Quad-Core Intel® Xeon® Processor 5400 Series Thermal/Mechanical Design Guidelines November 2007 Reference Number: 318611 Revision: 001
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Contents 1 Introduction .............................................................................................................. 9 1.1 Objective ........................................................................................................... 9 1.2 Scope ................................................................................................................ 9 1.3 References ......................................................................................................... 9 1.
D Safety Requirements................................................................................................89 E Quality and Reliability Requirements .......................................................................91 E.1 Intel Verification Criteria for the Reference Designs ................................................91 E.1.1 Reference Heatsink Thermal Verification ....................................................91 E.1.2 Environmental Reliability Testing ..........................
B-5 B-6 B-7 B-8 B-9 B-10 B-11 B-12 B-13 B-14 B-15 B-16 B-17 B-18 B-19 B-20 B-21 B-22 B-23 B-24 C-1 C-2 C-3 CEK Spring (Sheet 1 of 3) .................................................................................. 62 CEK Spring (Sheet 2 of 3) .................................................................................. 63 CEK Spring (Sheet 3 of 3) ..................................................................................
Tables 1-1 1-2 2-1 2-2 Reference Documents.......................................................................................... 9 Terms and Descriptions ......................................................................................10 Processor Mechanical Parameters Table ................................................................13 Input and Output Conditions for the Quad-Core Intel® Xeon® Processor 5400 Series Thermal Management Features ..................................................
Revision History Reference Number Revision Number 318611 001 Description Initial release of the document.
Quad-Core Intel® Xeon® Processor 5400 Series TMDG
Introduction 1 Introduction 1.1 Objective The purpose of this guide is to describe the reference thermal solution and design parameters required for the Quad-Core Intel® Xeon® Processor 5400 Series. It is also the intent of this document to comprehend and demonstrate the processor cooling solution features and requirements.
Introduction Table 1-1. Reference Documents (Sheet 2 of 2) Document Clovertown_Harpertown_Wolfdale-DP Processor Enabled Components CEK Thermal Models (in Flotherm* and Icepak*) Available electronically Clovertown_Harpertown_Wolfdale-DP Processor Package Thermal Models (in Flotherm and Icepak) Available electronically RS - Wolfdale Processor Family BIOS Writers Guide (BWG) See Note following table.
Introduction Table 1-2. Terms and Descriptions (Sheet 2 of 2) TCONTROL A processor unique value for use in fan speed control mechanisms. TCONTROL is a temperature specification based on a temperature reading from the processor’s Digital Thermal Sensor. TCONTROL can be described as a trigger point for fan speed control implementation. TCONTROL = -TOFFSET.
Introduction 12 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
Thermal/Mechanical Reference Design 2 Thermal/Mechanical Reference Design This chapter describes the thermal/mechanical reference design for Quad-Core Intel® Xeon® Processor 5400 Series. Both Quad-Core Intel® Xeon® Processor X5400 Series and Quad-Core Intel® Xeon® Processor E5400 Series are targeted for the full range of form factors (2U, 2U+ and 1U).
Thermal/Mechanical Reference Design 2.1.2 Quad-Core Intel® Xeon® Processor 5400 Series Package The Quad-Core Intel® Xeon® Processor 5400 Series is packaged using the flip-chip land grid array (FC-LGA) package technology. Please refer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet for detailed mechanical specifications.
Thermal/Mechanical Reference Design Figure 2-1. Note: Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (1 of 3) Guidelines on potential IHS flatness variation with socket load plate actuation and installation of the cooling solution are available in the processor Thermal/Mechanical Design Guidelines.
Thermal/Mechanical Reference Design Figure 2-2.
Thermal/Mechanical Reference Design Figure 2-3. Note: Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (3 of 3) The optional dimple packing marking highlighted by Detail F from the above drawing may only be found on initial processors.
Thermal/Mechanical Reference Design The package includes an integrated heat spreader (IHS). The IHS transfers the nonuniform heat from the die to the top of the IHS, out of which the heat flux is more uniform and spreads over a larger surface area (not the entire IHS area). This allows more efficient heat transfer out of the package to an attached cooling device. The IHS is designed to be the interface for contacting a heatsink.
