Intel® Xeon® Processor 5500 Series Thermal/Mechanical Design Guide March 2009 Document Number:321323-001
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Contents 1 Introduction .............................................................................................................. 9 1.1 References ....................................................................................................... 10 1.2 Definition of Terms ............................................................................................ 10 2 LGA1366 Socket ...................................................................................................... 13 2.
6 Quality and Reliability Requirements .......................................................................43 6.1 Test Conditions .................................................................................................43 6.2 Intel Reference Component Validation ..................................................................45 6.2.1 Board Functional Test Sequence ...............................................................45 6.2.2 Post-Test Pass Criteria....................................
B-7 1U Reference Heatsink Fin and Base (Sheet 1 of 2) ...................................................... 58 B-8 1U Reference Heatsink Fin and Base (Sheet 2 of 2) ...................................................... 59 B-9 Heatsink Shoulder Screw (1U, 2U and Tower) .............................................................. 60 B-10Heatsink Compression Spring (1U, 2U and Tower)........................................................ 61 B-11Heatsink Retaining Ring (1U, 2U and Tower) ..................
Tables 1-1 1-2 4-1 4-2 4-3 4-4 5-1 5-2 5-3 5-4 6-1 A-1 A-2 A-3 A-4 B-1 C-1 E-1 E-2 E-3 6 Reference Documents ...............................................................................................10 Terms and Descriptions .............................................................................................10 Socket Component Mass............................................................................................27 1366-land Package and LGA1366 Socket Stackup Height ................
Revision History Document Number Revision Number 321323 001 Description Revision Date Public Release March 2009 § Thermal/Mechanical Design Guide 7
Thermal/Mechanical Design Guide
Introduction 1 Introduction This document provides guidelines for the design of thermal and mechanical solutions for 2-socket server and 2-socket Workstation processors in the Intel® Xeon® 5500 Platform. The processors covered include those listed in the Intel® Xeon® Processor 5500 Series Datasheet, Volume 1 and the follow-on processors. The design guidelines apply to the follow-on processors in their current stage of development and are not expected to change as they mature.
Introduction 1.1 References Material and concepts available in the following documents may be beneficial when reading this document. Table 1-1. Reference Documents Document Location European Blue Angel Recycling Standards Notes 2 Intel® Xeon® Processor 5500 Series Datasheet, Volume 1 321321 1 Intel® Xeon® Processor 5500 Series Mechanical Model 321326 1 Intel® Xeon® Processor 5500 Series Thermal Model 321327 Entry-level Electronics Bay Specification 1 3 Notes: 1.
Introduction Table 1-2. Terms and Descriptions (Sheet 2 of 2) Term Description TCONTROL TCONTROL is a static value below TCC activation used as a trigger point for fan speed control. TDP Thermal Design Power: Thermal solution should be designed to dissipate this target power level. TDP is not the maximum power that the processor can dissipate. Thermal Monitor A power reduction feature designed to decrease temperature after the processor has reached its maximum operating temperature.
Introduction 12 Thermal/Mechanical Design Guide
LGA1366 Socket 2 LGA1366 Socket This chapter describes a surface mount, LGA (Land Grid Array) socket intended for processors in the Intel® Xeon® 5500 Platform. The socket provides I/O, power and ground contacts. The socket contains 1366 contacts arrayed about a cavity in the center of the socket with lead-free solder balls for surface mounting on the motherboard. The socket has 1366 contacts with 1.016 mm X 1.
LGA1366 Socket BA AW AU AR AN AL AJ AG AE AC AA W U R N L J G E C A 41 40 39 38 37 36 35 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 BA 42 AY AW 43 AV AU T V Y AB AD AF AH AK AM R U W AA AC AE AG AJ AL AN 5 B D F H K M P T V Y AB AD AF AH AK AM P 6 A N AP AT AV AY AT 7 AR 8 AP 9 10 M 11 12 L 13 14 K 15 16 J 17 18 H 19 20 G 21 22 F 23 24 E 25 26 D 27 28 C 29 30 B 31 32 4 Thermal/Mechanica
LGA1366 Socket 2.1 Board Layout The land pattern for the LGA1366 socket is 40 mils X 40 mils (X by Y), and the pad size is 18 mils. Note that there is no round-off (conversion) error between socket pitch (1.016 mm) and board pitch (40 mil) as these values are equivalent. Figure 2-3.
