User Manual

Intel
®
Xeon
®
Processor 5600 Series Datasheet Volume 1 3
Contents
1Introduction............................................................................................................11
1.1 Processor Features............................................................................................12
1.2 Platform Features..............................................................................................12
1.3 Terminology .....................................................................................................13
1.4 References .......................................................................................................15
2 Electrical Specifications...........................................................................................17
2.1 Processor Signaling ...........................................................................................17
2.1.1 Intel® QuickPath Interconnect ...............................................................17
2.1.2 DDR3 Signal Groups..............................................................................17
2.1.3 Platform Environmental Control Interface (PECI).......................................17
2.1.4 Processor Sideband Signals....................................................................18
2.1.5 System Reference Clock ........................................................................18
2.1.6 Test Access Port (TAP) Signals................................................................19
2.1.7 Power / Other Signals............................................................................20
2.1.8 Reserved or Unused Signals................................................................... 27
2.2 Signal Group Summary......................................................................................28
2.3 Mixing Processors..............................................................................................29
2.4 Flexible Motherboard Guidelines (FMB).................................................................30
2.5 Absolute Maximum and Minimum Ratings .............................................................31
2.6 Processor DC Specifications ................................................................................32
2.6.1 VCC Overshoot Specifications.................................................................35
2.6.2 Die Voltage Validation ...........................................................................36
2.7 Intel® QuickPath Interconnect Specifications........................................................47
2.8 AC Specifications...............................................................................................49
2.9 Processor AC Timing Waveforms ......................................................................... 56
3 Signal Quality Specifications....................................................................................67
3.1 Overshoot/Undershoot Tolerance.........................................................................67
4 Package Mechanical Specifications ..........................................................................69
4.1 Package Mechanical Specifications.......................................................................69
4.1.1 Package Mechanical Drawing..................................................................70
4.1.2 Processor Component Keep-Out Zones ....................................................73
4.1.3 Package Loading Specifications...............................................................73
4.1.4 Package Handling Guidelines..................................................................73
4.1.5 Package Insertion Specifications .............................................................73
4.1.6 Processor Mass Specification ..................................................................74
4.1.7 Processor Materials...............................................................................74
4.1.8 Processor Markings...............................................................................74
5Land Listing.............................................................................................................75
5.1 Listing by Land Name ........................................................................................75
5.2 Listing by Land Number .....................................................................................92
6 Signal Definitions .................................................................................................. 111
6.1 Signal Definitions ............................................................................................ 111
7 Thermal Specifications .......................................................................................... 115
7.1 Package Thermal Specifications......................................................................... 115
7.1.1 Thermal Specifications......................................................................... 115
7.1.2 Thermal Metrology.............................................................................. 130
7.2 Processor Thermal Features.............................................................................. 130
7.2.1 Processor Temperature........................................................................ 130
7.2.2 Adaptive Thermal Monitor.................................................................... 131