Thermal/Mechanical Reference Design A potential mechanical solution for heavy heatsinks is the direct attachment of the heatsink to the chassis pan. In this case, the strength of the chassis pan can be utilized rather than solely relying on the baseboard strength. In addition to the general guidelines given above, contact with the baseboard surfaces should be minimized during installation in order to avoid any damage to the baseboard.
Thermal/Mechanical Reference Design processor operating frequency (via the bus multiplier) and input voltage (via the VID signals). Please refer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet for further details on TM and TM2. PROCHOT# is designed to assert at or a few degrees higher than maximum TCASE (as specified by the thermal profile) when dissipating TDP power, and can not be interpreted as an indication of processor case temperature.
Thermal/Mechanical Reference Design smaller foot print and decreased sensitivity to noise. These DTS benefits will result in more accurate fan speed control and TCC activation.The DTS application in fan speed control will be discussed in more detail in Section 2.4.1. 2.2.3 Platform Environmental Control Interface (PECI) The PECI interface is designed specifically to convey system management information from the processor (initially, only thermal data from the Digital Thermal Sensor).
Thermal/Mechanical Reference Design 2.2.4.2 Thermal Monitor for Multiple Core Products The thermal management for multiple core products has only one TCONTROL value per processor. The TCONTROL for processor 0 and TCONTROL for processor 1 are independent from each other. If the DTS temperature from any domain within the processor is greater than or equal to TCONTROL, the processor case temperature must remain at or below the temperature as specified by the thermal profile. See Section 2.2.
Thermal/Mechanical Reference Design Figure 2-6. Processor Core Geometric Center Locations Core4 Core3 Y4 Core2 Y3 Core1 Y2 Y1 X1, X2, X3, X4 Y X Table 2-3. Processor Core Geometric Center Dimensions Feature X Dimension Y Dimension Core 1 18.15 mm 6.15 mm Core 2 18.15 mm 10.35 mm Core 3 18.15 mm 18.85 mm Core 4 18.15 mm 23.
Thermal/Mechanical Reference Design 2.2.5 Thermal Profile The thermal profile is a line that defines the relationship between a processor’s case temperature and its power consumption as shown in Figure 2-7. The equation of the thermal profile is defined as: Equation 2-1.y = ax + b Where: y x a b Figure 2-7.
Thermal/Mechanical Reference Design above, the case-to-ambient resistance represents the slope of the line and the processor local ambient temperature represents the y-axis intercept. Hence the TCASE_MAX value of a specific solution can be calculated at TDP. Once this point is determined, the line can be extended to Power (P) = 0W representing the Thermal Profile of the specific solution.
Thermal/Mechanical Reference Design Figure 2-9 depicts the interaction between the Thermal Profile and TCONTROL. Figure 2-9. TCONTROL and Thermal Profile Interaction If the DTS temperature is less than TCONTROL, then the case temperature is permitted to exceed the Thermal Profile, but the DTS temperature must remain at or below TCONTROL.
Thermal/Mechanical Reference Design Figure 2-10. Dual Thermal Profile Diagram T case_max_B T case_max_A Thermal Profile B Thermal Profile A Power TDP The Thermal Profile A is based on Intel’s 2U+ air cooling solution. Designing to Thermal Profile A ensures that no measurable performance loss due to Thermal Control Circuit (TCC) activation is observed in the processor.
Thermal/Mechanical Reference Design Refer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet or Section 2.2.8 for the Thermal Profile A and Thermal Profile B specifications. Section 2.5 of this document also provides details on the 2U+ and 1U Intel reference thermal solutions that are designed to meet the Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profile A and Thermal Profile B respectively. 2.2.7.
Thermal/Mechanical Reference Design Figure 2-11. Thermal Profile for the Quad-Core Intel® Xeon® Processor X5400 Series Notes: 1. The The thermal specifications shown in this graph are for Quad-Core Intel® Xeon® Processor X5400 Series except the Quad-Core Intel® Xeon® Processor X5482 sku. 2. Refer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet for the Thermal Profile specifications. In case of conflict, the data information in the datasheet supersedes any data in this figure.
Thermal/Mechanical Reference Design Figure 2-12. Thermal Profile for Quad-Core Intel® Xeon® Processor E5400 Series Note: 30 The thermal specifications shown in this graph are for reference only. Refer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet for the Thermal Profile specifications. In case of conflict, the data information in the datasheet supersedes any data in this figure.
