Data Sheet

K255B-SR
FN-LINK TECHNOLOGY LIMITED Proprietary & Confidential Information
1
CONTENTS
1 Overview....................................................................................................................................2
1.1 Introduction......................................................................................................................... 2
1.2 Features.............................................................................................................................. 2
1.3 General Specification........................................................................................................ 3
1.4 Recommended Operating Rating....................................................................................3
※1.5 EEPROM Information
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3
2 Wi-Fi RF Specification........................................................................................................... 4
2.1 2.4GHz RF Specification.................................................................................................. 4
2.2 5GHz RF Specification......................................................................................................5
3 Bluetooth Specification.........................................................................................................7
3.1 Bluetooth Specification..................................................................................................... 7
4 Pin Assignments..................................................................................................................... 8
4.1 Pin Outline...........................................................................................................................8
4.2 Pin Definition.......................................................................................................................8
5 Dimensions.............................................................................................................................11
5.1 Module Picture..................................................................................................................11
5.2 Marking Description.........................................................................................................11
5.3 Module Physical Dimensions.........................................................................................12
5.4 Layout Recommendation............................................................................................... 13
6 Host Interface Timing Diagram......................................................................................... 14
6.1 system power on sequence........................................................................................... 14
6.2 SDIO Pin Description...................................................................................................... 15
6.3 SDIO Default Mode Timing Diagram............................................................................ 15
6.4 SDIO High Speed Mode Timing Diagram....................................................................16
6.5 SDIO Bus Timing Specifications in SDR Modes.........................................................17
6.6 SDIO Bus Timing Specifications in DDR50 Mode......................................................19
7 Reference Design................................................................................................................. 21
8 Ordering Information........................................................................................................... 21
9 The Key Material List........................................................................................................... 22
10 Recommended Reflow Profile.........................................................................................23
11 Package Information.......................................................................................................... 24
11.1 Reel..................................................................................................................................24
11.2 Carrier Tape Detail.........................................................................................................24
11.3 Packaging Detail............................................................................................................ 25
11.4 Moisture sensitivity........................................................................................................ 25