LGA1366 Socket 2.2 Attachment to Motherboard The socket is attached to the motherboard by 1366 solder balls. There are no additional external methods (that is, screw, extra solder, adhesive, and so on) to attach the socket. As indicated in Figure 2-4, the Independent Loading Mechanism (ILM) is not present during the attach (reflow) process. Figure 2-4. Attachment to Motherboard ILM LGA 1366 Socket 2.
LGA1366 Socket The co-planarity (profile) and true position requirements are defined in Appendix C. 2.3.3 Contacts Base material for the contacts is high strength copper alloy. For the area on socket contacts where processor lands will mate, there is a 0.381 μm [15 μinches] minimum gold plating over 1.27 μm [50 μinches] minimum nickel underplate. No contamination by solder in the contact area is allowed during solder reflow. 2.3.
LGA1366 Socket 2.4 Package Installation / Removal As indicated in Figure 2-6, access is provided to facilitate manual installation and removal of the package. To assist in package orientation and alignment with the socket: • The package Pin1 triangle and the socket Pin1 chamfer provide visual reference for proper orientation. • The package substrate has orientation notches along two opposing edges of the package, offset from the centerline.
LGA1366 Socket 2.5 Durability The socket must withstand 30 cycles of processor insertion and removal. The max chain contact resistance from Table 4-4 must be met when mated in the 1st and 30th cycles. The socket Pick and Place cover must withstand 15 cycles of insertion and removal. 2.6 Markings There are three markings on the socket: • LGA1366: Font type is Helvetica Bold - minimum 6 point (2.125 mm). • Manufacturer's insignia (font size at supplier's discretion).
LGA1366 Socket 2.9 LGA1366 Socket NCTF Solder Joints Intel has defined selected solder joints of the socket as non-critical to function (NCTF) for post environmental testing. The processor signals at NCTF locations are typically redundant ground or non-critical reserved, so the loss of the solder joint continuity at end of life conditions will not affect the overall product functionality. Figure 2-7 identifies the NCTF solder joints. . Figure 2-7.
Independent Loading Mechanism (ILM) 3 Independent Loading Mechanism (ILM) The Independent Loading Mechanism (ILM) provides the force needed to seat the 1366-LGA land package onto the socket contacts. The ILM is physically separate from the socket body. The assembly of the ILM to the board is expected to occur after wave solder. The exact assembly location is dependent on manufacturing preference and test flow.
Independent Loading Mechanism (ILM) Figure 3-1. ILM Cover Assembly Load Lever Captive Fastener (4x) Load Plate Frame 3.1.2 ILM Back Plate Design Overview The unified back plate for 2-socket server and 2-socket Workstation products consists of a flat steel back plate with threaded studs for ILM attach, and internally threaded nuts for heatsink attach.
Independent Loading Mechanism (ILM) Back Plate t -o ut Figure 3-2. Cu Threaded studs studs Threaded Clearance Clearance hole hole Threaded nuts 3.2 Assembly of ILM to a Motherboard The ILM design allows a bottoms up assembly of the components to the board. In step 1, (see Figure 3-3), the back plate is placed in a fixture. Holes in the motherboard provide alignment to the threaded studs. In step 2, the ILM cover assembly is placed over the socket and threaded studs.
Independent Loading Mechanism (ILM) . Figure 3-3. ILM Assembly Step 1: With socket body reflowed on board, and back plate in fixture, align board holes to back plate studs. 24 Step 2: With back plate against bottom of board, align ILM cover assembly to back plate studs.
