HP ProLiant BL680c G7 Server Blade User Guide Abstract This document is for the person who installs, administers, and troubleshoots servers and storage systems. HP assumes you are qualified in the servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels.
© Copyright 2010, 2011 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft, Windows, and Windows Server are U.S.
Contents Component identification ............................................................................................................... 7 Front panel components and LEDs .................................................................................................................. 7 SAS and SATA hard drive LEDs ..................................................................................................................... 8 SAS and SATA hard drive LED combinations .........................
DIMM installation guidelines ............................................................................................................. 49 Memory subsystem architecture ......................................................................................................... 50 Hemisphere mode ............................................................................................................................ 52 Memory performance optimization .......................................................
Integrated Management Log .............................................................................................................. 88 Remote support and analysis tools ............................................................................................................... 89 HP Insight Remote Support software ................................................................................................... 89 Keeping the system current ..........................................................
Canadian notices ........................................................................................................................... 116 Japanese notices ............................................................................................................................ 117 Taiwan notices ............................................................................................................................... 117 Electrostatic discharge .................................................
Component identification Front panel components and LEDs Item Description 1 Local I/O connector 2 UID LED 3 Health LED 4 Flex 1 LED 5 Flex 2 LED 6 Flex 3 LED 7 Flex 4 LED 8 Flex 5 LED 9 Flex 6 LED 10 Power On/Standby button and system power LED 11 Hard drive bay 1 12 Hard drive bay 2 13 Server release lever button 14 Server release lever 15 Hard drive bay 4 16 Hard drive bay 3 Component identification 7
SAS and SATA hard drive LEDs Item Description 1 Fault/UID LED (amber/blue) 2 Online LED (green) SAS and SATA hard drive LED combinations Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation On, off, or flashing Alternating amber and blue The drive has failed, or a predictive failure alert has been received for this drive; it also has been selected by a management application.
Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation Off Steadily amber A critical fault condition has been identified for this drive, and the controller has placed it offline. Replace the drive as soon as possible. Off Amber, flashing regularly (1 Hz) A predictive failure alert has been received for this drive. Replace the drive as soon as possible. Off Off The drive is offline, a spare, or not configured as part of an array.
Item Description 15 Processor 1 16 System battery 17 SAS/SATA backplane power connector 18 Processor 2 The symbols correspond to the symbols located on the interconnect bays. For more information, see the HP ProLiant BL680c G7 Server Blade Installation Instructions that ship with the server blade.
System maintenance switch The system maintenance switch (SW1) is an eight-position switch that is used for system configuration. The default position for all eight positions is Off. Position Description Function S1 iLO 3 security Off = iLO 3 security is enabled. On = iLO 3 security is disabled. S2 Configuration lock Off = System configuration can be changed. On = System configuration is locked.
10. Repeat steps 5 and 6. IMPORTANT: When the server blade boots after NVRAM is cleared, a delay of up to 2 minutes is normal. During this delay, the system appears non-functional. Do not attempt any procedures during the delay. Accessing the redundant ROM If the system ROM is corrupted, the system automatically switches to the redundant ROM in most cases. If the system does not automatically switch to the redundant ROM, perform the following steps: 1. Power down the server blade (on page 16). 2.
Item Description 3 Enclosure connectors (2) 4 Embedded FlexFabric adapter 5 Mezzanine connector 5 (Type I only) 6 Mezzanine connector 7 (Type I or II) 7 B-side system board connector DIMM slot locations (A-side) DIMM slots are numbered sequentially (1 through 16) for each processor. The supported AMP modes use the letter assignments for population guidelines.
DIMM slot locations (B-side) DIMM slots are numbered sequentially (1 through 16) for each processor. The supported AMP modes use the letter assignments for population guidelines.
