Datasheet

iC-LF1401 OLGA LF2C
PACKAGE SPECIFICATION
Rev E1, Page 4/4
REVISION HISTORY
Rev Notes Pages affected
A1 Initial version
B1 Substrate length shortened to 9.7mm, smaller tolerance all
B2 Paddle/shield connected to AGND (was GND);
General Handling Instruction updated
all
C1 RoHS compliance 1, 4
D1 Convection reflow soldering peak temperature reduced to 245
◦
C 1, 4
E1 Measures L1/L2 corrected to reflect the actual glass dimensions 1, 4
GENERAL HANDLING INSTRUCTIONS
After opening the dry pack, devices must be mounted
within 8 hours (in factory conditions of maximum
30
◦
C/60% RH) or must be stored at < 10% RH. De-
vices require baking before mounting if the Humidity
Indicator Card shows > 10% when read at 23
◦
C ±5
◦
C
or if the conditions mentioned above are not met. De-
vices may be baked for 72 hours at 100
◦
C using high-
temperature device containers (trays).
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for a particular purpose or of any other nature are made hereunder with respect to information/specification or the products to which information refers and no
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to result in significant personal injury or death (Safety-Critical Applications) without iC-Haus’ specific written consent. Safety-Critical Applications include, without
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