Datasheet

IDITECH CORPORATION
SPECIFICATION
TITLE SPC. NO.
PAGE： 2 OF 4
MINI DIN JACK
DATE： 2013.04.24
3. Mechanical characteristics
Item Conditions Specifications
3.1 Operating force
Insertion force
44.1N（4.5kgf）MAX
Withdrawal force
4.9N〜29.4N（0.5〜3kgf）
3.2 Contact pull
strength
Contact shall
withstand a steady strength pull of
2kg in the direction of contact breakout for 20
seconds.
Without parting
3.3 Single tenacity
0.098N（10g）MIN.
4. Resistance to soldering heat test
Item Conditions Specifications
4.1
The terminal for a printed circuit board：
Temperature of solder：260 ±5℃
Dip time：5 ±1 seconds
The terminal for a lead wire：
Temperature of solder：350 ±10℃
Dip time：3 ±1 seconds
Electrical and mechanical
characteristics shall be
satisfied, and not show
remarkable failure.
5. Soldering test
Item Conditions Specifications
5.1
Temperature of solder：260℃±5℃
Time of dip：3±0.5 seconds
Length of dip：2±0.5mm（from top of terminal）
To the balance point time：3 seconds
A new uniform of solder shall
cover a minimum of 95% of the
surface being immersed.
S－JACK/001