HP ProLiant XL220a Gen8 v2 Server User Guide Abstract This document is for the person who installs, administers, and troubleshoots servers and storage systems. HP assumes you are qualified in the servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels.
© Copyright 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft® and Windows® are U.S. registered trademarks of Microsoft Corporation.
Contents Component identification ............................................................................................................... 6 Front panel components ................................................................................................................................ 6 Front panel LEDs and buttons ......................................................................................................................... 7 System board components .................................
HP Trusted Platform Module option .............................................................................................................. 34 Installing the Trusted Platform Module board ....................................................................................... 35 Retaining the recovery key/password................................................................................................. 36 Enabling the Trusted Platform Module .......................................................
Electrostatic discharge ................................................................................................................. 57 Preventing electrostatic discharge ................................................................................................................ 57 Grounding methods to prevent electrostatic discharge .................................................................................... 57 Specifications ...............................................................
Component identification Front panel components Item Description 1 Drive bay 2 (node 1) 2 Drive bay 1 (node 1) 3 SUV connector (node 1) 4 SUV connector (node 2) 5 Drive bay 2 (node 2) 6 Drive bay 1 (node 2) 7 Server release lever 8 Server release latch 9 Serial label pull tab Component identification 6
Front panel LEDs and buttons Item Description Status 1 NIC 1 LED (node 1) Solid green = Link to network Flashing green (1 Hz/cycle per sec) = Network active Off = No network activity 2 Health LED (node 1) Solid green = Normal Flashing amber = System degraded Flashing red (1 Hz/cycle per sec) = System critical Fast-flashing red (4 Hz/cycles per sec) = Power fault 3 NIC 2 LED (node 2) Solid green = Link to network Flashing green (1 Hz/cycle per sec) = Network active Off = No network activity 4 H
Item Description Status 6 Power On/Standby button and system power LED (node 2) Solid green = System on Flashing green (1 Hz/cycle per sec) = Performing power on sequence Solid amber = System in standby Off = No power present 7 UID button/LED (node 1) Solid blue = Activated Flashing blue (1 Hz/cycle per sec) = Remote management or firmware upgrade in progress Off = Deactivated 8 Power On/Standby button and system power LED (node 1) Solid green = System on Flashing green (1 Hz/cycle per sec) = Per
Item Description 16 PCIe riser board connector (node 2) 17 System maintenance switch (node 2) 18 Drive backplane power connector (node 2) DIMM slot locations DIMM slots are numbered sequentially (1 through 4) for each processor. The supported AMP modes use the alpha assignments for population order, and the slot numbers designate the DIMM slot ID for spare replacement. The arrow indicates the front of the server.
Drive numbering Item Description 1 Drive bay 2 (node 1) 2 Drive bay 1 (node 1) 3 Drive bay 1 (node 2) 4 Drive bay 2 (node 2) Hot-plug drive LED definitions Component identification 10
Item LED Status Definition 1 Locate Solid blue The drive is being identified by a host application. Flashing blue The drive carrier firmware is being updated or requires an update. Rotating green Drive activity Off No drive activity Solid white Do not remove the drive. Removing the drive causes one or more of the logical drives to fail. Off Removing the drive does not cause a logical drive to fail. Solid green The drive is a member of one or more logical drives.
Operations Power down the server Before powering down the server for any upgrade or maintenance procedures, perform a backup of critical server data and programs. IMPORTANT: When the server is in standby mode, auxiliary power is still being provided to the system. To power down the server, use one of the following methods: • Press and release the Power On/Standby button. This method initiates a controlled shutdown of applications and the OS before the server enters standby mode.
Remove the drive 1. Determine the status of the drive from the drive LED definitions ("Hot-plug drive LED definitions" on page 10). 2. Back up all data on the drive. 3. Remove the drive.
Remove the processor air baffle 1. Power down the server (on page 12). 2. Disconnect all peripheral cables from the server. 3. Remove the server (on page 13). 4. Remove the processor air baffle. Remove the PCI riser board assembly 1. Power down the server (on page 12). 2. Disconnect all peripheral cables from the server. 3. Remove the server (on page 13). 4. Place the server on a flat, level work surface. 5. Disconnect all cables connected to existing expansion boards.
