Specifications

Thermal/Mechanical Design Guide 49
Component Suppliers
A.1.4 Socket and ILM Components
The LGA1366 Socket and ILM Components are described in Chapter 2 and Chapter 3,
respectively. Socket mechanical drawings are provided in Appendix C. Mechanical
models are listed in Table 1-1.
§
Assembly,
Heatsink,
Intel® Xeon®
Processor 5500
Series, 2U
2U Alternative URS
Heatsink
Supplier Designed
Solution,
Aluminum base,
Cu insert, Al fins,
heatpipes,
includes TIM, 95W
capable
Asia Vital
Components (AVC)
SR40400001
Asia Vital Components (AVC)
David Chao
[e-mail]
[phone] x7619
Supplier Designed
Solution, Cu base,
Al fins, heatpipes,
includes TIM, 95W
capable
Thermaltake
CL-P0486
Thermaltake
Sean Li
[e-mail]
[phone] EXT.235
Supplier Designed
Solution, Cu base,
Al fins, heatpipes,
includes TIM, 95W
capable
CoolerMaster
S2N-PJMHS-07-GP
CoolerMaster
Isaac Chu
[e-mail]
[phone] x11182
Supplier Designed
Solution, Cu base,
Al fins, heatpipes,
includes TIM, 95W
capable
TaiSol Corporation
1A0-9041000960-A
TaiSol Corporation
Janice Chiu
[e-mail]
[phone]
Supplier Designed
Solution,
Aluminum
Extrusion,
includes TIM, 80W
capable
Dynatron
Corporation
G520
Dynatron Corporation
Ian Lee
[e-mail]
510-498-8888 x137
Assembly,
Heatsink,
Intel® Xeon®
Processor 5500
Series, Tower
Tower Alternative
URS Heatsink
Supplier Designed
Solution, Al fins,
heatpipes, 130W
capable
TaiSol Corporation
1A0-9051000960-A
TaiSol Corporation
Janice Chiu
[e-mail]
[phone]
Supplier Designed
Solution, Al fins,
heatpipes, 130W
capable
Thermaltake
CL-P0485
Thermaltake
Sean Li
[e-mail]
[phone] EXT.235
Table A-3. Suppliers for the Alternative Thermal Solution
Assembly Component Description Supplier PN Supplier Contact Info
Table A-4. LGA1366 Socket and ILM Components
Item Intel PN Foxconn Tyco
ILM Cover Assembly D92428-002 PT44L12-4101 1939738-1
Server Back Plate D92433-002 PT44P12-4101 1981467-1
LGA1366 Socket D86205-002 PE136627-4371-01F 1939737-1
Supplier Contact Info
Julia Jiang
[e-mail]
408-919-6178
Billy Hsieh
[e-mail]
[phone]