HP ProLiant ML10 Server User Guide Abstract This document is for the person who installs, administers, and troubleshoots servers and storage systems. This document is intended for experienced IT professionals or end-users with no or prior hardware setup experience. HP assumes you are qualified in the servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels.
© Copyright 2013 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft® and Windows® are U.S. registered trademarks of Microsoft Corporation.
Contents Component identification ............................................................................................................... 6 Front panel components ............................................................................................................................. 6 Front panel LEDs and buttons ...................................................................................................................... 6 Rear panel components .........................................
Drive cabling .......................................................................................................................................... 43 Front I/O assembly cabling ...................................................................................................................... 44 Optical drive cabling ............................................................................................................................... 44 Ambient temperature sensor cabling ...................
Documentation feedback ............................................................................................................. 73 Index .........................................................................................................................................
Component identification Front panel components Item Description 1 Drive bay 2 USB connectors Front panel LEDs and buttons Component identification 6
Item Description Status 1 NIC link/activity LED Green = Network link Flashing green = Network link and activity Off = No link to network (If the power is off, view the rear panel NIC LEDs for status.
Rear panel LEDs and buttons Item Description Status 1 NIC status LED Solid green = Link to network Flashing green (1 Hz/cycle per sec) = Network active Off = No network activity 2 NIC link LED Solid green = Link exists Off = No link exists 3 Power supply LED Solid green = System on/System in standby Off = No power present System board components Component identification 8
Item Description 1 Processor socket 2 DIMM slots (4) 3 24-pin power supply connector 4 System fan connector 5 Internal USB connector 6 System battery 7 SATA connectors (2) 8 Ambient temperature sensor connector 9 Mini-SAS connector 10 Front I/O connector 11 Processor fan connector 12 Front USB connector 13 Slot 1 PCIe2x16 (16, 8, 4, 1)* 14 Slot 2 PCIe2x8 (4, 1) 15 Slot 3 PCIe2x8 (4, 1) 16 Slot 4 PCIe2x4 (1) 17 4-pin power supply connector 18 NMI header 19 Rear USB conn
System maintenance switch Position Default Function 1 Off Off = iLO security is enabled On = iLO security is disabled 2 Off Off = System configuration can be changed On = System configuration is locked 3 — Reserved 4 — Reserved 5 Off Off = Power-on password is enabled On = Power-on password is disabled 6 Off Off = No function On = Clear NVRAM 7 — Reserved 8 — Reserved 9 — Reserved 10 — Reserved When the system maintenance switch position 6 is set to the On position, the syst
Fan locations Item Description 1 Rear system fan 2 Processor-heatsink fan assembly Component identification 11
Operations Power up the server 1. Connect each power cord to the server. 2. Connect each power cord to the power source. 3. Press the Power On/Standby button. The server exits standby mode and applies full power to the system. The system power LED changes from amber to green. Power down the server Before powering down the server for any upgrade or maintenance procedures, perform a backup of critical server data and programs.
1. Press the Power On/Standby button. The server powers down and enters standby mode. The system power LED changes from green to amber. Power is still applied to the server. 2. Disconnect the power cord from the power source. 3. Disconnect the power cord from the server. 4. Place the server on its side. 5. Unfasten the T-15 screw securing the access panel, and then slide the panel towards the rear of the server.
2. The server powers down and enters standby mode. The system power LED changes from green to amber. Power is still applied to the server. 3. Disconnect the power cord from the power source. 4. Disconnect the power cord from the server. 5. Remove the access panel (on page 12). 6. Remove the front bezel. Install the front bezel 1. Insert the tabs on the front bezel into the slots on the front chassis. 2. Close the front bezel.
CAUTION: Do not operate the server for long periods with the access panel open or removed. Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage. 1. Place the access panel on the chassis, and then slide it toward the front of the server. 2. Tighten the T-15 screw. 3. Connect each power cord to the server. 4. Connect each power cord to the power source.
Setup Optional installation services Delivered by experienced, certified engineers, HP Care Pack services help you keep your servers up and running with support packages tailored specifically for HP ProLiant systems. HP Care Packs let you integrate both hardware and software support into a single package. A number of service level options are available to meet your needs.
Temperature requirements To ensure continued, safe, and reliable equipment operation, install or position the system in a well-ventilated, climate-controlled environment. The maximum recommended TMRA for most server products is 35°C (95°F). The temperature in the room where the server is located must not exceed 35°C (95°F).
