HP WBEM TC Document Number: P00110 Date: 08/01/06 Version: 1.0.0 HP Memory Profile © Copyright 2008 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty.
Contents Foreword ....................................................................................................................................................... 5 Introduction.................................................................................................................................................... 6 1 Scope ....................................................................................................................................................
Figures Figure 1 – Memory Profile: Class Diagram ................................................................................................... 9 Figure 2 – Memory Profile: Hierarchy Diagram........................................................................................... 10 Figure 3 – HP Memory Profile: Object diagram with two memory modules ............................................... 12 Version 1.0.
Tables Table 1 – Related Profiles ............................................................................................................................. 9 Table 2 – Operations: HP_Memory ........................................................................................................... 11 Table 3 – CIM Elements – HP Memory Profile ........................................................................................... 13 Table 4 – Class: HP_Memory ..........................................
Foreword The HP Memory Profile P00110 was prepared by the HP WBEM TC. Version 1.0.
Introduction The information in this specification should be sufficient for a provider or consumer of this data to identify unambiguously the classes, properties, methods, and values that shall be instantiated and manipulated to represent logical Memory in HP systems (support for physical memory information is optional). The target audience for this specification is implementers who are writing CIM based providers or consumers of management interfaces representing the component described in this document.
1 Scope The HP Memory profile extends the management capability of referencing profiles by adding the capability to represent the logical Memory in HP specific ways. 2 Normative References The following referenced documents are indispensable for the application of this document. For dated references, only the edition cited applies. For undated references, the latest edition of the referenced document (including any amendments) applies. 2.
3.4 mandatory used to indicate requirements strictly to be followed in order to conform to the document and from which no deviation is permitted 3.5 may used to indicate a course of action permissible within the limits of the document 3.6 need not used to indicate a course of action permissible within the limits of the document 3.7 optional used to indicate a course of action permissible within the limits of the document 3.
Central Class: HP_Memory Scoping Class: Same as parent profile Extends: DMTF DSP1026, System Memory Profile 1.0.0 The HP Memory profile extends DMTF DSP1026 to add Memory characteristics that are specific to HP systems. Table 1 – Related Profiles Profile Name Organization P00100 – HP Profile Registration Profile HP WBEM TC 1.0.0 Mandatory DSP1026 – System Memory Profile DMTF 1.0.0 Mandatory P00111 – HP Memory Physical Asset profile HP WBEM TC 1.0.
CIM_SystemDevice (see DMTF Base Server profile) HP_SystemMemory Figure 2 – Memory Profile: Hierarchy Diagram Figure 1 represents the class diagram for the HP Memory Profile. The HP_Memory class describes logical aspects of system memory. The physical aspects of system memory is optionally described using the HP_MemoryModule class, defined in the HP Memory Physical Asset Profile.
8 Methods None. 8.1 Profile Conventions for Operations Support for operations for each profile class (including associations) is specified in the following subclauses. Each sub-clause includes either a statement “All operations are supported as described by DSP200 v1.2” or a table listing all the operations that are Unspecified by this profile or where the profile requires behavior other that described by DSP200.
9 9.1 Use Cases Object Diagrams The following represents a possible instantiation of the HP Memory Profile. In this case, “system1” has two memory modules. For simplicity the properties have been removed from the classes. system1 : HP_ComputerSystem HP_SystemMemory memory1 : HP_Memory HP_RealizesMemoryModule mm1 : HP_MemoryModule HP_RealizesMemoryModule mm2 : HP_MemoryModule Figure 3 – HP Memory Profile: Object diagram with two memory modules 12 Version 1.0.
10 CIM Elements Table 3 – CIM Elements – HP Memory Profile Element Name Requirement Description Classes HP_Memory Mandatory See section 7.1 and 10.1 HP_SystemMemory Mandatory See section 7.2 and 10.2 HP_RegisteredProfile Mandatory See section 10.3 Indications None defined in this profile 10.1 HP_Memory HP_Memory extends the class CIM_Memory in ways that are specific to HP systems.
Table 6 – Class: HP_RegisteredProfile Properties Requirement Notes RegisteredOrganization Mandatory Other (1) OtherRegisteredOrganization Mandatory “HP WBEM TC” RegisteredName Mandatory “HP Memory” RegisteredVersion Mandatory “1.0.
ANNEX A (normative) Change Log Version Date 0.1 6/28/06 Initial Draft 0.2 7/26/06 Resolved various typographical errors based on WBEM TC sub-team review 0.3 7/28/06 Updated broken hyperlinks and revised property format 1.0 8/1/06 Updated document version Version 1.0.
ANNEX B (informative) Acknowledgments 16 Version 1.0.
ANNEX C (informative) Included WBEM TC CR Numbers CR Number Date CR00106 7/26/06 Version 1.0.
Bibliography This section contains a list of the external references and dependencies for this specification. 18 Version 1.0.