Item Connector Description 1 Server blade For connecting to the SUV connector on the server blade front panel 2 Video For connecting a video monitor 3 USB For connecting up to two USB devices 4 Serial For trained personnel to connect a null modem serial cable and perform advanced diagnostic procedures Component identification 15
Operations Power up the server blade The Onboard Administrator initiates an automatic power-up sequence when the server blade is installed. If the default setting is changed, use one of the following methods to power up the server blade: • Use a virtual power button selection through iLO 3. • Press and release the Power On/Standby button. When the server blade goes from the standby mode to the full power mode, the system power LED changes from amber to green.
a. Select the Enclosure Information tab, and then select the Overall checkbox in the Device Bays item. b. Initiate a shutdown from the Virtual Power menu: — Select Momentary Press to initiate a controlled shutdown of applications and the OS. — Select Press and Hold to initiate an emergency shutdown of applications and the OS. IMPORTANT: When the server blade is in standby mode, auxiliary power is still being provided. To remove all power from the server blade, remove the server blade from the enclosure.
Remove the access panel (A-side) To remove the component: 1. Power down the server blade (on page 16). 2. Remove the server blade (on page 17). 3. Place the server blade on a flat, level surface with the correct side of the server blade facing up. To determine the correct side, see the label attached to the access panel. 4. Press the access panel release button, and then slide the access panel to the rear. 5. Remove the access panel.
3. Remove the hard drive. To replace the component, reverse the removal procedure. Remove the left DIMM baffle To remove the component: 1. Power down the server blade (on page 16). 2. Remove the server blade (on page 17). 3. Place the server blade on a flat, level surface with the correct side of the server blade facing up. To determine the correct side, see the label attached to the access panel. 4. Remove the access panel (A-side) (on page 18). 5.
7. Unroute the SAS/SATA cable. 8. Remove the left DIMM baffle. Remove the right DIMM baffle To remove the component: 1. Power down the server blade (on page 16). 2. Remove the server blade (on page 17). 3. Place the server blade on a flat, level surface with the correct side of the server blade facing up. To determine the correct side, see the label attached to the access panel. 4. Remove the access panel (B-side) (on page 18). 5. If installed, remove the battery pack (on page 24).
6. Remove the right DIMM baffle. Remove the front panel/hard drive cage assembly (A-side) To remove the component: 1. Power down the server blade (on page 16). 2. Remove the server blade (on page 17). 3. Place the server blade on a flat, level surface with the correct side of the server blade facing up. To determine the correct side, see the label attached to the access panel. 4. Remove the access panel (A-side) (on page 18). 5.
7. Remove the front panel/hard drive cage assembly. Remove the front panel/hard drive cage assembly (B-side) To remove the component: 1. Power down the server blade (on page 16). 2. Remove the server blade (on page 17). 3. Place the server blade on a flat, level surface with the correct side of the server blade facing up. To determine the correct side, see the label attached to the access panel. 4. Remove the access panel (B-side) (on page 18). 5.
7. Remove the front panel/hard drive cage assembly. Remove the interposer board To remove the component: 1. Power down the server blade (on page 16). 2. Remove the server blade (on page 17). 3. Place the server blade on a flat, level surface with the B-side of the server blade facing up. To determine which side is the B-side, see the label attached to the access panel. 4. Remove the access panel (B-side) (on page 18). 5. Loosen the thumbscrews.
6. Remove the interposer board. To install the interposer board, reverse the removal procedure. Remove the battery pack CAUTION: To prevent a server blade malfunction or damage to the equipment, do not add or remove the battery pack while an array capacity expansion, RAID level migration, or stripe size migration is in progress. CAUTION: After the server blade is powered down, wait 15 seconds and then check the amber LED before unplugging the cable from the cache module.
3. Place the server blade on a flat, level surface with the A-side of the server blade facing up. To determine which side is the A-side, see the label attached to the access panel. 4. Remove the access panel (A-side) (on page 18). 5. Do one of the following: o Remove the battery pack from the left DIMM baffle. o Remove the battery pack from the right DIMM baffle.
