Product guide

High-performance blade server optimized for virtualization
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14.
Interior View
BladeCenter HS22V Specifications
Machine type 7871- Axx, Dxx, Gxx, Hxx, Nxx
Form factor
30mm blade
Two-core Xeon
(E55xx)
2.00GHz E5503 (D3x)
Processor type
Six-core Xeon
(L56xx/X56xx)
2.26GHz L5640 (N2x),
2.66GHz X5650 (H2x,
HAx), 2.93GHz X5670
(H4x)
Four-core Xeon
(E56xx)
2.40GHz E5620 (G2x),
2.66GHz E5640 (G4x,
GDx), 3.06GHz X5667
(H5x)
Four-core Xeon
(E55xx)
2.26GHz E5507 (A4x)
Processor power draw
95W (H2x/H4x/H5x/HAx)
80W (A4x, D3x,
G2x/G4x/GDx)
60W (N2x)
Internal L3 cache
12MB shared cache (G2x/G4x/GDx,
H2x/H4x/H5x/HAx, N2x)
4MB shared cache (A4x, D3x)
QuickPath Interconnect (QPI) speed
(gigatransfers per second)
6.4 GTps
(H2x/H4x/H5x/HAx)
5.86 GTps (G2x/G4x/GDx,
N2x)
4.8 GTps (A4x, D3x)
Maximum memory access speed
1333MHz
(H2x/H4x/H5x/Hax, N2x)
1066MHz (G2x/G4x/GDx) 800MHz (A4x, D3x)
# of processors standard /
maximum
1 / 2
NEBS/ETSI Compliance
Select blades are NEBS3/ETSI-compliant. (Contact IBM sales for details.)
Chipset
Intel 5520
Standard / maximum memory
9
6GB (3 x 2GB) / 144GB (N2x,
G2x/G4x/GDx, H2x/4x/H5x/HAx)
3GB (3 x 1GB) / 144GB (A4x, D3x)
9
Maximum memory capacity may require the replacement of standard components with the largest supported component available.
Status / cKVM
Panel
9 VLP DIMM
Sockets
9 VLP DIMM
Sockets
Low-Profile Hot-
Swap Blade
Handles
Processor /
Heat Sink
Processor /
Heat Sink
1.8-inch
SSDs
Internal USB
(Embedded
Hypervisor)
2 I/O slots
(1 CIOv, 1
CFFh)
Redundant
Midplane
Connections
Light Path
Diagnostics
Panel
Dual 1GbE LOM
(10GbE Option)