Datasheet

DESCRIPTION
HyperX HX313C9FK2/8 is a kit of two 512M x 64-bit (4GB)
DDR3-1333 CL9 SDRAM (Synchronous DRAM) 1Rx8 memory
modules, based on eight 512M x 8-bit DDR3 FBGA components
per module. Total kit capacity is 8GB. Each module kit has
been tested to run at DDR3-1333 at latency timing 9-9-9 at
1.5V. The JEDEC standard electrical and mechanical specifica-
tions are as follows:
Document No. 4806995-001.B00 04/23/15 Page 1
SPECIFICATIONS
selcyc 9)DDI(LC
Row Cycle Time (tRCmin) 49.125ns (min.)
Refresh to Active/Refresh 260ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin) 36ns (min.)
Maximum Operating Power TBD W* (per module)
0 - V 49gnitaR LU
Operating Temperature 0
o
C to 85
o
C
Storage Temperature -55
o
C to +100
o
C
*Power will vary depending on the SDRAM used.
FEATURES
• JEDEC standard 1.5V (1.425V ~1.575V) Power Supply
• VDDQ = 1.5V (1.425V ~ 1.575V)
• 667MHz fCK for 1333Mb/sec/pin
• 8 independent internal bank
• Programmable CAS Latency: 9, 8, 7, 6
• Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
• 8-bit pre-fetch
• Burst Length: 8 (Interleave without any limit, sequential with
starting address “000” only), 4 with tCCD = 4 which does not
allow seamless read or write [either on the fly using A12 or
MRS]
• Bi-directional Differential Data Strobe
• Internal(self) calibration : Internal self calibration through ZQ
pin (RZQ : 240 ohm ± 1%)
• On Die Termination using ODT pin
• Average Refresh Period 7.8us at lower than TCASE 85°C,
3.9us at 85°C < TCASE
< 95°C
• Asynchronous Reset
•
Height 1.291” (32.80mm) w/heatsink, single sided
component
HX313C9FK2/8
8GB (4GB 512M x 64-Bit x 2 pcs.)
DDR3-1333 CL9 240-Pin DIMM Kit
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