Identifying the contents of the server shipping carton Unpack the server shipping carton and locate the materials and documentation necessary for installing the server. The contents of the server shipping carton include: • Server • Power cord • Hardware documentation and software products In addition to the supplied items, you might need: • Operating system or application software • Hardware options Installing hardware options Install any hardware options before initializing the server.
For more information on the automatic configuration, see the HP ROM-Based Setup Utility User Guide. Installing the operating system To operate properly, the server must have a supported operating system installed. For the latest information on supported operating systems, see the HP website (http://www.hp.com/go/supportos). You can install an operating system manually—Insert the operating system CD into the DVD-ROM drive, and then reboot the server.
Hardware options installation Introduction If more than one option is being installed, read the installation instructions for all the hardware options and identify similar steps to streamline the installation process. WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, properly ground the server before beginning any installation procedure.
4. Place the server on its side. 5. Remove the access panel (on page 12). 6. Remove the front bezel (on page 13). 7. Remove the EMI shield. 8. Install the drive into the drive carrier, and then secure it with four T-15 screws.
Be sure to install the drive with the sticker facing up and the connectors facing toward the rear. 9. Insert the drive carrier halfway into the media bay. 10. Connect the SATA cable and power cable (P6) to the rear of the drive.
11. Connect the other end of the SATA cable to the system board. 12. Fully insert the drive carrier into the media bay until the screw holes line up with the holes in the chassis, and then secure the drive cage, using the two M3 screws from the option kit. 13. Install the front bezel (on page 14). 14. Install the access panel (on page 14). 15. Return the server to an upright position. 16. Connect the power cord to the server. 17. Connect the power cord to the power source. 18.
Installing the 3 LFF drive enablement option 1. Press the Power On/Standby button. The server powers down and enters standby mode. The system power LED changes from green to amber. Power is still applied to the server. 2. Disconnect the power cord from the power source. 3. Disconnect the power cord from the server. 4. Place the server on its side. 5. Remove the access panel (on page 12). 6. Remove the front bezel (on page 13). 7. Install the LFF drive enablement option. 8.
b. Pull the cables out. 9. Remove the drive: a. Unfasten and remove the four T-15 screws connected to the drive cage. b. Slide out the drive to remove it. 10. Disconnect the 24 pin power supply cable: a. Release the cable tie securing the 24 pin power supply cable.
b. Disconnect the 24 pin power cable connector from the system board. 11. Disconnect the fan cable from the system board connector. 12. Remove the heatsink: a. Disconnect the fan cable from the system board. b. Loosen the four corner screws completely to disengage the heatsink.
c. 13. Remove the heatsink from the processor backplate. Install the drive bracket: a. Place the drive bracket flush against the wall of the chassis, and then slide it fully to the front of the chassis. b. From outside of the chassis, use two shoulder screws to secure the drive bracket to the chassis front. 14. Connect the system fan cable and the 24 pin power cable to the system board connectors.
To avoid drive carrier interference, tuck the two cables underneath the flanges of the drive bracket. 15. Insert the LFF drives into the drive carrier, the open end of the drive carrier should be facing down and the drive stickers should be facing up, and then secure each drive by tightening two T-15 6-32 screws on either side of the drive carrier for each drive installed. Be sure to install each drive with the sticker facing up and the connectors facing toward the rear. 16.
b. Place the drive carrier flush against the wall of the chassis, and then slide it fully to the chassis front. 17. Secure the drive carrier installed in the server: a. Insert and completely tighten the four T-15 6- 32 screws on the top of the drive cage. b. Insert and completely tighten the six shoulder screws on the chassis. 18. Connect the Mini-SAS/power cable assembly: a. Starting from the bottom, connect the HDD1, HDD2, and HDD3 connectors in sequence.
b. Connect the other end of the cable to power cable P3. c. Connect the Mini-SAS cable to the system board.
19. Secure the 24 pin, 4 pin, system board, P3, and the P4 power cables with a cable tie. 20. Clean the old thermal grease from the heatsink and the top of the processor with the alcohol swab. Allow the alcohol to evaporate before continuing. 21. Apply all the grease to the top of the processor in the following pattern to ensure even distribution. 22. Install the heatsink: a. Position the heatsink on the processor backplate b. Tighten the four corner screws completely to secure the heatsink in place.
c. Connect the fan cable to the system board. 23. Install the front bezel (on page 14). 24. Install the access panel (on page 14). 25. Return the server to an upright position. 26. Connect the power cord to the server. 27. Connect the power cord to the power source. 28. Press the Power On/Standby button. The server exits standby mode and applies full power to the system. The system power LED changes from amber to green. Optical drive option 1. Press the Power On/Standby button.