Independent Loading Mechanism (ILM) As indicated in Figure 3-4, socket protrusion and ILM key features prevent 180-degree rotation of ILM cover assembly with respect to the socket. The result is a specific Pin 1 orientation with respect to the ILM lever. Figure 3-4.
Independent Loading Mechanism (ILM) 26 Thermal/Mechanical Design Guide
LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications 4 LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications This chapter describes the electrical, mechanical, and environmental specifications for the LGA1366 socket and the Independent Loading Mechanism. 4.1 Component Mass Table 4-1. Socket Component Mass Component Socket Body, Contacts and PnP Cover ILM Cover ILM Back Plate for dual processor server products 4.
LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications 4.4 Loading Specifications The socket will be tested against the conditions listed in the LGA1366 Socket Validation Reports with heatsink and the ILM attached, under the loading conditions outlined in this chapter. Table 4-3 provides load specifications for the LGA1366 socket with the ILM installed. The maximum limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition.
LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications Table 4-4. Electrical Requirements for LGA1366 Socket Parameter Value Comment <3.9nH The inductance calculated for two contacts, considering one forward conductor and one return conductor. These values must be satisfied at the worst-case height of the socket. Mated loop inductance, Loop Mated partial mutual inductance, L Maximum mutual capacitance, C.
LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications Figure 4-1.
Thermal Solutions 5 Thermal Solutions This section describes a 1U reference heatsink, design targets for 2U and Tower heatsinks, performance expectations for a 25.5 mm tall heatsink, and thermal design guidelines for Intel® Xeon® Processor 5500 Series and the follow-on processors. 5.1 Performance Targets Table 5-1 provides boundary conditions and performance targets for 1U, 2U and Tower heatsinks.
Thermal Solutions For 1U reference heatsink, see Appendix B for detailed drawings. Table 5-1 specifies ΨCA and pressure drop targets at 9.7 CFM. Figure 5-1 shows ΨCA and pressure drop for the 1U heatsink versus the airflow provided. Best-fit equations are provided to prevent errors associated with reading the graph. Figure 5-1. 1U Heatsink Performance Curves For 2U and Tower heatsink, see Appendix B for volumetric drawings. Table 5-1 specifies ΨCA and pressure drop targets at 30 CFM.
Thermal Solutions 5.1.1 25.5 mm Tall Heatsink For the 25.5 mm tall heatsink, Table 5-2 provides guidance regarding performance expectations. These values are not used to generate processor thermal specifications. Table 5-2. Performance Expectations for 25.5 mm Tall Heatsink Parameter Value Altitude, system ambient temp Sea level, 35oC TDP 95W, Profile B o TLA1 ΨCA2 50 C 49oC 40oC 0.287oC/W 0.337oC/W 0.275oC/W 3 13.3 CFM @ 0.334” dP 10 CFM @ 0.210” dP 16 CFM @ 0.
Thermal Solutions 5.2 Heat Pipe Considerations Figure 5-2 shows the orientation and position of the TTV die. The TTV die is sized and positioned similarly to the processor die. Figure 5-2. TTV Die Size and Orientation 45 Figure 1 - Side Views of Package with IHS (not to scale) Cache Cache Cache Cache Cache 42.5 13.2 Core 4 Core 3 Core Uncore 1.0 Core 2 Package CL Core 1 Die CL 19.
Thermal Solutions 5.3 Assembly Figure 5-3. 1U Reference Heatsink Assembly 1U Reference Heatsink Captive Screw Thermal Interface Material: Honeywell PCM45F IHS: Integrated Heat Spreader Threaded Nut Reference Back Plate (Unified Back Plate) The assembly process for the 1U reference heatsink begins with application of Honeywell PCM45F thermal interface material to improve conduction from the IHS. Tape and roll format is recommended. Pad size is 35 x 35mm, thickness is 0.25mm.
Thermal Solutions 5.3.1 Thermal Interface Material (TIM) TIM should be verified to be within its recommended shelf life before use. Surfaces should be free of foreign materials prior to application of TIM. Use isopropyl alcohol and a lint free cloth to remove old TIM before applying new TIM. 5.4 Structural Considerations Mass of the 1U reference heatsink and the target mass for 2U and Tower heatsinks does not exceed 500 gm.
