Datasheet
Table Of Contents
- Description
- Fetures
- Ordering Information
- Key Parameters
- Speed Grade
- Address Table
- Pin Descriptions
- Input/Output Functional Descriptions
- Pin Assignments
- Functional Block Diagram
- Absolute Maximum Ratings
- AC & DC Operating Conditions
- AC & DC Input Measurement Levels
- Vref Tolerances
- AC and DC Logic Input Levels for Differential Signals
- AC & DC Output Measurement Levels
- Overshoot and Undershoot Specifications
- Refresh parameters by device density
- Standard Speed Bins
- IDD and IDDQ Specification Parameters and Test Conditions
- IDD Specifications (Tcase: 0 to 95oC)
- Module Dimensions

Rev. 1.0/Sep. 2012 29
Standard Speed Bins
DDR3 SDRAM Standard Speed Bins include tCK, tRCD, tRP, tRAS and tRC for each corresponding bin.
DDR3-800 Speed Bins
For specific Notes See "Speed Bin Table Notes" on page 33.
Speed Bin DDR3-800E
Unit Notes
CL - nRCD - nRP 6-6-6
Parameter
Symbol min max
Internal read command to first data
t
AA
15 20 ns
ACT to internal read or write delay time
t
RCD
15 — ns
PRE command period
t
RP
15 — ns
ACT to ACT or REF command period
t
RC
52.5 — ns
ACT to PRE command period
t
RAS
37.5 9 * tREFI ns
CL = 5 CWL = 5
t
CK(AVG)
3.0 3.3 ns
1, 2, 3, 4, 10
CL = 6 CWL = 5
t
CK(AVG)
2.5 3.3 ns
1, 2, 3
Supported CL Settings
5, 6
n
CK
10
Supported CWL Settings
5
n
CK