Thermal/Mechanical Reference Design Figure 2-13. Thermal Profile for Quad-Core Intel® Xeon® Processor X5482 Series Thermal Profile (2U) 75 70 65 Tcase [C] 60 55 50 Thermal Profile Y = 0.187*x + 35 45 40 35 0 10 20 30 40 50 60 70 80 Pow e r [W] 90 100 110 120 130 140 150 Table 2-4 and Table 2-5 describe the thermal performance target for the Quad-Core Intel® Xeon® Processor 5400 Series cooling solution enabled by Intel. Table 2-4.
Thermal/Mechanical Reference Design Table 2-5. Intel Reference Heatsink Performance Targets for the Quad-Core Intel® Xeon® Processor E5400 Series Parameter Maximum Unit Notes Altitude Sea-Level m Heatsink designed at 0 meters TLA 40 °C TDP 80 W 1U CEK TCASE_MAX 67 °C Airflow 15 25.5 CFM m3 / hr Pressure Drop 0.331 82.4 Inches of H2O Pa ψCA 0.246 °C/W Airflow through the heatsink fins Mean + 3σ 1U Alternative Heatsink TCASE_MAX 67 °C Airflow 15 25.
Thermal/Mechanical Reference Design 2.4 Characterizing Cooling Solution Performance Requirements 2.4.1 Fan Speed Control Fan speed control (FSC) techniques to reduce system level acoustic noise are a common practice in server designs. The fan speed is one of the parameters that determine the amount of airflow provided to the thermal solution. Additionally, airflow is proportional to a thermal solution’s performance, which consequently determines the TCASE of the processor at a given power level.
Thermal/Mechanical Reference Design Table 2-6. Fan Speed Control, TCONTROL and DTS Relationship Condition FSC Scheme DTS ≤ TCONTROL FSC can adjust fan speed to maintain DTS ≤ TCONTROL (low acoustic region). DTS >TCONTROL FSC should adjust fan speed to keep TCASE at or below the Thermal Profile specification (increased acoustic region).
Thermal/Mechanical Reference Design The case-to-local ambient thermal characterization parameter of the processor, ΨCA, is comprised of ΨCS, the TIM thermal characterization parameter, and of ΨSA, the sink-tolocal ambient thermal characterization parameter: Equation 2-4.ΨCA = ΨCS + ΨSA Where: ΨCS ΨSA = = Thermal characterization parameter of the TIM (°C/W). Thermal characterization parameter from heatsink-to-local ambient (°C/W).
Thermal/Mechanical Reference Design Assume the datasheet TDP is 85 W and the case temperature specification is 68 °C. Assume as well that the system airflow has been designed such that the local processor ambient temperature is 45°C. Then the following could be calculated using equation (2-3) from above: Equation 2-5.ΨCA = (TCASE – TLA) / TDP = (68 – 45) / 85 = 0.
Thermal/Mechanical Reference Design To develop a reliable, cost-effective thermal solution, thermal characterization and simulation should be carried out at the entire system level, accounting for the thermal requirements of each component. In addition, acoustic noise constraints may limit the size, number, placement, and types of fans that can be used in a particular design. 2.5 Thermal/Mechanical Reference Design Considerations 2.5.1 Heatsink Solutions 2.5.1.
Thermal/Mechanical Reference Design 2.5.2 Thermal Interface Material TIM application between the processor IHS and the heatsink base is generally required to improve thermal conduction from the IHS to the heatsink. Many thermal interface materials can be pre-applied to the heatsink base prior to shipment from the heatsink supplier and allow direct heatsink attach, without the need for a separate TIM dispense or attach process in the final assembly factory.
Thermal/Mechanical Reference Design 2.5.4 Assembly Overview of the Intel Reference Thermal Mechanical Design The reference design heatsinks that meet the Quad-Core Intel® Xeon® Processor 5400 Series thermal performance targets are called the Common Enabling Kit (CEK) heatsinks, and are available in 1U, 2U, & 2U+ form factors. Each CEK consists of the following components: • Heatsink (with captive standoff and screws) • Thermal Interface Material (TIM) • CEK Spring 2.5.4.
Thermal/Mechanical Reference Design The CEK reference thermal solution is designed to extend air-cooling capability through the use of larger heatsinks with minimal airflow blockage and bypass. CEK retention solution can allow the use of much heavier heatsink masses compared to the legacy limits by using a load path directly attached to the chassis pan. The CEK spring on the secondary side of the baseboard provides the necessary compressive load for the thermal interface material.