Setup Overview Installation of a server blade requires the following steps: 1. Install and configure an HP BladeSystem c-Class enclosure. 2. Install any server blade options. 3. Install interconnect modules in the enclosure. 4. Connect the interconnect modules to the network. 5. Install a server blade. 6. Complete the server blade configuration. Installing an HP BladeSystem c-Class enclosure Before performing any server blade-specific procedures, install an HP BladeSystem c-Class enclosure.
1. Remove the device bay blank. 2. Remove the three adjacent blanks. Removing a c7000 device bay divider 1. Slide the device bay shelf locking tab to the left to open it.
2. Push the device bay shelf back until it stops, lift the right side slightly to disengage the two tabs from the divider wall, and then rotate the right edge downward (clockwise). 3. Lift the left side of the device bay shelf to disengage the three tabs from the divider wall, and then remove it from the enclosure.
Removing a c3000 device bay mini-divider or device bay divider 1. Slide the locking tab down. 2. Remove the mini-divider or divider: o c3000 mini-divider: Push the divider toward the back of the enclosure until the divider drops out of the chassis. o c3000 divider: a. Push the divider toward the back of the enclosure until it stops. b. Slide the divider to the left to disengage the tabs from the wall. c. Rotate the divider clockwise.
d. Remove the divider from the enclosure. Installing interconnect modules For specific steps to install interconnect modules, see the documentation that ships with the interconnect module.
• HP BladeSystem c3000 Enclosure To support network connections for specific signals, install an interconnect module in the bay corresponding to the embedded adapter or mezzanine signals.
Dedicated dual-port Ethernet mezzanine † For detailed port mapping information, see the HP BladeSystem enclosure installation poster or the HP BladeSystem enclosure setup and installation guide on the HP website (http://www.hp.com/go/bladesystem/documentation). Connecting to the network To connect the HP BladeSystem to a network, each enclosure must be configured with network interconnect devices to manage signals between the server blades and the external network.
2. Prepare the server blade for installation. 3. Install the server blade. Completing the configuration To complete the server blade and HP BladeSystem configuration, see the overview card that ships with the enclosure.
Hardware options installation Introduction If more than one option is being installed, read the installation instructions for all the hardware options and identify similar steps to streamline the installation process. WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, properly ground the server before beginning any installation procedure.
Installing a processor option (A-side) WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent possible server blade malfunction and damage to the equipment, multiprocessor configurations must contain processors with the same part number. CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the heatsink is removed from the processor after it has been installed.
8. Remove the heatsink blank. CAUTION: Failure to completely open the processor locking lever prevents the processor from seating during installation, leading to hardware damage. 9. Open the processor locking lever and the processor socket retaining bracket. Do not remove the processor socket cover. IMPORTANT: Be sure the processor remains inside the processor installation tool.
10. If the processor has separated from the installation tool, carefully re-insert the processor in the tool. Handle the processor by the edges only, and do not touch the bottom of the processor, especially the contact area.
11. Align the processor installation tool with the socket, and then install the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board: • Never install or remove a processor without using the processor installation tool. • Do not touch the processor socket contacts. • Do not tilt or slide the processor when lowering the processor into the socket.
12. Press the tabs on the processor installation tool to separate it from the processor, and then remove the tool. 13. Close the processor socket retaining bracket and the processor locking lever. The processor socket cover is automatically ejected. Remove the cover. CAUTION: Be sure to close the processor socket retaining bracket before closing the processor locking lever. The lever should close without resistance.
14. Remove the heatsink protective cover. CAUTION: Orient the heatsink as indicated in the procedure. Otherwise, you cannot install the hard drive cage. CAUTION: When tightening the heatsink screws, first tighten the front screw four to five turns, tighten the back screw completely, and then finish tightening the front screw. 15. Orient and install the heatsink as shown in the illustration. 16. Install the front panel/hard drive cage assembly (A-side). 17. Install the access panel (A-side). 18.
Installing a processor option (B-side) WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent possible server blade malfunction and damage to the equipment, multiprocessor configurations must contain processors with the same part number. CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the heatsink is removed from the processor after it has been installed.
