HP ProLiant SL4540 Gen8 Server Node User Guide Abstract This document is for the person who installs, administers, and troubleshoots servers and storage systems. HP assumes you are qualified in the servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels.
© Copyright 2012, 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft® and Windows® are U.S.
Contents Component identification ............................................................................................................... 6 Node component identification ................................................................................................................... 6 Front panel components ................................................................................................................... 6 Front panel LEDs and buttons ..............................................
Hot-plug hard drive guidelines .................................................................................................................. 38 Removing a drive blank .................................................................................................................. 39 Installing a hot-plug SATA hard drive ............................................................................................... 39 Controller options ..................................................................
Safety and regulatory compliance ............................................................................................................. 61 Turkey RoHS material content declaration ................................................................................................... 61 Ukraine RoHS material content declaration ................................................................................................. 61 Warranty information ..........................................................
Component identification Node component identification Front panel components Item Description 1 Hard drive bay 1 2 Hard drive bay 2 3 Node release button 4 USB connectors (2) 5 VGA connector Front panel LEDs and buttons Item Description Status 1 UID LED button Blue = Activated Flashing blue = System is being remotely managed or firmware update is in progress.
Item Description Status 2 Node release button — 3 System Health LED Green = Normal Flashing amber = System degraded Flashing red = System critical 4 Power On/Standby button and system power LED Green = System on Amber = System is in Standby mode, but power is still applied. Off = Power is not connected, or power supply has failed. Off = Deactivated Hot-plug drive LED definitions Item LED Status Definition 1 Locate Solid blue The drive is being identified by a host application.
System board components Item Description 1 HDD data LED backplane connector 2 Power connector 3 Processor socket 2 4 Processor 1 DIMM slots (6) 5 SATA HDD connector 1 6 SATA HDD connector 2 7 Reserved connector 8 Reserved connector 9 Reserved connector 10 Reserved connector 11 HDD data LED connector 12 MicroSD card slot 13 USB/VGA connector 14 Personality board connector 1 15 NMI jumper 16 NIC 1 connector 17 NIC 2 connector 18 iLO connector 19 LED power connector 20
Item Description 31 VGA connector 32 Front LED connector DIMM slots DIMM slots are numbered sequentially (1 through 6) for each processor. The supported AMP modes use the letter assignments for population guidelines.
drivers, and applications. Many crashes can freeze a system, requiring you to do a hard reset. Resetting the system erases any information that would support root cause analysis. Systems running Microsoft® Windows® experience a blue-screen trap when the OS crashes. When this happens, Microsoft® recommends that system administrators perform an NMI event by temporarily shorting the NMI header with a jumper. The NMI event enables a hung system to become responsive again.
Front panel components • 1 node chassis Item Description 1 Node drives 2 LFF drive health LED 3 LFF drive UID 4 Drives controlled by the array controller a. Port 1i b.
Item Description 1 Node 1 2 Node drives 3 LFF drive health LED 4 LFF drive UID 5 Drives controlled by node 1 P420i array controller 6 Node 2 7 Drives controlled by node 2 P420i array controller 8 Drive display boards 9 Node VGA connector 10 Node USB connectors 11 Node Power On/Standby button and system power LED 12 Node health LED 13 Node release button 14 Node UID LED button • 3 node chassis Item Description 1 Node 1 2 Node drives 3 LFF drive health LED 4 LFF drive
Item Description 16 Node UID LED button Hard drive display LEDs LED behavior Definition Off • • • Drive is not installed. Drive is not a member of any RAID volumes. Drive is a spare drive that is inactive or has been activated but has not been rebuilt. Notes: • • Solid green Drive is not rebuilding. Drive is not a volume undergoing capacity expansion. All of the following conditions apply: • • • • Drive is a member of a RAID volume. Drive is not an inactive spare drive.
LED behavior Definition Green Storage system health is good. Amber System requires service or a fault is detected. Check hard drives, hard drive backplane, RAID controller, and system fans. UID LEDs LED behavior Definition Off Normal operating mode Blue flashing Hard drive segment is selected; hard drive is in locate mode. Firmware is being flashed.