Thermal/Mechanical Reference Design CEK, are now commonly using direct chassis attach (DCA) as the mechanical retention design. The mass of the new thermal solutions is large enough to require consideration for structural support and stiffening on the chassis. 2.5.5 Thermal Solution Performance Characteristics Figure 2-17 and Figure 2-18 show the performance of the 2U+ and 1U passive heatsinks, respectively.
Thermal/Mechanical Reference Design Figure 2-18. 1U CEK Heatsink Thermal Performance 2.5.6 Thermal Profile Adherence The 2U+ CEK Intel reference thermal solution is designed to meet the Thermal Profile A for the Quad-Core Intel® Xeon® Processor 5400 Series. From Table 2-4, the threesigma (mean+3sigma) performance of the thermal solution is computed to be 0.187 °C/W and the processor local ambient temperature (TLA) for this thermal solution is 40 °C.
Thermal/Mechanical Reference Design Figure 2-19. 2U+CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profile A 65 TCASE_MAX_B @TDP Temperature ( C) 60 Thermal Profile A Y = 0.168 * X + 42.8 55 50 2U CEK Reference Solution Y = 0.
Thermal/Mechanical Reference Design Figure 2-20. 1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profile B TCASE_MAX_B @ TDP 70 65 Temperature ( C) 60 Thermal Profile B Y = 0.221 * X + 43.5 1U CEK Reference Solution Y = 0.
Thermal/Mechanical Reference Design Figure 2-21. 1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile TCASE_MAX @ TDP 65 60 Thermal Profile Y = 0.298 * X + 43.2 Tcase ( C ) 55 50 1U CEK Reference Solution Y = 0.246 * X + 40 45 40 35 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 Note: Intel has also developed an 1U alternative reference heatsink design.
Thermal/Mechanical Reference Design Figure 2-22. Isometric View of the 2U+ CEK Heatsink Note: Refer to Appendix B for more detailed mechanical drawings of the heatsink. . Figure 2-23. Isometric View of the 1U CEK Heatsink Note: Refer to Appendix B for more detailed mechanical drawings of the heatsink. The function of the standoffs is to provide a bridge between the chassis and the heatsink for attaching and load carrying.
Thermal/Mechanical Reference Design Although the CEK heatsink fits into the legacy volumetric keep-in, it has a larger footprint due to the elimination of retention mechanism and clips used in the older enabled thermal/mechanical components. This allows the heatsink to grow its base and fin dimensions, further improving the thermal performance. A drawback of this enlarged size and use of copper for both the base and fins is the increased weight of the heatsink.
Thermal/Mechanical Reference Design 2.5.7.3 CEK Spring The CEK spring, which is attached on the secondary side of the baseboard, is made from 0.80 mm [0.0315 in.] thick 301 stainless steel half hard. Any future versions of the spring will be made from a similar material. The CEK spring has four embosses which, when assembled, rest on the top of the chassis standoffs. The CEK spring is located between the chassis standoffs and the heatsink standoffs.
Thermal/Mechanical Reference Design 2.5.8 Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5400 Series Thermal Profile Intel will provide a 2U passive and a 1U passive/active heatsink solution for boxed Quad-Core Intel® Xeon® Processor 5400 Series. This active heatsink solution is primarily designed to be used in a pedestal chassis where sufficient air inlet space is present and side directional airflow is not an issue.
Thermal/Mechanical Reference Design Clearance is required around the heatsink to ensure unimpeded airflow for proper cooling. The physical baseboard keepout requirements for the active solution are the same as the passive CEK solution shown in Appendix B. Refer to Figure B-18 through Figure B-20 for additional details on the active CEK thermal solution volumetrics. 2.5.8.1 Fan Power Supply The active heatsink includes a fan, which requires a +12 V power supply.
Thermal/Mechanical Reference Design Table 2-10. Fan Cable Connector Pin Out (Active CEK) Pin Number 1 2.5.8.2 Signal Color Ground (Constant) Black 2 Power (+12V) Yellow 3 Signal: 2 pulses per revolution Green 4 Control 21KHz - 28KHz Blue Systems Considerations Associated with the Active CEK This heatsink was designed to help pedestal chassis users to meet the processor thermal requirements without the use of chassis ducting.