4. Place the server on its side. 5. Remove the access panel (on page 12). 6. Remove the front bezel (on page 13). 7. Remove the drive bay blank from the front bezel.
8. Remove the EMI shield. 9. Install the optical drive: a. Insert the optical drive halfway into the drive. b. Connect the SATA cable and power cable (P6) to the rear of the optical drive.
c. Pass the SATA cable through a cable clip at the bottom of the server, and then connect the other end of the cable to the system board. d. Fully insert the optical drive into the media bay until the screw holes line up with the holes in the chassis, and then secure the drive cage using the two T-15 screws. Use the T-15 screws available on the front I/O module for securing the optical drive. 10. Install the front bezel (on page 14). 11. Install the access panel (on page 14). 12.
Memory options The server memory subsystem supports only UDIMMs. The server supports dual-rank, PC3-12800E (DDR3) DIMMs operating at a speed of 1600 MT/s. For more information, see "General DIMM slot population guidelines (on page 38)." DIMM identification To determine DIMM characteristics, use the label attached to the DIMM and the following illustration and table. Item Description Definition 1 Size — 2 Rank 1R 2R 3R 4R 3 Data width x4 = 4-bit x8 = 8-bit 4 Voltage rating L = Low voltage (1.
Single-rank and dual-rank DIMMs DIMM configuration requirements are based on these classifications: • Single-rank DIMM—One set of memory chips that is accessed while writing to or reading from the memory. • Dual-rank DIMM—Two single-rank DIMMs on the same module, with only one rank accessible at a time. The server memory control subsystem selects the proper rank within the DIMM when writing to or reading from the DIMM. Dual-rank DIMMs provide the greatest capacity with the existing memory technology.
General DIMM slot population guidelines • The server has four memory slots. • The server supports two channels with two DIMM slots per channel. o Memory channel A consists of the two DIMM slots that are closest to the processor. o Memory channel B consists of the two DIMM slots that are farthest from the processor. • White DIMM slot indicates the first slot of a channel (2-A, 4-B). • Memory speed support depends on the type of processor installed.
4. Place the server on the side. 5. Remove the access panel (on page 12). 6. Open the DIMM slot latches. 7. Install the DIMM. 8. Install the access panel (on page 14). 9. Return the server to an upright position. 10. Connect the power cord to the server. 11. Connect the power cord to the power source. 12. Press the Power On/Standby button. The server exits standby mode and applies full power to the system. The system power LED changes from amber to green.
Expansion board options 1. Press the Power On/Standby button. The server powers down and enters standby mode. The system power LED changes from green to amber. Power is still applied to the server. 2. Disconnect the power cord from the power source. 3. Disconnect the power cord from the server. 4. Place the server on its side. 5. Remove the access panel (on page 12). 6. Remove the expansion slot cover retainer. 7. Remove the expansion slot cover. a.
These slot covers are not reusable, and you cannot reinstall them. b. If installing an expansion board in PCIe slots 2 or 4, pull up the slot cover and then remove it from the server. Retain the slot cover for future use.
8. Install the expansion board. Verify that the board is firmly seated in the slot. 9. Connect all necessary internal cabling to the expansion board. For more information on these cabling requirements, see the documentation that ships with the option. 10. Install the access panel (on page 14). 11. Return the server to an upright position. 12. Connect the power cord to the server. 13. Connect the power cord to the power source. 14. Press the Power On/Standby button.