6. Remove the PCI riser board assembly. A T-10 screwdriver (for horizontal screws) and a T-15 screwdriver (for vertical screws) are required for this procedure. Remove the drive cage assembly 1. Back up all server data on the drive. 2. Power down the server (on page 12). 3. Disconnect all peripheral cables from the server. 4. Remove the server (on page 13). 5. Place the server on a flat, level work surface. 6. Remove the PCI riser board assembly (on page 14). 7.
8. Disconnect the front panel LED board assembly cables. 9. Remove all drives ("Remove the drive" on page 13). 10. Remove the drive cage assembly. To replace the component, reverse the removal procedure.
Install the processor air baffle 1. Install the processor air baffle. IMPORTANT: If the DIMM latches are not fully closed, the baffle will not sit properly. 2. Install the server into the chassis ("Install the server" on page 18). 3. Connect all peripheral cables to the server. 4. Press the Power On/Standby button. The server exits standby mode and applies full power to the system. The system power LED changes from amber to green. Install the PCI riser board assembly 1.
2. Install the PCI riser board assembly. 3. Connect all cables to existing expansion boards. 4. Install the server (on page 18). 5. Connect all peripheral cables to the server. 6. Press the Power On/Standby button. The server exits standby mode and applies full power to the system. The system power LED changes from amber to green. Install the server CAUTION: To prevent improper cooling and thermal damage, do not operate the chassis unless all bays are populated with a component or a blank.
To install the component: 1. Prepare the server for installation. 2. Install the server. When seated properly, the server will be flush with the front of the chassis and the release lever will close completely without resistance.
Setup Setup overview Installation of a server requires the following steps: 1. Install and configure a chassis. 2. Install any server options. 3. Install I/O modules in the chassis. 4. Connect the I/O modules to the network. 5. Install a server. 6. Install an operating system. 7. Install system software. 8. Register the product. Installing the chassis into a rack To install the chassis into a rack, see the HP Apollo a6000 Chassis Setup and Installation Guide on the HP website (http://www.hp.
CAUTION: To prevent improper cooling and thermal damage, do not operate the chassis unless all bays are populated with a component or a blank. To install the component: 1. Prepare the server for installation. 2. Install the server. When seated properly, the server will be flush with the front of the chassis and the release lever will close completely without resistance. Powering up the chassis Connect the AC or DC power cables, depending on the power configuration.
Installing the operating system To operate properly, the server must have a supported operating system installed. For the latest information on operating system support, see the HP website (http://www.hp.com/go/supportos). To install an operating system on the server, use one of the following methods: • Manual installation—Insert the operating system CD into the USB-attached DVD-ROM drive (user provided) and reboot the node.
Hardware options installation Introduction If more than one option is being installed, read the installation instructions for all the hardware options and identify similar steps to streamline the installation process. WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, properly ground the server before beginning any installation procedure.
c. Remove the heatsink from the processor backplate. WARNING: To reduce the risk of personal injury from hot surfaces, allow the heatsink to cool before touching it. WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To avoid damage to the processor, do not touch the bottom of the processor, especially the contact area. CAUTION: The pins on the processor socket are very fragile.
CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board: • Do not touch the processor socket contacts. • Do not tilt or slide the processor when lowering the processor into the socket. 1. Install the processor. Use the notches on both sides of the processor to properly align it into the socket. CAUTION: Be sure to close the processor socket retaining bracket before closing the processor locking lever. The lever should close without resistance.
4. Apply all the grease to the top of the processor in the following pattern to ensure even distribution. 5. Install the heatsink. 6. Install the processor air baffle (on page 17). 7. Install the server into the chassis ("Install the server" on page 18). 8. Connect all peripheral cables to the server. 9. Press the Power On/Standby button. The server exits standby mode and applies full power to the system. The system power LED changes from amber to green.
Memory subsystem architecture The memory subsystem in this server is divided into channels. The processor supports two channels, and each channel supports two DIMM slots. Channel Population order Slot number 1 C A 4 3 2 D B 2 1 DIMM slots are identified by number and by letter. Letters identify the population order. Slot numbers are reported by ROM messages during boot and are used for error reporting. For the DIMM slot locations, see "DIMM slot locations (on page 9).
Item Description Definition 1 Size — 2 Rank 1R 2R 3R 4R 3 Data width x4 = 4-bit x8 = 8-bit 4 Voltage rating L = Low voltage (1.35V) U = Ultra low voltage (1.
