tubes Water . . . . . . . . . . . . . . . . . . . . . 3.2 mm (0.125 in.) OD (vacuum side) 6.4 mm (0.25 in.) OD (atmosphere side) Air . . . . . . . . . . . . . . . . . . . . . . . . 3.2 mm (0.125 in.
UHV Bakeable Sensor Operating Manual 1.5.4 Installation Requirements Feedthrough . . . . . . . . . . . . . . . . . . . CF40 (2-3/4 in. ConFlat) feedthrough, integral with sensor head Other . . . . . . . . . . . . . . . . . . . . . . . . XIU or Oscillator to match specific controller/monitor BK-A1F only: Solenoid Valve for air, PN 750-420-G1 (see Chapter 3, Solenoid Valve Assembly Installation) Water Flow Rate. . . . . . . . . . . . . . . .
UHV Bakeable Sensor Operating Manual 1.6 UHV Bakeable Sensor Drawings The following UHV Bakeable Sensor Outline and Assembly Drawings provide dimensions and other relevant data necessary for planning equipment configurations. Figure 1-4 on page 1-9. . . . . . . . . . . UHV Bakeable Sensor and Feedthrough Outline Figure 1-5 on page 1-10. . . . . . . . . . UHV Bakeable Sensor and Feedthrough Assembly Figure 1-6 on page 1-11. . . . . . . . . .
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1 - 10 PN 074-154N Figure 1-5 UHV Bakeable Sensor and feedthrough assembly UHV Bakeable Sensor Operating Manual
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1 - 12 PN 074-154N Figure 1-7 Shuttered UHV Bakeable Sensor with feedthrough assembly UHV Bakeable Sensor Operating Manual
UHV Bakeable Sensor Operating Manual Chapter 2 UHV Bakeable Sensor Installation 2.1 Pre-installation Sensor Check Prior to installing the sensor in the vacuum system, make certain that it is in proper working condition by following the appropriate procedure. 2.1.1 Sensor Check with XTC/3, IC6, or Cygnus 2 Deposition Controller 1 Connect one end of the 15.2 cm (6 in.) BNC cable (PN 755-257-G6) to the BNC connector on the feedthrough. 2 Connect the other end of the 15.2 cm (6 in.
UHV Bakeable Sensor Operating Manual 2.1.2 Sensor Check with STM-2XM, STM-3, SQM-160, SQC-310, SQM-242, or IQM-233 Deposition Controller/Monitor 1 Connect one end of the 15.2 cm (6 in.) BNC cable (PN 782-902-011) to the BNC connector on the feedthrough. 2 Connect the other end of the 15.2 cm (6 in.) BNC cable to the connector of the oscillator (PN 782-900-010 or 783-500-013) labeled Feedthrough or Sensor.
UHV Bakeable Sensor Operating Manual 2.1.3 Sensor Check with Q-pod™ or STM-2 Deposition Monitor 1 Connect one end of the 15.2 cm (6 in.) BNC cable (PN 782-902-011) to the BNC connector on the feedthrough. 2 Connect the other end of the 15.2 cm (6 in.) BNC cable to the connector of the Q-pod or STM-2. 3 Connect one end of the USB cable (PN 068-0472) to the mating connector of the Q-pod or STM-2.
UHV Bakeable Sensor Operating Manual 2.1.4 Sensor Shutter Check Temporarily connect an air supply to the actuator air tube fitting on the feedthrough. Use the manual override button on the solenoid valve (see Figure 3-2 on page 3-4), or other means, to activate and deactivate the pneumatic shutter several times. NOTE: The air supply must be 70 psi (gauge) {85 psi (absolute)} (5.8 bar (absolute) [584 kPa (absolute)] (minimum) to 80 psi (gauge) {95 psi (absolute)} (6.
UHV Bakeable Sensor Operating Manual Figure 2-1 Typical UHV Bakeable Sensor installation Mounting Bracket Source to Sensor 25.4 cm (10 in.
UHV Bakeable Sensor Operating Manual The sensor head must be installed such that the face of the crystal is perpendicular to the evaporant stream from the source (see Figure 2-2). Two effects may arise if the sensor head is not perpendicular to the evaporant stream, and the combination of these effects will have a negative effect on crystal life and increase the probability of mode hops: The deposit will not be even across the crystal surface.
UHV Bakeable Sensor Operating Manual In many cases installing multiple sensors to monitor one source can improve thickness accuracy. The rules for multiple sensors are the same as for a single sensor installation, and the locations chosen must be as defined above. Consult the monitor or controller manual for more information regarding the availability of this feature.