Cabling Drive cabling • Primary non-hot-plug LFF drive cabling Item Description 1 SATA cable 2 Power (P3) cable • Secondary non-hot-plug LFF drive cabling Cabling 43
Item Description 1 SATA cable 2 Power (P6) cable Front I/O assembly cabling Optical drive cabling Item Description 1 SATA cable 2 Power (P6) cable Cabling 44
Ambient temperature sensor cabling Fan cabling • System fan Cabling 45
• Processor fan Power supply cabling Item Description 1 4-pin power supply cable 2 24-pin power supply cable Cabling 46
Software and configuration utilities Configuration tools HP ROM-Based Setup Utility RBSU is a configuration utility embedded in HP ProLiant servers that performs a wide range of configuration activities that can include the following: • Configuring system devices and installed options • Enabling and disabling system features • Displaying system information • Selecting the primary boot controller • Configuring memory options • Language selection For more information on RBSU, see the HP ROM-Based
intervention. During this process, the ORCA utility, in most cases, automatically configures the array to a default setting based on the number of drives connected to the server. NOTE: The server may not support all the following examples. NOTE: If the boot drive is not empty or has been written to in the past, ORCA does not automatically configure the array. You must run ORCA to configure the array settings.
o Video-On-Demand Advanced Controller Settings • Provides different operating modes, enabling faster configuration or greater control over the configuration options • Remains available any time that the server is on • Displays on-screen tips for individual steps of a configuration procedure • Provides context-sensitive searchable help content • Provides diagnostic and SmartSSD Wear Gauge functionality on the Diagnostics tab ACU is now available as an embedded utility, starting with HP ProLiant G
11. Press the F10 key to confirm exiting RBSU. The server automatically reboots. Management tools Automatic Server Recovery ASR is a feature that causes the system to restart when a catastrophic operating system error occurs, such as a blue screen, ABEND (does not apply to HP ProLiant DL980 Servers), or panic. A system fail-safe timer, the ASR timer, starts when the System Management driver, also known as the Health Driver, is loaded.
• Access advanced troubleshooting features through the iLO interface. For more information about iLO features (which may require an iLO Advanced Pack or iLO Advanced for BladeSystem license), see the iLO documentation on the Documentation CD or on the HP website (http://www.hp.com/go/ilo). USB support HP provides both standard USB 2.0 support and legacy USB 2.0 support. Standard support is provided by the OS through the appropriate USB device drivers.
o For NetWare: IML Viewer (does not apply to HP ProLiant DL980 Servers) o For Windows®: IML Viewer o For Linux: IML Viewer Application • From within the iLO user interface • From within HP Insight Diagnostics For more information, see the Management CD or DVD in the HP Insight Foundation suite for ProLiant.
IMPORTANT: Always perform a backup before installing or updating device drivers. Operating System Version Support For information about specific versions of a supported operating system, refer to the operating system support matrix (http://www.hp.com/go/supportos). HP Smart Update Manager The HP Smart Update Manager provides intelligent and flexible firmware and software deployment.
Troubleshooting Troubleshooting resources for previous HP ProLiant server models The HP ProLiant Servers Troubleshooting Guide provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, error message interpretation, issue resolution, and software maintenance on HP ProLiant servers and server blade models prior to Gen8. This guide includes problem-specific flowcharts to help you navigate complex troubleshooting processes.
System battery replacement If the server no longer automatically displays the correct date and time, you might have to replace the battery that provides power to the real-time clock. WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce the risk of personal injury: • • • • 1. Do not attempt to recharge the battery.
7. Remove the battery. To replace the component, reverse the removal procedure. For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider.
Regulatory information Safety and regulatory compliance For safety, environmental, and regulatory information, see Safety and Compliance Information for Server, Storage, Power, Networking, and Rack Products, available at the HP website (http://www.hp.com/support/Safety-Compliance-EnterpriseProducts). Belarus Kazakhstan Russia marking Manufacturer Hewlett-Packard Company, Address: 3000 Hanover Street, Palo Alto, California 94304, U.S.
Valid date formats include the following: • YWW, where Y indicates the year counting from within each new decade, with 2000 as the starting point. For example, 238: 2 for 2002 and 38 for the week of September 9. In addition, 2010 is indicated by 0, 2011 by 1, 2012 by 2, 2013 by 3, and so forth. • YYWW, where YY indicates the year, using a base year of 2000. For example, 0238: 02 for 2002 and 38 for the week of September 9.
Electrostatic discharge Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device. To prevent electrostatic damage: • Avoid hand contact by transporting and storing products in static-safe containers.
Specifications Environmental specifications Specification Value Temperature range* Operating 10° C to 35° C (50° F to 95° F) Nonoperating -30° C to 60° C (-22° F to 140° F) Relative humidity (noncondensing) Operating, maximum wet bulb 10% to 90% temperature of 28°C (82.4°F) Nonoperating, maximum wet 5% to 95% bulb temperature of 38.7°C (101.7°F) * All temperature ratings shown are for sea level. An altitude derating of 1° C per 304.8 m (1.8° F per 1,000 ft) to 3048 m (10,000 ft) is applicable.