Thermal Solutions Figure 5-4. Processor Thermal Characterization Parameter Relationships 5.5.2 Dual Thermal Profile Processors that offer dual thermal profile are specified in the appropriate Datasheet. Dual thermal profile helps mitigate limitations in volumetrically constrained form factors and allows trade-offs between heatsink cost and TCC activation risk.
Thermal Solutions Figure 5-5. Dual Thermal Profile TCASE _MAX_B TEMPERATURE TCASE _MAX_A 1U Heatsink 40C 0W 2U Heatsink POWER TDP Compliance to Profile A ensures that no measurable performance loss will occur due to TCC activation. It is expected that TCC would only be activated for very brief periods of time when running a worst-case real world application in a worst-case thermal condition.
Thermal Solutions 5.6.1 Fan Speed Control There are many ways to implement fan speed control. Using processor ambient temperature (in addition to Digital Thermal Sensor) to scale fan speed can improve acoustics when DTS > TCONTROL. Table 5-3. Fan Speed Control, TCONTROL and DTS Relationship Condition 5.6.1.1 FSC Scheme DTS ≤ TCONTROL FSC can adjust fan speed to maintain DTS ≤ TCONTROL (low acoustic region).
Thermal Solutions 5.6.2 PECI Averaging and Catastrophic Thermal Management By averaging DTS over PECI, thermal solution failure can be detected and a soft shutdown can be initiated to help prevent loss of data. Thermal data is averaged over a rolling window of 256mS by default (X=8): AVGN = AVGN-1 * (1 – 1/2X) + Temperature * 1/2X Using a smaller averaging constant could cause premature detection of failure. The Critical Temperature threshold generally triggers somewhere between PECI of -0.75 and -0.50.
Thermal Solutions compliance by ensuring that the processor Tcase value, as measured on the TTV, does not exceed Tcase_max_B at the anomalous power level for the environmental condition of interest. This anomalous power level is equal to 75% of the TDP limit. 5.7.
Thermal Solutions 42 Thermal/Mechanical Design Guide
Quality and Reliability Requirements 6 Quality and Reliability Requirements 6.1 Test Conditions The Test Conditions provided in Table 6-1 address processor heatsink failure mechanisms only. Test Conditions, Qualification and Visual Criteria vary by customer; Table 6-1 applies to Intel requirements. Socket Test Conditions are provided in the LGA1366 Socket Validation Reports available from socket suppliers listed in Appendix A. Table 6-1.
Quality and Reliability Requirements Table 6-1. Heatsink Test Conditions and Qualification Criteria (Sheet 2 of 2) Assessment 8) Thermal Performance Test Condition Qualification Criteria Min Sample Size Using 1U heatsink and 1U airflow from Table 5-1: 1) TTV @ 95W (Profile B), Note 1. Using 2U heatsink and 2U airflow from Table 5-1: 2) TTV @ 95W (Profile A), Note 1. 3) TTV @ 80W. 4) TTV @ 60W. Using Tower heatsink and Tower airflow from Table 5-1: 5) TTV @ 130W, Note 1. 6) TTV @ 95W (Profile A).
Quality and Reliability Requirements Figure 6-1. Example Thermal Cycle - Actual profile will vary 6.2 Intel Reference Component Validation Intel tests reference components both individually and as an assembly on mechanical test boards, and assesses performance to the envelopes specified in previous sections by varying boundary conditions.
Quality and Reliability Requirements 2. Heatsink remains seated and its bottom remains mated flat against the IHS surface. No visible gap between the heatsink base and processor IHS. No visible tilt of the heatsink with respect to the retention hardware. 3. No signs of physical damage on baseboard surface due to impact of heatsink. 4. No visible physical damage to the processor package. 5. Successful BIOS/Processor/memory test. 6.
