User Manual

Intel
®
Xeon
®
Processor 5600 Series Datasheet Volume 1 121
Thermal Specifications
Notes:
1. Thermal Profile A (refer to Table 7-7) is representative of a volumetrically unconstrained platform. Thermal
Profile B (refer to Table 7-8) is representative of a volumetrically constrained platform.
2. Implementation of Thermal Profile A should result in virtually no TCC activation. Utilization of thermal
solutions that do not meet Thermal Profile A will result in increased probability of TCC activation and may
incur measurable performance loss.
3. Refer to the Intel® Xeon® Processor 5500/5600 Series Thermal/Mechanical Design Guidelines for system
and environmental implementation details.
Figure 7-4. Advanced Server/Workstation Platform Thermal Profile A and B (4 Core)
40
45
50
55
60
65
70
75
80
85
90
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95
Power [W]
Temperature [C]
Thermal Profile B
Y = 0.272 * x + 57.1
Thermal Profile A
Y = 0.195 * x + 57.1
TCASE_MAX is a thermal solution design point.
In actuality, units will not significantly exceed
TCASE_MAX_A due to TCC activation.
40
45
50
55
60
65
70
75
80
85
90
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95
Power [W]
Temperature [C]
Thermal Profile B
Y = 0.272 * x + 57.1
Thermal Profile A
Y = 0.195 * x + 57.1
TCASE_MAX is a thermal solution design point.
In actuality, units will not significantly exceed
TCASE_MAX_A due to TCC activation.
Table 7-7. Advanced Server/Workstation Thermal Profile A (4 Core)
Power (W) Maximum T
CASE
(C)
0 57.1
10 59.1
20 61.0
30 63.0
40 64.9
50 66.9
60 68.8
70 70.8
80 72.7
90 74.7
95 75.7