Efficiency No less than 82% at 100% load No less than 85% at 50% load No less than 82% at 20% load Power supply output Rated output power 300 W Specifications 61
Support and other resources Before you contact HP Be sure to have the following information available before you call HP: • Active Health System log (HP ProLiant Gen8 or later products) Download and have available an Active Health System log for 3 days before the failure was detected. For more information, see the HP iLO 4 User Guide or HP Intelligent Provisioning User Guide on the HP website (http://www.hp.com/go/ilo/docs).
providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts: • Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service. • Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair.
Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus d'informations sur ce programme en Amérique du Nord, consultez le site Web HP (http://www.hp.com/go/selfrepair). Riparazione da parte del cliente Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente dal cliente (CSR, Customer Self Repair).
HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet. CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert. Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen Aufpreis verfügbar.
sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio. Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite la página web de HP siguiente (http://www.hp.com/go/selfrepair).
Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto. OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça.
Support and other resources 68
Support and other resources 69
Acronyms and abbreviations ABEND abnormal end ACU Array Configuration Utility AMP Advanced Memory Protection ASR Automatic Server Recovery CSR Customer Self Repair DDR double data rate EAC EuroAsian Economic Commission EMI electromagnetic interference HP SIM HP Systems Insight Manager HP SUM HP Smart Update Manager IEC International Electrotechnical Commission iLO Integrated Lights-Out Acronyms and abbreviations 70
IML Integrated Management Log IRS Insight Remote Support ISO International Organization for Standardization LFF large form factor LOM Lights-Out Management LRDIMM load reduced dual in-line memory module LV DIMM low-voltage DIMM NMI nonmaskable interrupt NVRAM nonvolatile memory OA Onboard Administrator ORCA Option ROM Configuration for Arrays PCIe Peripheral Component Interconnect Express PDU power distribution unit POST Power-On Self Test Acronyms and abbreviations 71
PSU power supply unit PXE preboot execution environment RBSU ROM-Based Setup Utility RDIMM registered dual in-line memory module RDP Rapid Deployment Pack RoHS Restriction of Hazardous Substances SAS serial attached SCSI SATA serial ATA SFF small form factor TMRA recommended ambient operating temperature UDIMM unregistered dual in-line memory module USB universal serial bus VCA Version Control Agent VCRM Version Control Repository Manager Acronyms and abbreviations 72
Documentation feedback HP is committed to providing documentation that meets your needs. To help us improve the documentation, send any errors, suggestions, or comments to Documentation Feedback (mailto:docsfeedback@hp.com). Include the document title and part number, version number, or the URL when submitting your feedback.
Index A D access panel 12, 14 ambient temperature sensor, cabling 45 Array Configuration Utility (ACU) 48 authorized reseller 62 auto-configuration process 47 Automatic Server Recovery (ASR) 50 Declaration of Conformity 57, 58 diagnostic tools 47, 50, 51 dimensions and weight 60 DIMM identification 36 DIMM population guidelines 38 DIMM slot locations 9 DIMMs 37 DIMMs, installing 38 DIMMs, single- and dual-rank 37 drive cabling 43 drive enablement option 20, 24 drive guidelines 20 drivers 52 drives, insta
health driver 50 health LED 6 help resources 62 HP Insight Diagnostics 51 HP Insight Diagnostics survey functionality 51 HP Insight Remote Support software 52 HP Smart Update Manager overview 53 HP technical support 62 I iLO (Integrated Lights-Out) 50 IML (Integrated Management Log) 51 Insight Diagnostics 51, 52 installation services 16 installation, server options 18, 20 installing hardware 20 Integrated Lights-Out (iLO) 50 Integrated Management Log (IML) 51 K Kensington security slot 7 L LED, system po
system fan cabling 45 system maintenance switch 10 T Taiwan battery recycling notice 57 technical support 62 telephone numbers 62 temperature requirements 17 troubleshooting 54 troubleshooting resources 54 U UDIMM configuration 37 USB support 51 utilities 47 utilities, deployment 47 V ventilation 16 W warranty information 58 website, HP 62 weight 60 Index 76