UHV Bakeable Sensor Operating Manual 7 If the bakeable sensor has a shutter: 7a Attach air connection to solenoid valve (see Chapter 3) and adjust air pressure to be 70 psi (gauge) {85 psi (absolute)} (5.8 bar (absolute)) [584 kPa (absolute)] (minimum) to 80 psi (gauge) {95 psi (absolute)} (6.5 bar (absolute)) [653 kPa (absolute)] (maximum). WARNING Do not exceed 100 psi (gauge) {115 psi (absolute)} (7.9 bar (absolute)) [791 kPa (absolute)].
UHV Bakeable Sensor Operating Manual 2.3.1 Tube Bending CAUTION Read this entire section before attempting to bend the tubes. Incorrect tube bending that damages the tubes voids the warranty.
UHV Bakeable Sensor Operating Manual 2.4 Providing Improved Cooling for the Sensor Because of its temperature requirements, the UHV Bakeable Sensor is made primarily of stainless steel. This poses a difficult problem from the design standpoint of thermal transfer. The clamping action of the spring and cam mechanism was found to provide better transfer of heat than other methods, because it allows continuous contact pressure throughout the temperature cycles encountered.
UHV Bakeable Sensor Operating Manual Chapter 3 Solenoid Valve Assembly Installation 3.1 Introduction The solenoid valve assembly (PN 750-420-G1, see Figure 3-2 on page 3-4) and the shuttered UHV Bakeable Sensor assembly should be installed at the same time. 3.2 Installation with the UHV Bakeable Sensor 1 Align the score line on the solenoid valve bracket (see Figure 3-2 on page 3-4) over the edge of a table or other square edge.
UHV Bakeable Sensor Operating Manual 9 Attach the P port of the solenoid valve to a source of air. The air supply must be 70 psi (gauge) {85 psi (absolute)} (5.8 bar (absolute)) [584 kPa (absolute)] (minimum) to 80 psi (gauge) {95 psi (absolute)} (6.5 bar (absolute)) [653 kPa (absolute)] (maximum) (see Pneumatic Connections, section 3.3.) WARNING Do not exceed 100 psi (gauge) {115 psi (absolute)} (7.9 bar (absolute)) [791 kPa (absolute)].
UHV Bakeable Sensor Operating Manual 3.4 Electrical Connections To complete installation of the assembly, make electrical connections where indicated in Figure 3-2 to either 24 V(ac) or 24 V(dc). Current required is approximately 70 mA. CAUTION PN 074-154N The maximum applied voltage must not exceed 26 V (ac) or 26 V (dc).
PN 074-154N Figure 3-2 Solenoid valve UHV Bakeable Sensor Operating Manual 3-4
UHV Bakeable Sensor Operating Manual Chapter 4 Maintenance and Spare Parts 4.1 General Precautions CAUTION Wear clean nylon or talc-free latex lab gloves when handling sensor components. If sensor components become contaminated, clean them thoroughly using a suitable solvent to avoid outgassing under vacuum. 4.1.
UHV Bakeable Sensor Operating Manual 4.1.3 Maintain the Temperature of the Crystal Periodically measure the water flow rate leaving the sensor to verify that the flow rate meets or exceeds the flow rate value specified (refer to page 1-7). Depending upon the condition of the cooling water used, the addition of an in-line water filtering cartridge system may be necessary to prevent flow obstructions. Many system coaters use parallel water supplies that provide high water flow rates.
UHV Bakeable Sensor Operating Manual 4.2 Crystal Replacement Instructions Follow the steps below to replace the crystals. NOTE: Review section 4.1, General Precautions, on page 4-1. CAUTION To preserve cleanliness and to maximize crystal performance, perform all work in a clean room environment. 1 Remove the crystal holder by releasing the clamping spring handle towards the crystal side of the sensor.
UHV Bakeable Sensor Operating Manual 6 Replace the ceramic retainer. Initially orient it at an angle to displace the spring wire segments in the crystal holder. CAUTION Do not use excessive force when handling the Ceramic Retainer Assembly since breakage may occur. Always use the crystal snatcher. To prevent scratching the crystal electrode, do not rotate the ceramic retainer after installation. 7 Release the crystal snatcher with a slight side-to-side rocking motion.
UHV Bakeable Sensor Operating Manual 4.3 UHV Bakeable Sensor Maintenance 4.3.1 Adjusting the Leaf Spring UHV Bakeable Sensors have one leaf spring with three prongs located on the ceramic retainer that provides an electrical connection to the crystal electrode. Examine the prongs on the leaf spring positioned on the ceramic retainer. If they are significantly lower than shown by Figure 4-2, they should be adjusted to an angle of approximately 45 degrees.