Thermal/Mechanical Reference Design The other items listed in Figure 2-16 that are required to complete this solution will be shipped with either the chassis or boards.
1U Alternative Heatsink Thermal/Mechanical Design A 1U Alternative Heatsink Thermal/Mechanical Design Intel has also developed an 1U alternative reference heatsink design for the volumetrically constrained form factor and targeted for the rack-optimized and ultra dense SKUs. This alternative heatsink design meets the thermal profile specifications of the Quad-Core Intel® Xeon® Processor E5400 Series and offers the advantages of weight reduction and cost savings in using this alternative 1U heatsink.
1U Alternative Heatsink Thermal/Mechanical Design A.2 Thermal Solution Performance Characterics Figure A-2 shows the performance of the 1U alternative heatsink. This figure shows the thermal performance and the pressure drop through fins of the heatsink versus the airflow provided. The best-fit equations for these curves are also provided to make it easier for users to determine the desired value without any error associated with reading the graph. Figure A-2.
1U Alternative Heatsink Thermal/Mechanical Design x = Processor power value (W) Figure A-3 below shows the comparison of this reference thermal solution’s Thermal Profile to the Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile specification. The 1U alternative solution meets the Thermal Profile with 0.5°C margin at the upper end (TDP). By designing to Thermal Profile, it is ensured that no measurable performance loss due to TCC activation is observed under the given environmental conditions.
1U Alternative Heatsink Thermal/Mechanical Design 56 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
Mechanical Drawings B Mechanical Drawings The mechanical drawings included in this appendix refer to the thermal mechanical enabling components for the Quad-Core Intel® Xeon® Processor 5400 Series. Note: Intel reserves the right to make changes and modifications to the design as necessary. Table B-1.
Mechanical Drawings Figure B-1.
Mechanical Drawings Figure B-2.
Mechanical Drawings Figure B-3.
Mechanical Drawings Figure B-4.
Mechanical Drawings Figure B-5.
Mechanical Drawings Figure B-6.
Mechanical Drawings Figure B-7.
Mechanical Drawings Figure B-8.
Mechanical Drawings Figure B-9.
Mechanical Drawings Figure B-10.
Mechanical Drawings Figure B-11.
Mechanical Drawings Figure B-12.
Mechanical Drawings Figure B-13.
Mechanical Drawings Figure B-14.
Mechanical Drawings Figure B-15.
Mechanical Drawings Figure B-16.
Mechanical Drawings Figure B-17.
Mechanical Drawings Figure B-18.
Mechanical Drawings Figure B-19.
Mechanical Drawings Figure B-20.
Mechanical Drawings Figure B-21.
Mechanical Drawings Figure B-22.
Mechanical Drawings Figure B-23.
Mechanical Drawings Figure B-24.
Mechanical Drawings § 82 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
Heatsink Clip Load Methodology C Heatsink Clip Load Methodology C.1 Overview This section describes a procedure for measuring the load applied by the heatsink/clip/ fastener assembly on a processor package. This procedure is recommended to verify the preload is within the design target range for a design, and in different situations. For example: • Heatsink preload for the LGA771 socket. • Quantify preload degradation under bake conditions.
Heatsink Clip Load Methodology Alternate Heatsink Sample Preparation As just mentioned, making sure that the load cells have minimum protrusion out of the heatsink base is paramount to meaningful results. An alternate method to make sure that the test setup will measure loads representative of the non-modified design is: • Machine the pocket in the heatsink base to a depth such that the tips of the load cells are just flush with the heatsink base. • Then machine back the heatsink base by around 0.25 mm [0.
Heatsink Clip Load Methodology Figure C-2. Load Cell Installation in Machined Heatsink Base Pocket - Side View Height of pocket ~ height of selected load cell Figure C-3.
Heatsink Clip Load Methodology C.2.2 Typical Test Equipment For the heatsink clip load measurement, use equivalent test equipment to the one listed Table C-1. Table C-1. Typical Test Equipment Item Description Part Number (Model) Load cell Notes: 1, 5 Honeywell*-Sensotec* Model 13 subminiature load cells, compression only Select a load range depending on load level being tested. www.sensotec.