• 2 node chassis Item Description 1 System fans 2 I/O module for node 1 3 Management module 4 Power supplies 5 I/O module for node 2 • 3 node chassis Item Description 1 System fans 2 I/O module for node 1 3 Management module 4 I/O module for node 2 5 Power supplies 6 I/O module for node 3 Component identification 15
I/O module connectors and LEDs • 1 Gb I/O module Item Description 1 Activity LED 2 1Gb connectors 3 I/O module health LED 4 Serial connector 5 Link LED • 10 Gb I/O module Item Description 1 1 Gb connectors 2 I/O module health LED 3 QSFP 10 Gb Ethernet or 40Gb IB connector, depending on configuration 4 SFP+ 10Gb Ethernet connector Component identification 16
Item Description 5 Serial connector 6 Link LED 7 Activity LED 8 Activity LED 9 Link LED Description Status Health LED Off = I/O module is in good health. Amber = I/O module has one of the following health issues: • • • Thermal alarm on a mezzanine card I/O module power has failed on one of the power rails. The I/O module is not fully seated in the connector.
Description Status UID LED Blue = Activated Flashing blue = System is being remotely managed.
2 node drive bay numbering 3 node drive bay numbering Component identification 19
Power supply LED Power LED Status Off • • • Green AC is present and main 12 V output is enabled. No AC power to power supply units. Check the AC power cord. AC is present. Standby output is on; output is disabled. Power supply failure (includes overvoltage and overtemperature) Fan LED LED color System fan status Off The fan is working or power is off. Solid amber The fan module has failed.
Operations Powering up the system 1. Connect the power cables to the power supplies. 2. Connect the power cables to the power source (UPS or wall outlet) or to an installed PDU. 3. Press the Power On/Standby button on the node. Power down the node Before powering down the node for any upgrade or maintenance procedures, perform a backup of critical server data and programs. IMPORTANT: When the node is in standby mode, auxiliary power is still being provided to the system.
c. Remove the node. CAUTION: To avoid damage to the device, do not use the removal handle to carry it. 3. Place the node on a flat, level surface. Remove the access panel To remove the component: 1. Power down the node (on page 21). 2. Remove the node ("Remove a node from the chassis" on page 21). 3. Press the access panel release button.
4. Slide the access panel toward the rear of the node, and then lift to remove the panel. Install the access panel 1. Place the access panel on top of the node. 2. Slide the access panel forward until it clicks into place.
Setup Optional installation services Delivered by experienced, certified engineers, HP Care Pack services help you keep your servers up and running with support packages tailored specifically for HP ProLiant systems. HP Care Packs let you integrate both hardware and software support into a single package. A number of service level options are available to meet your needs.
Space and airflow requirements To allow for servicing and adequate airflow, observe the following space and airflow requirements when deciding where to install a rack: • Leave a minimum clearance of 63.5 cm (25 in) in front of the rack. • Leave a minimum clearance of 76.2 cm (30 in) behind the rack. • Leave a minimum clearance of 121.9 cm (48 in) from the back of the rack to the back of another rack or row of racks.
Power requirements Installation of this equipment must comply with local and regional electrical regulations governing the installation of information technology equipment by licensed electricians. This equipment is designed to operate in installations covered by NFPA 70, 1999 Edition (National Electric Code) and NFPA-75, 1992 (code for Protection of Electronic Computer/Data Processing Equipment).
WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that: • • • • • The leveling jacks are extended to the floor. The full weight of the rack rests on the leveling jacks. The stabilizing feet are attached to the rack if it is a single-rack installation. The racks are coupled together in multiple-rack installations. Only one component is extended at a time. A rack may become unstable if more than one component is extended for any reason.
Configuring the chassis For further information on setting up and configuring your system, see the HP ProLiant SL4500 Series Quick Setup Instructions and the HP ProLiant SL4500 Series Setup and Installation Guide. Powering up and configuring the server To power up the server, press the Power On/Standby button. While the server boots, RBSU and the ORCA utility are automatically configured to prepare the server for operating system installation.
For additional system software and firmware updates, download the HP Service Pack for ProLiant from the HP website (http://www.hp.com/go/spp/download). Software and firmware should be updated before using the node for the first time, unless any installed software or components require an older version. For more information on using these installation methods, see the HP website (http://www.hp.com/go/ilo).
Hardware options installation Introduction If more than one option is being installed, read the installation instructions for all the hardware options and identify similar steps to streamline the installation process. WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, properly ground the server before beginning any installation procedure.
5. Remove the heatsink blank. IMPORTANT: To avoid forcibly ejecting the processor, open the levers slowly. 6. Open each of the processor locking levers in the order indicated, and then open the processor retaining bracket.
7. Remove the clear processor socket cover. Retain the processor socket cover for future use. 8. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
CAUTION: Do not press down on the processor. Pressing down on the processor may cause damage to the processor socket and the system board. Press only in the area indicated on the processor retaining bracket. 10. Press and hold the processor retaining bracket in place, and then close each processor locking lever. Press only in the area indicated on the processor retaining bracket. 11. Remove the thermal interface protective cover from the heatsink.