UHV Bakeable Sensor Operating Manual 4.3.2 Cleaning the Crystal Holder In dielectric coating applications, the crystal seating surface of the crystal holder may require periodic cleaning. Since most dielectrics are insulators, any material buildup on this surface from an evaporation process can cause a poor electrical contact between the crystal and the crystal holder. Material buildup will also cause a reduction in thermal transfer from the crystal to the sensor body.
UHV Bakeable Sensor Operating Manual 4.3.3 Adjusting the Crystal Holder Retainer Spring Occasionally, the ceramic retainer may not be secured in the crystal holder. To alter the retainer retention force, use the following procedure. Tools required Scribe or other pointed tool Needle nose pliers (two required) Procedure 1 Position the crystal holder with the crystal aperture oriented downward.
UHV Bakeable Sensor Operating Manual 7 Reinstall the spring into the groove provided in the crystal cavity. 8 Determine if the retention force is acceptable and that the wire does not impede crystal insertion. If needed, repeat the adjustment procedure. 4.3.4 Lubricating the Clamping Mechanism If operation is impaired, lubricate moving parts with molybdenum disulfide (PN 750-191-G1), provided with each shuttered sensor, or graphite (PN 009-175), if appropriate for the process.
UHV Bakeable Sensor Operating Manual Figure 4-7 Lubrication of shuttered UHV Bakeable Sensor Apply graphite to the top edge of the clamp where the shutter meets the clamp Apply molybdenum disulfide to the exposed shaft with the shutter in the open position Apply molybdenum disulfide to the hole where the pin makes contact with the shutter in the open and closed positions Lubricate these moving parts if operation is impaired Apply molybdenum disulfide or graphite to the inside of the slots in the clampi
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UHV Bakeable Sensor Operating Manual Chapter 5 Troubleshooting 5.1 Troubleshooting Tools If the UHV Bakeable Sensor fails to function, or appears to have diminished performance, diagnose the sensor using one or more of the following: Symptom, Cause, Remedy chart (see section 5.1.1) Diagnostic Tools (see section 5.1.2 on page 5-4) Digital Multimeter (see section 5.1.3 on page 5-5) 5.1.
UHV Bakeable Sensor Operating Manual Table 5-1 Symptom, Cause, Remedy (continued) SYMPTOM CAUSE REMEDY Crystal ceases to oscillate during deposition before it reaches its “normal” life. Damaged crystal. Replace the crystal. Deposition material on crystal holder opening is touching the crystal. Remove material buildup from the crystal holder opening, being careful not to scratch the crystal seating surface (refer to section 4.3.2 on page 4-6).
UHV Bakeable Sensor Operating Manual Table 5-1 Symptom, Cause, Remedy (continued) SYMPTOM CAUSE Thermal instability: large Excessive heat applied to the changes in thickness reading crystal. during source warm-up (usually causes thickness reading to decrease) and after the termination of deposition (usually causes thickness reading to increase). No cooling water. Water flow rate is low. Water temperature too high.
UHV Bakeable Sensor Operating Manual 5.1.2 Diagnostic Tools The following diagnostic tools can be used to determine if a crystal fail condition is due to the UHV Bakeable Sensor or the instrument the sensor is used with: PN 782-902-023 oscillator with 5.5 MHz test crystal (see section 5.1.2.1). OSC-100 oscillator test function (see section 5.1.2.2). PN 760-601-G2 Crystal Sensor Emulator (see section 5.1.2.3). XIU test function (see section 5.1.2.4). 5.1.2.1 PN 782-902-023 Oscillator with 5.
UHV Bakeable Sensor Operating Manual 5.1.2.4 XIU Test Function The XIU Test function is a feature of IC/5, Cygnus, IC6, Cygnus 2, and XTC/3 controllers. Refer to the controller operating manual for instructions on using the XIU test function. 5.1.3 Digital Multimeter A useful tool for diagnosing sensor problems is the Digital Multimeter (DMM). To isolate the cause of a sensor problem, perform electrical isolation and continuity checks, starting with the Electrical Isolation Check (section 5.1.3.1). 5.1.3.
UHV Bakeable Sensor Operating Manual 5.1.3.2 Electrical Continuity Check 1 Select the DMM ohmmeter function and a low resistance scale. NOTE: The resistance specifications in the following steps do not take into account the resistance of the Digital Multimeter probes. Touch the probe tips together and note the resistance reading. Compensate for probe resistance by subtracting probe resistance from resistance measurements, or by zeroing the ohmmeter while the probes are touching.
