Datasheet
Table Of Contents
- Description
- Features
- Ordering Information
- Key Parameters
- Speed Grade
- Address Table
- Pin Descriptions
- Input/Output Functional Descriptions
- Pin Assignments
- Registering Clock Driver Specifications
- On DIMM Thermal Sensor
- Functional Block Diagram
- 4GB, 512Mx72 Module(1Rank of x8)
- 8GB, 1Gx72 Module(1Rank of x4) - page1
- 8GB, 1Gx72 Module(1Rank of x4) - page2
- 8GB, 1Gx72 Module(2Rank of x8) - page1
- 8GB, 1Gx72(2Rank of x8) - page2
- 16GB, 2Gx72 Module(2Rank of x4) - page1
- 16GB, 2Gx72 Module(2Rank of x4) - page2
- 16GB, 2Gx72 Module(2Rank of x4) - page3
- 32GB, 4Gx72 Module(4Rank of x4) - page1
- 32GB, 4Gx72 Module(4Rank of x4) - page2
- 32GB, 4Gx72 Module(4Rank of x4) - page3
- 32GB, 4Gx72 Module(4Rank of x4) - page4
- 32GB, 4Gx72 Module(4Rank of x4) - page5
- Absolute Maximum Ratings
- AC & DC Operating Conditions
- AC & DC Input Measurement Levels
- Vref Tolerances
- AC and DC Logic Input Levels for Differential Signals
- Differential signal definition
- Differential swing requirements for clock (CK - CK) and strobe (DQS-DQS)
- note : Rising input differential signal shall become equal to or greater than VIHdiff(ac) level and Falling input differential signal shall become equal to or less than VIL(ac) level.
- Single-ended requirements for differential signals
- Differential Input Cross Point Voltage
- Slew Rate Definitions for Single-Ended Input Signals
- Slew Rate Definitions for Differential Input Signals
- AC & DC Output Measurement Levels
- Overshoot and Undershoot Specifications
- Refresh parameters by device density
- Standard Speed Bins
- Environmental Parameters
- IDD and IDDQ Specification Parameters and Test Conditions
- IDD Specifications (Tcase: 0 to 95oC)
- Module Dimensions

Rev. 1.0 / May. 2014 24
32GB, 4Gx72 Module(4Rank of x4) - page5
CK1
CK1
120
Ω
±5%
S2
S3
BA[N:0]
A[N:0]
RAS
CAS
WE
CKE0
CK0
CK0
PAR_IN
BRS2A
→
CS1: SDRAMs D45,D47,D49,D51,D53
BRS2B
→
CS1: SDRAMs D37,D39,D41,D43,
BRS3A
→
CS0: SDRAMs D44.D46,D48,D50,D52,
BRRASB
→
RAS: SDRAMs D[43:36],D[61:54]
BRS3B
→
CS0: SDRAMs D36,D38,D40,D42,
BRBA[N:0]B
→
BA[N:0]: SDRAMs D[43:36],D[61:54]
BRBA[N:0]A
→
BA[N:0]: SDRAMs D[53:44],D[71:62]
BRRASA
→
RAS: SDRAMs D[53:44],D[71:62]
BRCASB
→
CAS: SDRAMs D[43:36],D[61:54]
BRCASA
→
CAS: SDRAMs D[53:44],D[71:62]
BRWEB
→
WE: SDRAMs D[43:36],D[61:54]
BRWEA
→
WE: SDRAMs D[53:44],D[71:62]
BRCKE0B
→
CKE1: SDRAMs D37,D39,D41,D43,
BRCKE0A
→
CKE1: SDRAMs D45,D47,D49,D51,D53,