CAUTION: To avoid damage to the drives, memory, and other system components, the air baffle, and drive blanks must be installed when the server is powered up. 1. Update the system ROM. Locate and download the latest ROM version from the HP website (http://www.hp.com/support). Follow the instructions on the website to update the system ROM. 2. Power down the server (on page 12). 3. Disconnect all peripheral cables from the server. 4. Remove the server (on page 13). 5.
Drive guidelines When adding drives to the server, observe the following general guidelines: • The system automatically sets all device numbers. • If only one drive is used, install it in the bay with the lowest device number ("Drive numbering" on page 10). • To provide the greatest storage space efficiency when drives are grouped together into the same drive array, drives must be the same capacity. Installing a hot-plug drive 1. Remove the drive blank. 2. Prepare the drive. 3.
Controller options The server supports installation of controller options in the PCI riser assembly for node 1 and node 2. The installation procedure for both node 1 and node 2 are the same. To install the component: 1. Power down the server (on page 12). 2. Disconnect all peripheral cables from the server. 3. Remove the server (on page 13). 4. Place the server on a flat, level work surface. 5. Remove the PCI riser board assembly (on page 14). 6.
FBWC cache module and capacitor pack option To install the component: 1. Power down the server (on page 12). 2. Disconnect all peripheral cables from the server. 3. Remove the server (on page 13). 4. Remove the PCI riser board assembly (on page 14). 5. Connect the FBWC capacitor pack cable to the cache module. 6. Install the cache module in the cache module slot on the controller. 7.
9. Install the FBWC capacitor pack into the holder mounted in the server. 10. Route the capacitor pack cables as indicated: Bundle all extra cable close to the capacitor pack and secure using the cable tie. Place the bundled cable under the capacitor pack mounting bracket.
o Node 2 11. Connect and route all drive cables. For more information, see "Drive cabling (on page 52)." 12. Install the server into the chassis ("Install the server" on page 18). 13. Connect all peripheral cables to the server. 14. Press the Power On/Standby button. The server exits standby mode and applies full power to the system. The system power LED changes from amber to green.
• When installing or replacing hardware, HP service providers cannot enable the TPM or the encryption technology. For security reasons, only the customer can enable these features. • When returning a system board for service replacement, do not remove the TPM from the system board. When requested, HP Service provides a TPM with the spare system board. • Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security rivet.
8. Install the TPM security rivet by pressing the rivet firmly into the system board. 9. Install the PCI riser board assembly (on page 17). 10. Install the server (on page 18). 11. Press the Power On/Standby button. The server exits standby mode and applies full power to the system. The system power LED changes from amber to green. Retaining the recovery key/password The recovery key/password is generated during BitLocker™ setup, and can be saved and printed after BitLocker™ is enabled.
8. Enable the TPM in the OS. For OS-specific instructions, see the OS documentation. CAUTION: When a TPM is installed and enabled on the server, data access is locked if you fail to follow the proper procedures for updating the system or option firmware, replacing the system board, replacing a hard drive, or modifying OS application TPM settings. For more information on firmware updates and hardware procedures, see the HP Trusted Platform Module Best Practices White Paper on the HP website (http://www.hp.
Software and configuration utilities Server mode The software and configuration utilities presented in this section operate in online mode, offline mode, or in both modes.
iLO 4 enables and manages the Active Health System (on page 39) and also features Agentless Management. All key internal subsystems are monitored by iLO 4. SNMP alerts are sent directly by iLO 4 regardless of the host operating system or even if no host operating system is installed. HP Insight Remote Support software (on page 41) is also available in HP iLO with no operating system software, drivers, or agents.
The data that is collected is managed according to the HP Data Privacy policy. For more information see the HP website (http://www.hp.com/go/privacy). The Active Health System log, in conjunction with the system monitoring provided by Agentless Management or SNMP Pass-thru, provides continuous monitoring of hardware and configuration changes, system status, and service alerts for various server components. The Agentless Management Service is available in the SPP, which is a disk image (.
HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS is not running. To run this utility, boot the server using Intelligent Provisioning (on page 40). HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and other related data needed for effective server management. Available in Microsoft Windows and Linux versions, the utility helps to ensure proper system operation.
HP Insight Remote Support is available as part of HP Warranty, HP Care Pack Service, or HP contractual support agreement. HP Insight Remote Support Central Connect When you use the embedded Remote Support functionality with an HP ProLiant Gen8 server or HP BladeSystem c-Class enclosure, you can register a server or chassis to communicate to HP through an HP Insight Remote Support centralized Hosting Device in your local environment.
