Datasheet

iC-LF1401 OLGA LF2C
PACKAGE SPECIFICATION
Rev E1, Page 3/4
DIMENSION TABLE
Item Parameter Comments Unit
Min. Typ. Max. Tolerance
Substrate
A1 Outline X 9.7 ±0.1 mm
A2 Outline Y 8.0 ±0.15 mm
A3 Substrate Thickness bottom package to bottom die 0.917 1.0 1.27 mm
Reference
(B1) Outline vs. Reference X bottom left lead center is reference 1.04 ±0.1 mm
(B2) Outline vs. Reference Y bottom left lead center is reference 0.85 ±0.1 mm
Chip Placement
G3 Chip Thickness 0.3 ±0.025 mm
H1 Chip Position vs. Reference X reference vs. center of 1
st
sensor 0.223 ±0.15 mm
H2 Chip Position vs. Reference Y reference vs. center of 1
st
sensor 3.409 ±0.15 mm
H5 Chip Tilt Angle vs. Paddle ±1.6 DEG
Bottom Metal Pattern
J5 Lead Size X 1.5 ±0.03 mm
J6 Lead Pitch X (or Lead-Lead Distance X) 2.54 mm
J7 Lead Pitch Y (or Lead-Lead Distance Y) Mid of lead
(not drill; drill is not center of lead)
6.4 mm
J8 Solder Stop Off 1.7 ±0.1 mm
J9 Lead Size Y 1.3 ±0.03 mm
Encapulant (Glass Cover)
L1 Glass Size X 8.4 ±0.05 mm
L2 Glass Size Y 0.918 ±0.05 mm
L3 Glass Thickness 0.4 ±0.03 mm
Thickness Specifications
T1 Overall Thickness 1.56 2.0 mm