Heatsink Clip Load Methodology (often on the order of 3 minutes). The time zero reading should be taken at the end of this settling time. 5. Record the preload measurement (total from all three load cells) at the target time and average the values over 10 seconds around this target time as well, i.e. in the interval for example over [target time – 5 seconds; target time + 5 seconds]. C.2.
Heatsink Clip Load Methodology 88 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
Safety Requirements D Safety Requirements Heatsink and attachment assemblies shall be consistent with the manufacture of units that meet the safety standards: 1. UL Recognition-approved for flammability at the system level. All mechanical and thermal enabling components must be a minimum UL94V-2 approved. 2. CSA Certification. All mechanical and thermal enabling components must have CSA certification. 3. Heatsink fins must meet the test requirements of UL1439 for sharp edges.
Safety Requirements 90 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
Quality and Reliability Requirements E Quality and Reliability Requirements E.1 Intel Verification Criteria for the Reference Designs E.1.1 Reference Heatsink Thermal Verification The Intel reference heatsinks will be verified within specific boundary conditions using a TTV and the methodology described in the Intel® Xeon® Dual- and Multi- Processor Family Thermal Test Vehicle User's Guide.
Quality and Reliability Requirements Table E-1. Use Conditions Environment Use Environment Shipping and Handling Speculative Stress Condition Mechanical Shock • System-level • Unpackaged • Trapezoidal • 25 g • velocity change is based on packaged weight Product Weight (lbs) < 20 lbs 20 to > 40 40 to > 80 80 to < 100 100 to < 120 ≥120 Example Use Condition Example 7-Yr Stress Equiv. Example 10Yr Stress Equiv.
Quality and Reliability Requirements 3. No signs of physical damage on baseboard surface due to impact of heatsink. 4. No visible physical damage to the processor package. 5. Successful BIOS/Processor/memory test of post-test samples. 6. Thermal compliance testing to demonstrate that the case temperature specification can be met. E.1.2.
Quality and Reliability Requirements 94 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
Enabled Suppliers Information F Enabled Suppliers Information F.1 Supplier Information F.1.1 Intel Enabled Suppliers The Intel reference enabling solution for Quad-Core Intel® Xeon® Processor 5400 Series is preliminary. The Intel reference solutions have not been verified to meet the criteria outlined in Appendix E. Customers can purchase the Intel reference thermal solution components from the suppliers listed in Table F-1.
Enabled Suppliers Information Table F-1. Suppliers for the Quad-Core Intel® Xeon® Processor 5400 Series Intel Reference Solution (Sheet 2 of 2) Assembly CEK771-01-1U (for 1U) Component CEK Heatsink Description Copper Fin, Copper Base Intel p/n C90546 rev02 Development Suppliers Fujikura CNDA# 1242012 (stacked fin) Supplier Contact Info Fujikura America Ash Ooe a_ooe@fujikura.com 408-748-6991 Fujikura Taiwan Branch Yao-Hsien Huang yeohsien@fujikuratw.com.
Enabled Suppliers Information Table F-2. Assembly 2U Heatsink Additional Suppliers for the Quad-Core Intel® Xeon® Processor 5400 Series Intel Reference Solution (Sheet 1 of 2) Component Alternative CEK Heatsink Description Copper Fin, Copper Base Development Suppliers Aavid Thermalloy CNDA#2525071 Supplier Contact Info David Huang huang@aavid.com 603-223-1724 Frank Hsue frank.hsu@aavid.com.tw 886-2-26989888 x306 Copper Fin, Copper Base - and - ADDA Corporation CNDA#AP1249 Jungpin Chen jungpin@adda.
Enabled Suppliers Information Table F-2. Assembly 1U Heatsink Additional Suppliers for the Quad-Core Intel® Xeon® Processor 5400 Series Intel Reference Solution (Sheet 2 of 2) Component Alternative CEK Heatsink Description Copper Fin, Copper Base Development Suppliers Aavid Thermalloy CNDA#2525071 Supplier Contact Info David Huang huang@aavid.com 603-223-1724 Frank Hsue frank.hsu@aavid.com.tw 886-2-26989888 x306 Copper Fin, Copper Base ADDA CNDA# AP1249 Jungpin Chen jungpin@adda.com.
Enabled Suppliers Information § Quad-Core Intel® Xeon® Processor 5400 Series TMDG 99
Enabled Suppliers Information 100 Quad-Core Intel® Xeon® Processor 5400 Series TMDG