ProLiant BL, ML, DL, and SL servers. The toolkit includes a modular set of utilities and important documentation that describes how to apply these tools to build an automated server deployment process. The Scripting Toolkit provides a flexible way to create standard server configuration scripts. These scripts are used to automate many of the manual steps in the server configuration process.
• Language selection For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the HP RBSU Information Library (http://www.hp.com/go/rbsu/docs). Using RBSU To use RBSU, use the following keys: • To access RBSU, press the F9 key during power-up when prompted. • To navigate the menu system, use the arrow keys. • To make selections, press the Enter key. • To access Help for a highlighted configuration option, press the F1 key.
Boot options Near the end of the boot process, the boot options screen is displayed. This screen is visible for several seconds before the system attempts to boot from a supported boot device. During this time, you can do the following: • Access RBSU by pressing the F9 key. • Access Intelligent Provisioning Maintenance Menu by pressing the F10 key. • Access the boot menu by pressing the F11 key. • Force a PXE Network boot by pressing the F12 key.
Utilities and features Array Configuration Utility ACU is a utility with the following features: • Runs as a local application or remote service accessed through the HP System Management Homepage • Supports online array capacity expansion, logical drive extension, assignment of online spares, and RAID or stripe size migration • Suggests the optimum configuration for an unconfigured system • For supported controllers, provides access to licensed features, including: o Moving and deleting individual
HP Smart Storage Administrator HP SSA is a configuration and management tool for HP Smart Array controllers. Starting with HP ProLiant Gen8 servers, HP SSA replaces ACU with an enhanced GUI and additional configuration features. HP SSA exists in three interface formats: the HP SSA GUI, the HP SSA CLI, and HP SSA Scripting. Although all formats provide support for configuration tasks, some of the advanced tasks are available in only one format.
For more information, go to the HP website (http://www.hp.com/go/hpsc) and click on Drivers, Software & Firmware. Then, enter your product name in the Find an HP product field and click Go. Automatic Server Recovery ASR is a feature that causes the system to restart when a catastrophic operating system error occurs, such as a blue screen, ABEND (does not apply to HP ProLiant DL980 Servers), or panic.
Keeping the system current Drivers IMPORTANT: Always perform a backup before installing or updating device drivers. The server includes new hardware that may not have driver support on all OS installation media. If you are installing an Intelligent Provisioning-supported OS, use Intelligent Provisioning (on page 40) and its Configure and Install feature to install the OS and latest supported drivers.
HP operating systems and virtualization software support for ProLiant servers For information about specific versions of a supported operating system, see the HP website (http://www.hp.com/go/ossupport). HP Technology Service Portfolio HP Technology Services offers a targeted set of consultancy, deployment, and service solutions to meet the support needs of most business and IT environments.
Troubleshooting Troubleshooting resources The HP ProLiant Gen8 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, issue resolution, and software maintenance on ProLiant servers and server blades. To view the guide, select a language: • English (http://www.hp.com/support/ProLiant_TSG_v1_en) • French (http://www.hp.com/support/ProLiant_TSG_v1_fr) • Spanish (http://www.hp.
Cabling Internal server cabling This section provides guidelines that help you make informed decisions about cabling the server and hardware options to optimize performance. CAUTION: When routing cables, always be sure that the cables are not in a position where they can be pinched or crimped.
Front panel LED board assembly cabling FBWC capacitor pack cabling SUV cable connectors CAUTION: Before disconnecting the SUV cable from the connector, always squeeze the release buttons on the sides of the connector. Failure to do so can result in damage to the equipment.
Item Connector Description 1 Serial For trained personnel to connect a null modem serial cable and perform advanced diagnostic procedures 2 USB For connecting up to two USB devices 3 Video For connecting a video monitor Cabling 54
Regulatory information Safety and regulatory compliance For safety, environmental, and regulatory information, see Safety and Compliance Information for Server, Storage, Power, Networking, and Rack Products, available at the HP website (http://www.hp.com/support/Safety-Compliance-EnterpriseProducts). Belarus Kazakhstan Russia marking Manufacturer Hewlett-Packard Company, Address: 3000 Hanover Street, Palo Alto, California 94304, U.S.
