Datasheet

Specifications of the HT2 MOA3 S20 Rev. 1.1 1997-08-19
Ht2moa3.doc/HS Page 4 of 22
2 Specifications
2.1 Mechanical Properties
Width
(Proposed Punching Outline)
7.55 mm
Length
(Proposed Punching Outline)
11.75 mm see also drawing in chapter 3
Overall Thickness 0.45 mm ± 0.03 mm
Film Thickness 0.16 mm ± 0.005 mm
Bondpad Size for
Transponder Coil / Module
Interconnection
1.9 x 3.5 mm Suitable for Welding/Soldering/
Conductive Gluing
2.2 Materials
Tape 110 µm Glass epoxy
Copper Plating 35 µm ED copper
Bond Plating Ni / Au Suitable for Al and Au wire
bonding
Backside Plating Ni / Au
Glob Top Filled Epoxy Thermal curing
2.3 Temperature Range
Operating -25°C to +85°C For packed transponder,
depending on type of package
Processing 150°C for 30 minutes at a standard lamination
pressure for contactless smart
card plastic materials (e.g. PVC,
PET, ...)
Welding Parameters max. 25 ms @ 500 °C on bond pads
Soldering Parameters max. 3 s @ 390 °C on bond pads