BRODT1B
→
ODT0: SDRAMs D37,D39,D41,D43
BRODT1A
→
ODT1: SDRAMs D45,D47,D49,D51,D53
BPCK0B
→
CK: SDRAMs D[43:36]
BPCK0A
→
CK: SDRAMs D[53:44]
BPCK0B
→
CK: SDRAMs D[43:36]
BPCK0A
→
CK: SDRAMs D[53:44]
Err_Out
RESET RST
1:2
R
E
G
I
S
T
E
R
/
P
BRCKE1B
→
CKE0: SDRAMs D36,D38,D40,D42,
BRCKE1A
→
CKE0: SDRAMs D44.D46,D48,D50,D52,
ODT1
CKE1
BRA[N:0]B
→
A[N:0]: SDRAMs D[43:36],D[61:54]
BRA[N:0]A
→
A[N:0]: SDRAMs D[55:44],D[71:62]
BPCK1B
→
CK: SDRAMs D[61:54]
BPCK1A
→
CK: SDRAMs D[71:62]
BPCK1B
→
CK: SDRAMs D[61:54]
BPCK1A
→
CK: SDRAMs D[71:62]
L
L
B
D63,D65,D67,D69,D71
D55,D57,D59,D61
D62,D64,D66,D68,D70
D54,D56,D58,D60
D63,D65,D67,D69,D71
D55,D57,D59,D61
D62,D64,D66,D68,D70
D54,D56,D58,D60
D63,D65,D67,D69,D71
D55,D57,D59,D61
120
Ω
±5%
S0
S1
BA[N:0]
A[N:0]
RAS
CAS
WE
CKE0
CK0
CK0
PAR_IN
ARS0A
→
CS1: SDRAMs D1,D3,D5,D7 D9,
ARS0B
→
CS1: SDRAMs D11, D13, D15, D17,
ARS1A
→
CS0: SDRAMs D0, D2, D4, D6, D8,
ARRASB
→
RAS: SDRAMs D[17:10],D[35:28]
ARS1B
→
CS0: SDRAMs D10, D12, D14, D16,
ARBA[N:0]B
→
BA[N:0]: SDRAMs D[17:10],D[35:28]
ARBA[N:0]A
→
BA[N:0]: SDRAMs D[9:0],D[27:18]
ARRASA
→
RAS: SDRAMs D[9:0],D[27:18]
ARCASB
→
CAS: SDRAMs D[17:10],D[35:28]
ARCASA
→
CAS: SDRAMs D[9:0],D[27:18]
ARWEB
→
WE: SDRAMs D[17:10],D[35:28]
ARWEA
→
WE: SDRAMs D[9:0],D[27:18]
ARCKE0B
→
CKE1: SDRAMs D11,D13,D15,D17,
ARCKE0A
→
CKE1: SDRAMs D1,D3,D5,D7,D9,
ARODT0B
→
ODT0: SDRAMs D11,D13,D15,D17,
ARODT0A
→
ODT1: SDRAMs D1,D3,D5,D7,D9,
APCK0B
→
CK: SDRAMs D[17:10]
APCK0A
→
CK: SDRAMs D[9:0]
APCK0B
→
CK: SDRAMs D[17:10]
APCK0A
→
CK: SDRAMs D[9:0]
Err_Out
RESET RST
RST: SDRAMs D[35:0]
1:2
R
E
G
I
S
T
E
R
/
P
ARCKE1B
→
CKE0: SDRAMs D10,D12,D14,D16,
ARCKE1A
→
CKE0: SDRAMs D0,D2,D4,D6,D8,
ODT0
CKE1
ARA[N:0]B
→
A[N:0]: SDRAMs D[17:10],D[35:28]
ARA[N:0]A
→
A[N:0]: SDRAMs D[9:0],D[27:18]
APCK1B
→
CK: SDRAMs D[35:28]
APCK1A
→
CK: SDRAMs D[27:18]
APCK1B
→
CK: SDRAMs D[35:28]
APCK1A
→
CK: SDRAMs D[27:18]
L
L
A
D19, D21, D23, D25, D27
D29, D31, D33, D35
D18, D20, D22, D24, D26
D28, D30, D32, D34
D19, D21, D23, D25, D27
D29, D31, D33, D35
D18, D20, D22, D24, D26
D28, D30, D32, D34
D19, D21, D23, D25, D27
D29, D31, D33, D35
120
Ω
±5%
1. CK0 and CK0 are differentially terminated with a single
120 Ohms ±5% resistor.
2.
CK1 and CK1 are differentially terminated with a single
120 Ohms ±5% resistor, but is not used.
3. Unused register inputs ODT1 for Register A and ODT0 for Register B are tied to ground.
4. The module drawing on this page is not drawn to scale.