Product guide

A cost-optimized storage-rich alternative to traditional enterprise 2U dual-socket servers
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15
IBM System x3630 M3 Specifications
Machine type 7377-22x, 32x, 42x, 52x, 62x/64x, 72x, A2x, B2x, C2x, D2x, F2x, G2x
Form factor 2U
4-Core Xeon (E55xx)
2.13GHz E5506 (22x),
2.26GHz E5507 (32x)
Processor types (standard or via CTO)
6-Core Xeon
(E56xx/L56xx/X56xx)
2.26GHz L5640 (CTO),
2.4GHz E5645 (D2x),
2.53GHz E5649 (F2x),
2.66GHz X5650
(62x/64x),
2.8GHz X5660 (CTO),,
2.93GHz X5670 (72x);
3.06GHz X5675 (G2x)
4-Core Xeon
(E56xx/L56xx/56xx)
1.6GHz E5603 (A2x),
1.86GHz L5609 (CTO),
2.13GHz E5606 (CTO),
2.13GHz L5630 (CTO),
2.26GHz E5607 (B2x),
2.4GHz E5620 (C2x),
2.53GHz E5630 (42x),
2.66GHz E5640 (52x),
3.2GHz X5672 (CTO)
2-Core Xeon (E55xx)
2.0GHz E5503 (CTO),
Maximum processor power draw
95W—62x/64x,
72x, G2x, plus
X5660/X5672 via
CTO
80W—all other
models, plus
E5503, E5606/
E5630 via CTO
60W—L5640 via
CTO
40W
L5609/L5630 via
CTO
QuickPath Interconnect (QPI) speed
(gigatransfers per second)
6.4GTps
(62x/64x, 72x, G2x, plus
X5660/X5672 via CTO)
5.86GTps
(42x, 52x, C2x, D2x, F2x,
plus L5630/L5640 via
CTO)
4.8GTps
(22x, 32x, A2x, B2x, plus
E5503/E5606, L5609 via
CTO)
# of processors standard / maximum 1 / 2
Hyper Threading Technology supported
Yes (2 threads per core) — 42x, 52x,
62x/64x, 72x, C2x, D2x, F2x, G2x, plus
L5630/L5640 via CTO
No — 22x, 32x, A2x, B2x, E5503, plus
E5606, L5609 via CTO
Turbo Boost Technology supported
Yes — 42x, 52x, 62x, 72x, C2x, D2x,
F2x, G2x, plus L5630/L5640 via CTO
No — 22x, 32x, A2x, B2x, plus E5503,
E5606, L5609 via CTO
Internal L3 cache
12MB (1 shared 12MB
cache)—42x, 52x, 62x/
64x, 72x, C2x, D2x, F2x,
G2x, plus E5620, L5630,
L5640 via CTO
8MB (1 shared 8MB
cache)—B2x, plus E5606
via CTO
4MB (1 shared 4MB
cache)—22x, 32x, plus
E5503, E5603 via CTO
Chipset Intel 5520
BIOS type Unified Extensible Firmware Interface (UEFI)
Standard memory
7
(96GB maximum)
12GB (3 x 4GB) — 62x, 72x
4GB (1 x 4GB) 22x, 32x, 42x, 52x,
64x, A2x, B2x, C2x, D2x, F2x G2x
# of DIMM sockets total / available
12 / 9 — 62x, 72x
12 / 11 — 22x, 32x, 42x, 52x
Memory voltage standard 1.5V (22x, 32x, 42x, 52x, 62x, 72x, CTO)
1.35V (64x, A2x, B2x, C2x, D2x, F2x,
G2x, CTO)
Memory type standard
Registered PC3-10600 (DDR III ECC
(Chipkill protection standard)—Dual-
rank x4 (22x, 32x, 42x, 52x, 62x, 72x,
CTO)
Registered PC3-10600 (DDR III ECC
(Chipkill protection optional)—Single-
rank x4 (64x, A2x, B2x, C2x, D2x, F2x,
G2x, CTO)
Maximum memory access speed
1333MHz (62x/64X, 72x,
G2x, plus X5660 via CTO)
1066MHz (42x, 52x, C2x,
D2x, F2x, plus
L5609/L5630/L5640 via
CTO)
800MHz (22x, 32x, plus
X5503 via CTO)
Memory interleaving Yes (two-way using pairs of DIMMs)
DIMM types / capacities supported
PC3-10600
1333MHz RDIMM
1GB single-rank x8, 1.5V;
PC3L-10600
8
1333MHz RDIMM
2GB dual-rank x8 1.35V;
PC3L-8500R
1066MHz RDIMM
8GB dual-rank x4 1.35V