Datasheet

iC-LF1401 OLGA LF2C

PACKAGE SPECIFICATION

Rev E1, Page 1/4

ORDERING INFORMATION

Type Package Options Order Designation

iC-LF1401 OLGA LF2C none iC-LF OLGA LF2C

9.7 mm x 8.0 mm

PIN CONFIGURATION PIN FUNCTIONS

(top view) No. Name Function

1 SI Start Integration Input

2 CLK Clock Input

3 AO Analogue Output

4 VCC +5 V Supply Voltage

5 RSET Bias Current Adjust

6 AGND Analog Ground

7 GND Digital Ground

8 DIS Disable Integration Input

ABSOLUTE MAXIMUM RATINGS

Item Symbol Parameter Conditions Fig. Unit

No. Min. Typ. Max.

TG1 Ta Operating Ambient Temperature Range

(extended temperature range on request)

-40 100

◦

TG2 Ts Storage Temperature Range -40 115

◦

TG3 Tpk Reﬂow Soldering Peak Temperature tpk < 20 s, convection reﬂow

tpk < 20 s, vapour phase

TOL (time on label) 8 h; please refer

to Customer Information #7 for details

245

230

◦

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iC-LF1401 OLGA LF2C PACKAGE SPECIFICATION Rev E1, Page 1/4 ORDERING INFORMATION Type Package Options Order Designation iC-LF1401 OLGA LF2C none iC-LF OLGA LF2C 9.7 mm x 8.0 mm PIN CONFIGURATION PIN FUNCTIONS (top view) No. Name Function 1 2 3 4 5 6 7 8 SI CLK AO VCC RSET AGND GND DIS Start Integration Input Clock Input Analogue Output +5 V Supply Voltage Bias Current Adjust Analog Ground Digital Ground Disable Integration Input ABSOLUTE MAXIMUM RATINGS Item No.
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iC-LF1401 OLGA LF2C PACKAGE SPECIFICATION Rev E1, Page 2/4 PHYSICAL DIMENSIONS
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iC-LF1401 OLGA LF2C PACKAGE SPECIFICATION Rev E1, Page 3/4 DIMENSION TABLE Item Parameter Comments Unit Min. Typ. Max. Tolerance Substrate A1 Outline X 9.7 ±0.1 mm A2 Outline Y 8.0 ±0.15 mm A3 Substrate Thickness bottom package to bottom die 0.917 1.0 1.27 mm Reference (B1) Outline vs. Reference X bottom left lead center is reference 1.04 ±0.1 mm (B2) Outline vs. Reference Y bottom left lead center is reference 0.85 ±0.1 mm 0.3 ±0.
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iC-LF1401 OLGA LF2C PACKAGE SPECIFICATION Rev E1, Page 4/4 REVISION HISTORY Rev Notes Pages affected A1 Initial version B1 Substrate length shortened to 9.