12. Install the heatsink. 13. Install the access panel (on page 23). 14. Install the node into the chassis ("Installing a node into the chassis" on page 27). 15. Power up the node ("Powering up and configuring the server" on page 28, "Powering up the system" on page 21). Memory options The node supports single- and dual-rank PC3L-10600 (DDR-1333) RDIMMs operating at up to 1333 MT/s.
Memory subsystem architecture The memory subsystem in this node is divided into channels. Each processor supports three channels, and each channel supports two DIMM slots, as shown in the following table. DIMM slots in this server are identified by number and by letter. Letters identify the population order. Slot numbers indicate the DIMM slot ID for spare replacement.
DIMM identification To determine DIMM characteristics, use the label attached to the DIMM and the following illustration and table. Item Description Definition 1 Size — 2 Rank 1R 2R 3R 4R 3 Data width x4 = 4-bit x8 = 8-bit 4 Voltage rating L = Low voltage (1.35V) U = Ultra low voltage (1.
Advanced Memory Protection options are configured in RBSU. If the requested AMP mode is not supported by the installed DIMM configuration, the node boots in Advanced ECC mode. For more information, see "HP ROM-Based Setup Utility (on page 53)." Maximum capacity DIMM type DIMM rank One processor Two processors RDIMM Single-rank 24 GB 48 GB RDIMM Dual-rank 96 GB 192 GB For the latest memory configuration information, see the QuickSpecs on the HP website (http://www.hp.com).
Population order For memory configurations with a single processor or multiple processors, populate the DIMM slots sequentially in alphabetical order (A through F). After installing the DIMMs, use RBSU to configure memory support. Installing a DIMM CAUTION: To avoid damage to the hard drives, memory, and other system components, the air baffle, drive blanks, and access panel must be installed when the server is powered up. 1. Power down the node (on page 21). 2.
Removing a drive blank Remove the component as indicated. CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless all bays are populated with either a component or a blank. Installing a hot-plug SATA hard drive 1. Remove the drive blank ("Removing a drive blank" on page 39). 2. Prepare the drive.
3. Install the hard drive. 4. Determine the status of the drive from the drive LED definitions ("Hot-plug drive LED definitions" on page 7). Controller options The chassis I/O module ships standard with an HP Smart Array P420i controller. • For more information about product features, specifications, options, configurations, and compatibility, see the product QuickSpecs on the HP Product Bulletin website (http://www.hp.com/go/productbulletin).
CAUTION: Always observe the guidelines in this document. Failure to follow these guidelines can cause hardware damage or halt data access. When installing or replacing a TPM, observe the following guidelines: • Do not remove an installed TPM. Once installed, the TPM becomes a permanent part of the system board. • When installing or replacing hardware, HP service providers cannot enable the TPM or the encryption technology. For security reasons, only the customer can enable these features.
5. Install the TPM board. Press down on the connector to seat the board ("System board components" on page 8). 6. Install the TPM security rivet by pressing the rivet firmly into the system board. 7. Install the access panel (on page 23). 8. Install the node into the chassis ("Installing a node into the chassis" on page 27). 9. Power up the node ("Powering up and configuring the server" on page 28, "Powering up the system" on page 21).
• Always store the recovery key/password in multiple locations. • Always store copies of the recovery key/password away from the node. • Do not save the recovery key/password on the encrypted hard drive. Enabling the Trusted Platform Module 1. When prompted during the start-up sequence, access RBSU by pressing the F9 key. 2. From the Main Menu, select Server Security. 3. From the Server Security Menu, select Trusted Platform Module. 4.
Cabling Personality board cabling Item Description 1 NIC 2 (1 Gb) 2 NIC 1 (1 Gb) 3 iLO HDD data LED cabling The HDD data LED cable routes underneath the SATA cables and power cable. Connect and route the cables in the following order: 1. HDD data LED cable (bottom) 2. SATA cables 3.
SATA cabling The SATA cables route over the HDD data LED cable and underneath the power cable. Connect and route the cables in the following order: 1. HDD data LED cable (bottom) 2. SATA cables 3. Power cable Internal power cabling The power cable routes over the HDD LED cable and SATA cables. Connect and route the cables in the following order: 1. HDD data LED cable (bottom) 2. SATA cables 3.
RPS cabling The RPS cable routes with the front LED cable underneath the SATA board power cable and USB/VGA cable. Connect and route the cables in the following order: 1. RPS cable and front LED cable (bottom) 2. SATA power board cable 3. USB/VGA cable Front LED cabling The front LED cable routes with the RPS cable underneath the SATA board power cable and the USB/VGA connector cable. Connect and route the cables in the following order: 1. RPS cable and front LED cable (bottom) 2.
