Datasheet

iC-VX
3-CHANNEL DIFFERENTIAL LINE DRIVER
Rev C1, Page 2/11
1
n.c.
2
E1
3
E2
4
VCC
5
VEE
6
PROG
7
VT
8
E3
9
VB2
10
n.c.
n.c.
20
A1
19
NA1
18
A2
17
16
VSUB
15
NA2
14
A3
13
NA3
12
n.c.
11
VB
DESCRIPTION
The device iC-VX is a monolithic, 3-channel line driver with complementary outputs for 24V applications.
The Schmitt trigger inputs contain pull-up current sources and run on separate operating voltages. Their
reference potential can be adjusted in the range of the output stage supply voltage to adapt the input threshold
voltage for various applications.
The guaranteed driver current can be set to 30mA (PROG pin open) or 100mA (PROG pin at VSUB). At low
load the drivers are TTL-compatible due to reduced saturation voltages. The output stages are current-limited
and, due to the shutdown at overtemperature, they are also protected against thermal destruction. Due to the
hysteresis of the overtemperature shutdown, the driver outputs switch on and off as a function of the iC power
loss until the overload ceases.
For 30mA driver current the short-circuit strength is guaranteed directly by the iC. For 100mA driver current
in 24V applications this is guaranteed by 30S series resistors.
Free-wheeling diodes at the outputs protect the iC against echoes of mismatched lines. The inputs and
outputs of the channels have diodes for protection against destruction by ESD.
PACKAGES SO16W, TSSOP20 to JEDEC Standard
PIN CONFIGURATION SO16W PIN FUNCTIONS
(top view) Name Function
E1 Input Channel 1
E2 Input Channel 2
VCC Inputs Supply Voltage (+5V)
VEE Reference Voltage for Inputs (0V)
PROG Programming Input for Driver Current
(open 30mA, PROG to VSUB 100mA)
VT +4.5..+30V Bias Supply Voltage
E3 Input Channel 3
VB2 +4.5..+30V Drivers Supply Voltage
NA3 Inverting Output Channel 3
A3 Input Channel 3
NA2 Inverting Output Channel 2
VSUB Ground, Substrate
PIN CONFIGURATION TSSOP20tp 4.4mm A2 Input Channel 2
(top view) NA1 Inverting Output Channel 1
A1 Input Channel 1
VB1 +4.5..+30V Drivers Supply Voltage
Pins VB1 and VB2 must both be connected when
the 100mA driver current is set.
To enhance heat removal, the TSSOP20 package
offers a large area pad to be soldered (a connection
is only permitted to VSUB).