8. Remove the heatsink blank. CAUTION: Failure to completely open the processor locking lever prevents the processor from seating during installation, leading to hardware damage. 9. Open the processor locking lever and the processor socket retaining bracket. Do not remove the processor socket cover. IMPORTANT: Be sure the processor remains inside the processor installation tool.
10. If the processor has separated from the installation tool, carefully re-insert the processor in the tool. Handle the processor by the edges only, and do not touch the bottom of the processor, especially the contact area.
11. Align the processor installation tool with the socket, and then install the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To avoid damage to the system board: • Never install or remove a processor without using the processor installation tool. • Do not touch the processor socket contacts. • Do not tilt or slide the processor when lowering the processor into the socket.
12. Press the tabs on the processor installation tool to separate it from the processor, and then remove the tool. 13. Close the processor socket retaining bracket and the processor locking lever. The processor socket cover is automatically ejected. Remove the cover. CAUTION: Be sure to close the processor socket retaining bracket before closing the processor locking lever. The lever should close without resistance.
14. Remove the heatsink protective cover. CAUTION: Orient the heatsink as indicated in the procedure. Otherwise, you cannot install the hard drive cage. CAUTION: When tightening the heatsink screws, first tighten the front screw four to five turns, tighten the back screw completely, and then finish tightening the front screw. 15. Orient and install the heatsink as shown in the illustration. 16. Install the front panel/hard drive cage assembly (B-side). 17. Install the access panel (B-side). 18.
Memory option To expand server memory, install DDR3 RDIMMs. The server blade supports dual-rank and quad-rank DIMMs. Server blades using Intel® Xeon® E7 family processors support up to 2 TB of memory using 64 32-GB DIMMs (16 DIMMs per processor). Server blades using Intel® Xeon® 7500 series processors support up to 1 TB of memory using 64 16-GB DIMMs (16 DIMMs per processor).
DIMMs save up to 15 to 20 percent per DIMM compared to using the standard 1.5V DIMMs. This savings is made possible by the Model 7510 Intel® SMB included on the HP ProLiant BL680c G7 Server Blade model that supports the Intel® Xeon® E7 family processors. LV DIMMs are not supported on the HP ProLiant BL680c G7 Server Blade that uses the Intel Xeon 6500 and 7500 series processors.
Item Description Definition 5 Memory speed 10600 = 1333-MHz 8500 = 1066-MHz 6 DIMM type R = RDIMM (registered) E = UDIMM (unbuffered with ECC) For the latest supported memory information, see the QuickSpecs on the HP website (http://www.hp.com). DIMM installation guidelines Each supported processor contains two memory controllers per processor. Each memory controller can support up to eight DDR3 1.5V RDIMMs and 1.35V LV DIMMs.
DIMM pairs (4A/5A, 12B/16B, 2C/7C, and 10D/14D), as long as they are installed at the end point of the DDR3 channel. AMP modes Advanced ECC, DDDC, HP Memory Quarantine, Online Spare, and Mirrored Memory have further requirements beyond the ones listed here.
Channel Slot Slot number 5 B F 12 11 6 D H 10 9 7 B F 16 15 8 D H 14 13 Memory architecture for processors 2 and 4 Channel Slot Slot number 1 B F 16 15 2 D H 14 13 3 B F 12 11 4 D H 10 9 5 A E 5 6 6 C G 7 8 7 A E 4 3 8 C G 2 1 Hardware options installation 51
Hemisphere mode The Intel® Xeon® E7 family and 7500 series processor architectures incorporate Hemisphere mode, a high-performance interleaving technology. Hemisphere mode combines the tracking resources of both memory controllers within each processor for a more aggressive cache line pipelining. Hemisphere mode is enabled when processors in the system have identical DIMM populations behind both of their memory controllers.
The following illustration shows examples of Hemisphere mode and non-Hemisphere mode populations. The two non-Hemisphere examples show the following: • Each memory controller within a processor must have memory installed. • The DIMM configurations of each memory controller of a processor must be identical. Memory performance optimization The HP ProLiant BL680c G7 Server Blade supports up to 64 DIMMs installed on four multi-core processors.
