Laptop User Manual
Table Of Contents
- Product description
- External component identification
- Illustrated parts catalog
- Removal and replacement procedures
- Preliminary replacement requirements
- Component replacement procedures
- Service tag
- Computer feet
- Battery
- SIM
- Bluetooth module
- Expansion memory module
- WLAN module
- Primary hard drive
- WWAN module
- Optical drive
- Switch cover and keyboard
- LED board
- RTC battery
- Secondary hard drive
- Primary memory module
- Display assembly
- Top cover
- Speaker
- System board
- ExpressCard assembly
- Modem module
- Fan
- Heat sink
- Computer Setup
- Specifications
- Computer specifications
- 12.1-inch, WXGA display specifications
- Hard drive specifications
- DVD-ROM Drive specifications
- DVD±RW and CD-RW SuperMulti Double-Layer Combo Drive specifications
- System DMA specifications
- System interrupt specifications
- System I/O address specifications
- System memory map specifications
- Screw listing
- Backup and recovery
- Connector pin assignments
- Power cord set requirements
- Recycling
- Index
3. Remove the heat sink (2).
NOTE: The thermal material must be thoroughly cleaned from the surfaces of the heat sink and
system board each time the heat sink is removed. Thermal paste and pads are located on the heat
sink (1) and on system board components (2). Replacement thermal material is included with all
heat sink and system board spare part kits. Replacement thermal material is included with all heat
sink and system board spare part kits.
Reverse this procedure to install the heat sink.
Component replacement procedures 93