SATA board power cabling The SATA board power cable routes on top of the RPS cable and front LED cable, and underneath the USB/VGA cable. Secure the SATA board power cable in the plastic clip provided. Connect and route the cables in the following order: 1. RPS cable and front LED cable (bottom) 2. SATA power board cable, secured in the plastic clip 3. USB/VGA cable USB/VGA cabling The USB/VGA cable routes on top of the SATA board power cable, RPS cable, and front LED cable.
Software and configuration utilities Server mode The software and configuration utilities presented in this section operate in online mode, offline mode, or in both modes.
iLO enables and manages the Active Health System (on page 49) and also features Agentless Management. All key internal subsystems are monitored by iLO. SNMP alerts are sent directly by iLO regardless of the host operating system or even if no host operating system is installed. HP Insight Remote Support software (on page 51) is also available in HP iLO with no operating system software, drivers, or agents.
The data that is collected is managed according to the HP Data Privacy policy. For more information see the HP website (http://www.hp.com/go/privacy). The Active Health System log, in conjunction with the system monitoring provided by Agentless Management or SNMP Pass-thru, provides continuous monitoring of hardware and configuration changes, system status, and service alerts for various server components. The Agentless Management Service is available in the SPP, which is a disk image (.
HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS is not running. To run this utility, boot the node using Intelligent Provisioning (on page 50). HP Insight Diagnostics Online Edition is a web-based application that captures system configuration and other related data needed for effective node management. Available in Microsoft Windows and Linux versions, the utility helps to ensure proper system operation.
HP Insight Remote Support is available as part of HP Warranty, HP Care Pack Service, or HP contractual support agreement. Scripting Toolkit for Windows and Linux The Scripting Toolkit for Windows and Linux is a server deployment product that delivers an unattended automated installation for high-volume server deployments. The Scripting Toolkit is designed to support ProLiant BL, ML, DL, and SL servers.
HP Smart Update Manager HP SUM is a product used to install and update firmware, drivers, and systems software on HP ProLiant servers. HP SUM provides a GUI and a command-line scriptable interface for deployment of systems software for single or one-to-many HP ProLiant servers and network-based targets, such as iLOs, OAs, and VC Ethernet and Fibre Channel modules. For more information about HP SUM, see the product page on the HP website (http://www.hp.com/go/hpsum).
Auto-configuration process The auto-configuration process automatically runs when you boot the server for the first time. During the power-up sequence, the system ROM automatically configures the entire system without needing any intervention. During this process, the ORCA utility, in most cases, automatically configures the array to a default setting based on the number of drives connected to the server.
Utilities and features Array Configuration Utility ACU is a utility with the following features: • Runs as a local application or remote service accessed through the HP System Management Homepage • Supports online array capacity expansion, logical drive extension, assignment of online spares, and RAID or stripe size migration • Suggests the optimum configuration for an unconfigured system • For supported controllers, provides access to licensed features, including: o Moving and deleting individual
Option ROM Configuration for Arrays Before installing an operating system, you can use the ORCA utility to create the first logical drive, assign RAID levels, and establish online spare configurations.
USB support HP provides both standard USB 2.0 support and legacy USB 2.0 support. Standard support is provided by the OS through the appropriate USB device drivers. Before the OS loads, HP provides support for USB devices through legacy USB support, which is enabled by default in the system ROM. Legacy USB support provides USB functionality in environments where USB support is not available normally.
Software and firmware Software and firmware should be updated before using the server for the first time, unless any installed software or components require an older version. For system software and firmware updates, use one of the following sources: • Download the SPP ("HP Service Pack for ProLiant" on page 52) from the HP Service Pack for ProLiant download page (http://www.hp.com/go/spp).
Troubleshooting Troubleshooting resources The HP ProLiant Gen8 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, issue resolution, and software maintenance on ProLiant servers and server blades. To view the guide, select a language: • English (http://www.hp.com/support/ProLiant_TSG_v1_en) • French (http://www.hp.com/support/ProLiant_TSG_v1_fr) • Spanish (http://www.hp.
System battery If the node no longer automatically displays the correct date and time, you might have to replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years. WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce the risk of personal injury: • • • • Do not attempt to recharge the battery.