• The best performance is obtained when all installed processors are enabled for Hemisphere mode. Hemisphere mode is optimum when four or eight DIMMs are installed per memory controller. Hemisphere mode can be achieved with two or six DIMMs per memory controller, but this configuration is not optimal for Hemisphere mode. • Maximum throughput is achieved when all DIMM slots are fully populated with the maximum number of eight quad-rank DIMMs per memory controller.
• Online Spare memory mode provides protection against persistent DRAM failure. Rank-sparing is more efficient than DIMM-sparing since only a portion of a DIMM is set aside for memory protection. For more information, see "Online Spare memory population guidelines (on page 56)." • Mirrored Memory mode provides the maximum protection against failed DIMMs. Uncorrectable errors in the DIMMs of one memory controller are corrected by the DIMMs in the mirrored memory controller.
HP Memory Quarantine The server blade is HP Memory Quarantine ready. The server blade will support this feature with a future planned firmware upgrade. The operating system must support this mode. HP Memory Quarantine increases the system availability by enabling the server and the operating system to work together to enable a server to recover from uncorrectable memory errors that would have otherwise caused a system crash. HP Memory Quarantine isolates the bad memory location before it affects other data.
Mirrored Memory population guidelines Errors that are not corrected by ECC, SDDC, or DDDC cannot be corrected by Online Spare memory. By providing added redundancy in the memory sub-system, Mirrored Memory provides the greatest protection against memory failure beyond ECC, SDDC, DDDC, and Online Spare memory. In Mirrored Memory mode, each Lockstep DIMM pair of a memory controller has a mirrored DIMM pair on the other memory controller of the same processor.
7. Install the DIMM. 8. Do one of the following: o Install the right DIMM baffle. o Install the left DIMM baffle. 9. Install the access panel (A-side). 10. Install the server blade ("Installing a server blade" on page 32). 11. Power up the server blade (on page 16). Installing DIMMs (B-side) To install the component: 1. Power down the server blade (on page 16). 2. Remove the server blade (on page 17). 3.
7. Install the DIMM. 8. Do one of the following: o Install the right DIMM baffle. o Install the left DIMM baffle. 9. Install the access panel (B-side). 10. Install the server blade ("Installing a server blade" on page 32). 11. Power up the server blade (on page 16). Hot-plug SAS or SATA hard drive option IMPORTANT: To avoid improper operation, install only hot-plug hard drives in this server blade.
1. Remove the hard drive blank. 2. Prepare the hard drive.
3. Install the hard drive. 4. Determine the status of the hard drive from the hot-plug hard drive LEDs ("SAS and SATA hard drive LEDs" on page 8). 5. Resume normal server blade operations. Mezzanine card option Optional mezzanine cards provide additional network connectivity or provide Fibre Channel support. • The A-side of the server blade contains mezzanine connectors 1, 2, and 3. For A-side mezzanine card locations, see "System board components (A-side) (on page 9).
CAUTION: Always wear an antistatic wrist strap when working inside the server. To install the component: 1. Power down the server blade (on page 16). 2. Remove the server blade (on page 17). 3. Place the server blade on a flat, level surface with the correct side of the server blade facing up. To determine the correct side, see the label attached to the access panel. 4. Remove the access panel (A-side). 5. Remove the mezzanine connector cover. 6.
7. Install the mezzanine card. Press down on the connector to seat the card. 8. Install the access panel (A-side). 9. Install the server blade ("Installing a server blade" on page 32). 10. Power up the server blade (on page 16). Installing a mezzanine card option (B-side) WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: Always wear an antistatic wrist strap when working inside the server.
6. Remove the mezzanine connector cover. 7. Align the mezzanine connector on the optional mezzanine card with the mezzanine connector on the interposer board. CAUTION: To prevent damage to the server blade, apply pressure over the mezzanine connector when installing the mezzanine card. Do not apply pressure to the edges of the card. 8. Install the mezzanine card. Press down on the connector to seat the card. 9. Install the interposer board. 10. Install the access panel (B-side). 11.
