Datasheet
Table Of Contents
- Description
- Features
- Ordering Information
- Key Parameters
- Speed Grade
- Address Table
- Pin Descriptions
- Input/Output Functional Descriptions
- Pin Assignments
- Registering Clock Driver Specifications
- On DIMM Thermal Sensor
- Functional Block Diagram
- 4GB, 512Mx72 Module(1Rank of x8)
- 8GB, 1Gx72 Module(1Rank of x4) - page1
- 8GB, 1Gx72 Module(1Rank of x4) - page2
- 8GB, 1Gx72 Module(2Rank of x8) - page1
- 8GB, 1Gx72(2Rank of x8) - page2
- 16GB, 2Gx72 Module(2Rank of x4) - page1
- 16GB, 2Gx72 Module(2Rank of x4) - page2
- 16GB, 2Gx72 Module(2Rank of x4) - page3
- 32GB, 4Gx72 Module(4Rank of x4) - page1
- 32GB, 4Gx72 Module(4Rank of x4) - page2
- 32GB, 4Gx72 Module(4Rank of x4) - page3
- 32GB, 4Gx72 Module(4Rank of x4) - page4
- 32GB, 4Gx72 Module(4Rank of x4) - page5
- Absolute Maximum Ratings
- AC & DC Operating Conditions
- AC & DC Input Measurement Levels
- Vref Tolerances
- AC and DC Logic Input Levels for Differential Signals
- Differential signal definition
- Differential swing requirements for clock (CK - CK) and strobe (DQS-DQS)
- note : Rising input differential signal shall become equal to or greater than VIHdiff(ac) level and Falling input differential signal shall become equal to or less than VIL(ac) level.
- Single-ended requirements for differential signals
- Differential Input Cross Point Voltage
- Slew Rate Definitions for Single-Ended Input Signals
- Slew Rate Definitions for Differential Input Signals
- AC & DC Output Measurement Levels
- Overshoot and Undershoot Specifications
- Refresh parameters by device density
- Standard Speed Bins
- Environmental Parameters
- IDD and IDDQ Specification Parameters and Test Conditions
- IDD Specifications (Tcase: 0 to 95oC)
- Module Dimensions
Rev. 1.0 / May. 2014 3
Description
Registered DDR3 SDRAM DIMMs (Registered Double Data Rate Synchronous DRAM Dual In-Line Memory
Modules) are low power, high-speed operation memory modules that use DDR3 SDRAM devices. These
Registered SDRAM DIMMs are intended for use as main memory when installed in systems such as servers
and workstations.
Features
• Power Supply: VDD=1.5V (1.425V to 1.575V)
• VDDQ = 1.5V (1.425V to 1.575V)
• VDDSPD=3.0V to 3.6V
• 8 internal banks
• Data transfer rates: PC3-14900, PC3-12800, PC3-10600, PC3-8500
• Bi-Directional Differential Data Strobe
• 8 bit pre-fetch
• Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
• Supports ECC error correction and detection
• On-Die Termination (ODT)
• Temperature sensor with integrated SPD
• This product is in compliance with the RoHS directive.
Ordering Information
* In order to uninstall FDHS, please contact sales administrator
Part Number Density Organization Component Composition
# of
ranks
FDHS
HMT451R7BFR8C-H9/PB/RD 4GB 512Mx72 512Mx8(H5TQ4G83BFR)*9 1 X
HMT41GR7BFR8C-H9/PB/RD 8GB 1Gx72 512Mx8(H5TQ4G83BFR)*18 2 X
HMT41GR7BFR4C-H9/PB/RD 8GB 1Gx72 1Gx4(H5TQ4G43BFR)*18 1 X
HMT42GR7BFR4C-H9/PB/RD 16GB 2Gx72 1Gx4(H5TQ4G43BFR)*36 2 O
HMT84GR7BMR4C-G7/H9/PB/RD 32GB 4Gx72 DDP 2Gx4(H5TQ8G43BMR)*36 4 O