Regulatory information Safety and regulatory compliance For safety, environmental, and regulatory information, see Safety and Compliance Information for Server, Storage, Power, Networking, and Rack Products, available at the HP website (http://www.hp.com/support/Safety-Compliance-EnterpriseProducts). Turkey RoHS material content declaration Ukraine RoHS material content declaration Warranty information HP ProLiant and X86 Servers and Options (http://www.hp.
Electrostatic discharge Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device. To prevent electrostatic damage: • Avoid hand contact by transporting and storing products in static-safe containers.
Specifications Environmental specifications Specification Value Temperature range* Operating 10°C to 35°C (50°F to 95°F) Shipping -40°C to 70°C (-40°F to 158°F) Maximum wet bulb temperature 28°C (82.4°F) Relative humidity (noncondensing)** Operating 10% to 90% Nonoperating 5% to 95% * All temperature ratings shown are for sea level. An altitude derating of 1°C per 300 m (1.8°F per 1,000 ft) to 3,048 m (10,000 ft) is applicable. No direct sunlight allowed.
Support and other resources Before you contact HP Be sure to have the following information available before you call HP: • Active Health System log (HP ProLiant Gen8 or later products) Download and have available an Active Health System log for 3 days before the failure was detected. For more information, see the HP iLO 4 User Guide or HP Intelligent Provisioning User Guide on the HP website (http://www.hp.com/go/ilo/docs).
providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts: • Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service. • Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair.
Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus d'informations sur ce programme en Amérique du Nord, consultez le site Web HP (http://www.hp.com/go/selfrepair). Riparazione da parte del cliente Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente dal cliente (CSR, Customer Self Repair).
HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet. CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert. Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen Aufpreis verfügbar.
sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio. Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite la página web de HP siguiente (http://www.hp.com/go/selfrepair).
Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto. OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça.
Support and other resources 70
Support and other resources 71
Acronyms and abbreviations ABEND abnormal end ACU Array Configuration Utility ASR Automatic Server Recovery CSA Canadian Standards Association CSR Customer Self Repair DDR double data rate HDD hard drive HP SIM HP Systems Insight Manager IEC International Electrotechnical Commission iLO Integrated Lights-Out IML Integrated Management Log LRDIMM load reduced dual in-line memory module Acronyms and abbreviations 72
NMI nonmaskable interrupt NVRAM nonvolatile memory ORCA Option ROM Configuration for Arrays PCI-X peripheral component interconnect extended POST Power-On Self Test QSFP quad small form-factor pluggable RBSU ROM-Based Setup Utility RDIMM registered dual in-line memory module RDP Rapid Deployment Pack SAS serial attached SCSI SATA serial ATA SFF small form factor SFP small form-factor pluggable SIM Systems Insight Manager Acronyms and abbreviations 73
SL-APM HP ProLiant SL Advanced Power Manager SPP HP Service Pack for ProLiant TMRA recommended ambient operating temperature UID unit identification UPS uninterruptible power system USB universal serial bus VCA Version Control Agent VCRM Version Control Repository Manager Acronyms and abbreviations 74
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Index A access panel 22, 23 ACU (Array Configuration Utility) Advanced ECC memory 37, 54 airflow requirements 25 Array Configuration Utility (ACU) ASR (Automatic Server Recovery) authorized reseller 64 auto-configuration process 54 Automatic Server Recovery (ASR) 48, 55 55 56 56 B batteries, replacing 60 battery 60 BIOS upgrade 48, 56 boot options 54 BSMI notice 61 buttons 6 buttons, front panel 6 C cables 44 cabling 44, 45, 46, 47 Care Pack 24, 51 Change Control 58 chassis components 10 chassis, insta
health LEDs 11 HP Insight Diagnostics 50, 51 HP Insight Remote Support software 51 HP Service Pack for ProLiant 48, 50, 52 HP Smart Update Manager overview 48, 53 HP SmartMemory 34 I I/O module connectors 16 I/O module LEDs 16 iLO (Integrated Lights-Out) 48, 49, 50 IML (Integrated Management Log) 48, 50 Insight Diagnostics 50, 51, 57 installation services 24, 27 installation, server options 27, 30 installing hardware 27, 30 installing operating system 28 Integrated Lights-Out (iLO) 48, 50 Integrated Manage
S W safety considerations 26, 57, 61, 62 safety information 57, 61 SAS drives 7 SATA cabling 45 scripted installation 52 series number 61 server features and options 30 server, installation 21, 27 Service Packs 52 SL-APM overview 52 Smart Update Manager 48, 53 software 58 space requirements 25 specifications 63 SPP 52 static electricity 62 support 64 supported operating systems 58 system battery 60 system board components 8 System Erase Utility 51 system maintenance switch 9 warnings 26 T Taiwan battery
