Datasheet
Table Of Contents
- Description
- Fetures
- Ordering Information
- Key Parameters
- Speed Grade
- Address Table
- Pin Descriptions
- Input/Output Functional Descriptions
- Pin Assignments
- Functional Block Diagram
- Absolute Maximum Ratings
- AC & DC Operating Conditions
- AC & DC Input Measurement Levels
- Vref Tolerances
- AC and DC Logic Input Levels for Differential Signals
- AC & DC Output Measurement Levels
- Overshoot and Undershoot Specifications
- Refresh parameters by device density
- Standard Speed Bins
- IDD and IDDQ Specification Parameters and Test Conditions
- IDD Specifications (Tcase: 0 to 95oC)
- Module Dimensions

Symbol Parameter
DDR3-800, 1066, 1333, 1600
Unit Notes
Min Max
V
IX
(CK)
Differential Input Cross Point Voltage
rela
tive to VDD/2 for CK, CK
-150 150 mV 2
-175 175 mV 1
V
IX
(DQS)
Differential Input Cross Point Voltage
r
elative to VDD/2 for DQS,
DQS
-150 150 mV 2
Rev. 1.0/Sep. 2012 20
Notes:
1. Extended range for V
IX
is only allowed for clock and if single-ended clock input signals CK and CK are
monotonic with a single-ended swing VSEL / VSEH of at least VDD/2 +/-250 mV, and when the differential
slew rate of CK - CK
is larger than 3 V/ns.
Refer to the table "Single-ended levels for CK, DQS, DQSL, DQSU, CK, DQS, DQSL or DQSU" on page 19
for VSEL and VSEH standard values.
2. The relation between Vix Min/Max and VSEL/VSEH should satisfy following.
(VDD/2) + Vix (Min) - VSEL ≥ 25mV
VSEH - ((VDD/2) + Vix(Max)) ≥ 25mV
Slew Rate Definitions for Single-Ended Input Signals
See 7.5 “Address / Command Setup, Hold and Derating” in “DDR3 Device Operation” for single-ended slew
rate definitions for address and command signals.
See 7.6 “Data Setup, Hold and Slew Rate Derating” in “DDR3 Device Operation” for single-ended slew rate
definition for data signals.
Cross point voltage for differential input signals (CK, DQS)