Specifications

Thermal/Mechanical Design Guide 33
Thermal Solutions
5.1.1 25.5 mm Tall Heatsink
For the 25.5 mm tall heatsink, Table 5-2 provides guidance regarding performance
expectations. These values are not used to generate processor thermal specifications.
Notes:
1. Local ambient temperature of the air entering the heatsink.
2. Max target (mean + 3 sigma + offset) for thermal characterization parameter (Section 5.5.1).
3. Airflow through the heatsink fins with zero bypass. Max target for pressure drop (dP) measured in inches H
2
O.
4. Reference system configuration. Processor is downstream from memory in SSI blade and EEB (Entry-Level
Electronics Bay), not in TEB (Thin Electronics Bay). Ducting is utilized to direct airflow.
5. Dimensions of heatsink do not include socket or processor. The 25.5 mm heatsink height + socket/processor
height (7.729 mm, Table 4-2) complies with 33.5mm max height for SSI blade boards
(http://ssiforum.oaktree.com/
).
6. Passive heatsinks. Dow Corning TC-1996 thermal interface material.
Table 5-2. Performance Expectations for 25.5 mm Tall Heatsink
Parameter Value
Altitude, system
ambient temp
Sea level, 35
o
C
TDP 95W, Profile B
T
LA
1
50
o
C49
o
C40
o
C
Ψ
CA
2
0.287
o
C/W 0.337
o
C/W 0.275
o
C/W
Airflow
3
13.3 CFM @ 0.334” dP 10 CFM @ 0.210” dP 16 CFM @ 0.354” dP
System height
(form factor)
4
SSI blade 1U (EEB) 1U (TEB)
Heatsink
volumetric
90 x 90 x 25.5mm (1U)
5
Heatsink
technology
6
Cu base, Al fins