Component Suppliers A Component Suppliers Various suppliers have developed support components for processors in the Intel® Xeon® 5500 Platform. These suppliers and components are listed as a convenience to customers. Intel does not guarantee quality, reliability, functionality or compatibility of these components. The supplier list and/or the components may be subject to change without notice.
Component Suppliers Table A-2.
Component Suppliers Table A-3. Assembly Assembly, Heatsink, Intel® Xeon® Processor 5500 Series, 2U Assembly, Heatsink, Intel® Xeon® Processor 5500 Series, Tower A.1.
Component Suppliers 50 Thermal/Mechanical Design Guide
Mechanical Drawings B Mechanical Drawings Table B-1.
A B C D 8 7 6 5 8 BALL 1 POSITION 4 LINE REPRESENTS OF OUTERMOST ROWS AND COLUMNS OF SOCKET BALL ARRAY OUTLINE. FOR REFERENCE ONLY SOCKET BODY OUTLINE FOR REFERENCE ONLY 7 6 AS VIEWED FROM PRIMARY SIDE OF THE MOTHERBOARD 36.00 [1.417] SOCKET ILM HOLE PATTERN 41.66 [1.640] CENTERLINE OF OUTER SOCKET BALL ARRAY 47.50 [1.870] SOCKET BODY OUTLINE, FOR REFERENCE ONLY 80.00 [3.150] THERMAL RETENTION HOLE PATTERN 90.00 [3.543] MAX THERMAL RETENTION OUTLINE 5 44.70 [1.
A B C D 8 7 6 8 5.00 [0.197 ] 85.00 [3.346 ] 3X 80.00 [3.150 ] 77.90 [3.067 ] 2X 72.50 [2.854 ] 2X 70.600 [2.7795 ] 62.39 [2.456 ] BALL 1 4 49.40 [1.945 ] 30.600 [1.205 ] 29.90 [1.177 ] 9.900 [0.3898 ] 2X 9.400 [0.3701 ] 2X 7.50 [0.295 ] 2X 0.00 [0.000 ] 3.30 [0.130 ] 7 67.70 [2.665 ] 58.000 [2.2835 ] 47.15 [1.856 ] 32.85 [1.293 ] 22.000 [0.8661 ] 19.17 [0.755 ] BALL 1 4 9.60 [0.378 ] 12.30 [0.484 ] 6 AS VIEWED FROM PRIMARY SIDE OF THE MOTHERBOARD (DETAILS) 2X 72.50 [2.
A B C D 8 7 6 5 8 (90.00 ) [3.543] 8X 7 6.00 [0.236 ] (72.20 ) [2.843] DESKTOP BACKPLATE KEEPIN SHOWN FOR REFERENCE ONLY 70.50 [2.776 ] 6 9.50 [0.374 ] 47.15 [1.856 ] 5 AS VIEWED FROM SECONDARY SIDE OF THE MOTHERBOARD (DETAILS) (90.00 ) [3.543] (47.00 ) [1.850] 32.85 [1.293 ] 85.00 [3.346 ] 54 4 4 0.00 [0.000 ] 85.00 [3.346 ] 75.00 [2.953 ] 62.83 [2.474 ] 49.40 [1.945 ] 30.60 [1.205 ] 17.17 [0.676 ] 5.00 [0.197 ] 0.00 [0.000 ] 5.00 [0.
Thermal/Mechanical Design Guide 7 6 5 8 7 6 5 4 DEPARTMENT R DATE ADDED ISO VIEW OF SECONDARY SIDE MOVED ISO VEWS TO SHEET 4 MODIFIED BACKSIDE HEIGHT RESTRICTIONS FOR NEW BACKPLATE GEOMETRY ADDED NOTE 5 DETAILING HEIGHT RESTRICTION NOMENCLATURE REMOVED TOLERANCE BLOCK VALUES, SEE NOTE 5 UPDATED ZONE 1 KEEPOUT ON SHEETS 1 & 2 TO ALLOW MORE SOCKET LEVER ARM ACCESS, LEFT SIDE OF ZONE PRODUCTION RELEASE ZONE 6 HEIGHT FROM 1.8MM --> 1.
