Product guide

Versatile, easy-to-use blade optimized for performance, power and cooling
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14.
Interior View
BladeCenter HS22 Specifications
Machine type 7870- Axx, Dxx, Gxx, Hxx, Nxx
Form factor
30mm blade
Two-core Xeon
(E55xx)
2.00GHz E5503 (D3x)
Processor type
Six-core Xeon
(L56xx, X56xx)
2.26GHz L5640 (N2x),
2.66GHz X5650 (H2x/HAx),
2.93GHz X5670 (H4x)
Four-core Xeon
(E56xx/X56xx)
2.40GHz E5620 (G2x),
2.66GHz E5640 (G4x),
3.06GHz X5667 (H5x)
Four-core Xeon
(E55xx)
2.26GHz E5507 (A4x)
Processor power draw
95W (H2x/H4x/H5x/HAx)
80W (A4x, D3x,
G2x/G4x/GCx)
60W (N2x)
Internal cache
12MB shared cache (G2x/G4x/GCx,
H2x/H4x/H5x/HAx, N2x)
4MB shared cache (A4x, D3x)
QuickPath Interconnect (QPI) speed
(gigatransfers per second)
6.4 Gbps
(H2x/H4x/H5x/HAx)
5.86 Gbps (G2x/G4x/GCx,
N2x)
4.8 Gbps (A4x, D3x)
Maximum memory access speed
1333MHz
(H2x/H4x/H5x/HAx, N2x)
1066MHz (G2x/G4x/GCx) 800MHz (A4x, D3x)
# of processors standard /
maximum
1 / 2
NEBS/ETSI Compliance
Select blades are NEBS3/ETSI-compliant. (Contact IBM sales for details.)
Chipset
Intel 5520
Standard / maximum memory
7
6GB (3 x 2GB) / 96GB (G2x/G4x/GCx,
H2x/H4x/H5x/HAx, N2x)
3GB (3 x 1GB) /96GB (A4x, D3x)
Standard memory type
Registered
DDR-3 ECC (operating at 1333MHz, 1066MHz or 800MHz, depending on
7
Maximum memory and disk capacity may require the replacement of standard components with the largest supported component available.
Processor/
Heat Sink
12 DIMM Sockets
Redundant
Midplane
Connectors
SFF SAS/SATA
HDD
I/O Adapt
er
Slots
Low
-
Profile
Hot-Swap
Blade Handle
USB Flash Drive
(Hidden)
Light Path
Diagnostics
Panel
Processor/
Heat Sink