Valid date formats include the following: • YWW, where Y indicates the year counting from within each new decade, with 2000 as the starting point. For example, 238: 2 for 2002 and 38 for the week of September 9. In addition, 2010 is indicated by 0, 2011 by 1, 2012 by 2, 2013 by 3, and so forth. • YYWW, where YY indicates the year, using a base year of 2000. For example, 0238: 02 for 2002 and 38 for the week of September 9.
Electrostatic discharge Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device. To prevent electrostatic damage: • Avoid hand contact by transporting and storing products in static-safe containers.
Specifications Environmental specifications Specification Value Temperature range* — Operating 10°C to 35°C (50°F to 95°F) Shipping -40°C to 70°C (-40°F to 158°F) Maximum wet bulb temperature 28°C (82.4°F) 130 W CPU option 10°C to 25°C (50°F to 77°F) Relative humidity (noncondensing)** — Operating 10% to 90% Nonoperating 5% to 95% * All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to 3,048 m (10,000 ft) is applicable.
Support and other resources Before you contact HP Be sure to have the following information available before you call HP: • Active Health System log (HP ProLiant Gen8 or later products) Download and have available an Active Health System log for 3 days before the failure was detected. For more information, see the HP iLO 4 User Guide or HP Intelligent Provisioning User Guide on the HP website (http://www.hp.com/go/ilo/docs).
providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts: • Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service. • Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair.
Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus d'informations sur ce programme en Amérique du Nord, consultez le site Web HP (http://www.hp.com/go/selfrepair). Riparazione da parte del cliente Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente dal cliente (CSR, Customer Self Repair).
HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet. CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert. Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen Aufpreis verfügbar.
sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio. Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite la página web de HP siguiente (http://www.hp.com/go/selfrepair).
Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto. OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça.
Support and other resources 65
Support and other resources 66
Acronyms and abbreviations ABEND abnormal end ACU Array Configuration Utility ADM Advanced Data Mirroring AMP Advanced Memory Protection ASR Automatic Server Recovery CSR Customer Self Repair DDDC Double Device Data Correction DDR double data rate DDR3 double data rate-3 DHCP Dynamic Host Configuration Protocol FBWC flash-backed write cache GPU graphics processing unit Acronyms and abbreviations 67
HP SIM HP Systems Insight Manager HP SSA HP Smart Storage Administrator HP SUM HP Smart Update Manager iLO Integrated Lights-Out IML Integrated Management Log ISO International Organization for Standardization LOM LAN on Motherboard LRDIMM load reduced dual in-line memory module NVRAM nonvolatile memory ORCA Option ROM Configuration for Arrays PCI peripheral component interconnect PCIe Peripheral Component Interconnect Express PDU power distribution unit POST Power-On Self Test Acronyms and ab
RBSU ROM-Based Setup Utility RDIMM registered dual in-line memory module RDP Rapid Deployment Pack RoHS Restriction of Hazardous Substances SAS serial attached SCSI SATA serial ATA SD Secure Digital SDDC Single Device Data Correction SID Systems Insight Display SIM Systems Insight Manager SPP HP Service Pack for ProLiant SUV serial, USB, video TMRA recommended ambient operating temperature TPM Trusted Platform Module Acronyms and abbreviations 69
UDIMM unregistered dual in-line memory module UID unit identification VCA Version Control Agent VCRM Version Control Repository Manager Acronyms and abbreviations 70
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Index A ACU (Array Configuration Utility) air baffle, installation 17 air baffle, removal 14 Array Configuration Utility (ACU) ASR (Automatic Server Recovery) authorized reseller 59 auto-configuration process 44 Automatic Server Recovery (ASR) 38, 46, 47 46, 47 48 48 drive numbering 10, 29 drivers 49 drives 10 drives, installing 30 E electrostatic discharge 57 environmental requirements 58 Erase Utility 38, 41 European Union notice 55 B F battery 8 BIOS upgrade 38, 47 boot options 45 BSMI notice 55
installing I/O modules 20 installing operating system 22 installing the processor air baffle 17 Integrated Lights-Out (iLO) 38, 40 Integrated Management Log (IML) 40 J Japanese notice 55 L LED, system power 7 LEDs, drive 10 LEDs, hard drive 10 LEDs, SAS hard drive 10 LEDs, troubleshooting 51 LEDs, unit identification (UID) 7 M memory 27, 28 memory, online spare 45 O online spare memory 45 operating systems 50 operations 12 Option ROM Configuration for Arrays (ORCA) 38, 47 options installation 23, 30 ORC
W website, HP 59 Index 74