Mechanical Drawings Figure B-5.
Mechanical Drawings Figure B-6.
Mechanical Drawings Figure B-7.
Mechanical Drawings Figure B-8.
A B C D 8 7 6 5 8 [ 5 DETAIL C SCALE 40.000 7 DETAIL A SCALE 40.000 DETAIL B SCALE 40.000 0.35 [0.014 ] ] 0.5 X 45 ALL AROUND +0.05 0 +0.001 0.025 -0.000 0.64 R0.20 [0.008 ] C B 6 SEE DETAIL A CRITICAL INTERFACE FEATURE: THIS SHOULDER MUST BE SQUARE SEE DETAIL SEE DETAIL 4X 0.72 MIN. [0.028 ] A A 6 TYPE 1, CROSS RECESSED #2 DRIVER 6 5 6 18.50 [0.728 ] 13.50 0.13 [0.532 0.005 ] 11.00 0.13 [0.433 0.005 ] 0.00 [0.000 ] 3.50 [0.138 ] 2X 4.06 0.17 [0.160 0.
Mechanical Drawings Figure B-10.
Mechanical Drawings Figure B-11.
Mechanical Drawings Figure B-12.
Mechanical Drawings Figure B-13.
Mechanical Drawings Figure B-14.
Mechanical Drawings Figure B-15.
Mechanical Drawings Figure B-16.
Mechanical Drawings Figure B-17.
Mechanical Drawings Figure B-18.
Mechanical Drawings Figure B-19.
Mechanical Drawings Figure B-20.
A B C D 8 7 6 5 8 5 7 6 2 5 THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION. 4 4 1 PART NUMBER 3 THIRD ANGLE PROJECTION UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5-1994 DIMENSIONS ARE IN MILLIMETERS TOLERANCES: .X # 0.5 Angles # 1.0 $ .XX # 0.25 .XXX # 0.
Thermal/Mechanical Design Guide A B C D 8 7 6 5 8 7 6 SEE NOTE 9 27.5 #0.5 [1.08 #0.01 ] 27.5 #0.5 [1.08 #0.01 ] 35.0 #1.0 [1.38 #0.03 ] 4 5 PROTECTIVE LINER NOT SHOWN. INSTALL PER MANUFACTURER'S RECOMMENDATION. SEE PARTS LIST, SHEET 1, ITEM 2 4 THERMAL INTERFACE APPLICATION THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION.
A B C D 8 7 6 5 8 7 6 5 5 THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION. 2 4 4 PART NUMBER 3 THIRD ANGLE PROJECTION UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5-1994 DIMENSIONS ARE IN MILLIMETERS TOLERANCES: .X # 0.5 Angles # 1.0 $ .XX # 0.25 .XXX # 0.
Thermal/Mechanical Design Guide A B C D 8 7 6 5 8 7 6 SEE NOTE 9 27.5 #0.5 [1.08 #0.01 ] 27.5 #0.5 [1.08 #0.01 ] 35.0 #1.0 [1.38 #0.03 ] 4 5 PROTECTIVE LINER NOT SHOWN. INSTALL PER MANUFACTURER'S RECOMMENDATION. SEE PARTS LIST, SHEET 1, ITEM 2. 4 THERMAL INTERFACE APPLICATION THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION.
A B C D 8 7 6 5 8 7 6 5 5 THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONT ENTS MAY NOT BE DISCLOSED, REPRODUCED, DI SPLAYED OR MODIFIED, WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION. 4 4 2 PART NUMBER 3 THIRD ANGLE PROJECTION UNLESS OTHERWISE SPECIFIED INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5-1994 DIMENSIONS ARE IN MILLIMETERS TOLERANCES: .X # 0.5 Angles # 1.0 $ .XX # 0.25 .XXX # 0.
Thermal/Mechanical Design Guide A B C D 8 7 6 5 8 7 6 SEE NOTE 9 27.5 #0.5 [1.08 #0.01 ] 5 PROTECTIVE LINER NOT SHOWN. INSTALL PER MANUFACTURER'S RECOMMENDATION. SEE PARTS LIST, SHEET 1, ITEM 2. THERMAL INTERFACE APPLICATION 27.5 #0.5 [1.08 #0.01 ] 35.0 #1.0 [1.38 #0.03 ] THIS DRAWING CONTAINS INTEL CORPORAT ION CONFIDENTIAL INFORMATION.
Mechanical Drawings 78 Thermal/Mechanical Design Guide
Socket Mechanical Drawings C Socket Mechanical Drawings Table C-1 lists the mechanical drawings included in this appendix. Table C-1.
Socket Mechanical Drawings Figure C-1.
Socket Mechanical Drawings Figure C-2.
Socket Mechanical Drawings Figure C-3.
Socket Mechanical Drawings Figure C-4.
Socket Mechanical Drawings 84 Thermal/Mechanical Design Guide
Heatsink Load Metrology D Heatsink Load Metrology To ensure compliance to max socket loading value listed in Table 4-3, and to meet the performance targets for Thermal Interface Material in Section 5.3, the Heatsink Static Compressive Load can be assessed using the items listed below: • HP34970A DAQ • Omegadyne load cell, 100 lbf max (LCKD-100) • Test board (0.
Heatsink Load Metrology Figure D-1.
Embedded Thermal Solutions E Embedded Thermal Solutions This section describes the LV processors and Embedded reference heatsinks for NEBS (Network Equipment Building Systems) compliant ATCA (Advanced Telecommunications Computing Architecture) systems. These LV processors are good for any form factor that needs to meet NEBS requirements. E.1 Performance Targets Table E-1 provides boundary conditions and performance targets for 1U and ATCA heatsinks.
Embedded Thermal Solutions Detailed drawings for the ATCA reference heatsink can be found in Section E.3. Table E-1 above specifies ΨCA and pressure drop targets and Figure E-1 below shows ΨCA and pressure drop for the ATCA heatsink versus the airflow provided. Best-fit equations are provided to prevent errors associated with reading the graph. ATCA Heatsink Performance Curves 2.5 2 ΔP = 1.3e-04CFM2 +1.1e-02CFM 2 1.6 1.2 1 0.8 0.5 0.4 Ψca, C/W 1.5 Mean Ψca = 0.337 + 1.625 CFM -0.
Embedded Thermal Solutions Figure E-2. NEBS Thermal Profile \ Thermal Profile 90 Short-term Thermal Profile may only be used for short term excursions to higher ambient temperatures, not to exceed 360 hours per year Tcase [C] 80 70 Short-Term Thermal Profile Tc = 0.302 * P + 66.9 Nominal Thermal Profile Tc = 0.302* P + 51.9 60 50 40 0 5 10 15 20 25 30 35 40 45 50 55 60 Power [W] Notes: 1.) The thermal specifications shown in this graph are for reference only.
Embedded Thermal Solutions Figure E-3. UP ATCA Thermal Solution Notes: Thermal sample only, retention not production ready. Figure E-4. UP ATCA System Layout Notes: Heat sink should be optimized for the layout.
Embedded Thermal Solutions § Figure E-5.
Embedded Thermal Solutions E.3 Mechanical Drawings and Supplier Information See Appendix B for retention and keep out drawings. The part number below represent Intel reference designs for a DP ATCA heatsink. Customer implementation of these components may be unique and require validation by the customer. Customers can obtain these components directly from the supplier below. Table E-2.
Embedded Thermal Solutions § Figure E-6.
Embedded Thermal Solutions § Figure E-7.
Embedded Thermal Solutions § Figure E-8.
Embedded Thermal Solutions § Figure E-9.
Processor Installation Tool F Processor Installation Tool The following optional tool is designed to provide mechanical assistance during processor installation and removal. Contact the supplier for availability: Billy Hsieh billy.hsieh@tycoelectronics.
Processor Installation Tool Figure F-1.