Controller options The server blade ships with an embedded Smart Array P410i Controller. RAID 0 and 1 are supported and do not require a cache module to be installed. RAID 1+0, 5, and 6 require a cache module. In addition, RAID 6 is supported by adding a cache option and the SmartArray Advanced Pack. Upgrade options exist for the integrated array controller. For a list of supported options, see the QuickSpecs on the HP website (http://www.hp.com/support).
Installing a cache module CAUTION: To prevent a server blade malfunction or damage to the equipment, do not add or remove the battery pack while an array capacity expansion, RAID level migration, or stripe size migration is in progress. CAUTION: After the server blade is powered down, wait 15 seconds and then check the amber LED before unplugging the cable from the cache module. If the amber LED blinks after 15 seconds, do not remove the cable from the cache module.
Installing a capacitor pack CAUTION: To prevent a server blade malfunction or damage to the equipment, do not add or remove the battery pack while an array capacity expansion, RAID level migration, or stripe size migration is in progress. CAUTION: After the server blade is powered down, wait 15 seconds and then check the amber LED before unplugging the cable from the cache module. If the amber LED blinks after 15 seconds, do not remove the cable from the cache module.
HP Trusted Platform Module option Use these instructions to install and enable a TPM on a supported server blade. This procedure includes three sections: 1. Installing the Trusted Platform Module board. 2. Retaining the recovery key/password (on page 69). 3. Enabling the Trusted Platform Module (on page 70). Enabling the TPM requires accessing the ROM-Based Setup Utility (RBSU) ("HP ROM-Based Setup Utility" on page 82). For more information about RBSU, see the HP website (http://www.hp.
CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM, administrators should consider the system compromised and take appropriate measures to ensure the integrity of the system data. 5. Install the TPM board. Press down on the connector to seat the board ("System board components (A-side)" on page 9). 6.
key/password is required to enter Recovery Mode after BitLocker™ detects a possible compromise of system integrity. To help ensure maximum security, observe the following guidelines when retaining the recovery key/password: • Always store the recovery key/password in multiple locations. • Always store copies of the recovery key/password away from the server blade. • Do not save the recovery key/password on the encrypted hard drive. Enabling the Trusted Platform Module 1.
Additional TPM features The following features are supported by Intel® Xeon® E7 family processors and require a TPM to be present: • Intel AES-NI is a processor-assisted AES encryption, supported by Intel Xeon E7 family processors, that makes enabled encryption software faster and stronger, and offers better data protection. With this technology, the encryption and decryption times are greatly reduced. AES-NI is enabled by default and requires a TPM to be present.
Cabling Using the HP c-Class Blade SUV Cable The HP c-Class Blade SUV Cable enables the user to perform server blade administration, configuration, and diagnostic procedures by connecting video and USB devices directly to the server blade. For SUV cable connectors, see "HP c-Class Blade SUV Cable (on page 14).
4. Connect a USB keyboard to the second USB connector. Item Description 1 Monitor 2 USB mouse 3 HP c-Class Blade SUV Cable 4 Video connector 5 Server blade 6 USB keyboard Accessing local media devices Use the following configuration when configuring a server blade or loading software updates and patches from a USB CD/DVD-ROM or a USB diskette. 1. Connect the SUV cable to the server blade. 2. Connect the video connector to a monitor. 3. Connect a USB hub to one USB connector. 4.
Item Description 1 Monitor 2 USB mouse 3 HP c-Class Blade SUV Cable 4 Server blade 5 USB hub 6 USB keyboard 7 USB CD/DVD-ROM drive or diskette drive Cabling 74
Software and configuration utilities Server blade deployment tools HP BladeSystem c-Class Advanced management iLO 3 is a standard component of ProLiant c-Class server blades that provides server health and remote server blade manageability. Its features are accessed from a network client device using a supported web browser. In addition to other features, iLO 3 provides keyboard, mouse, and video (text and graphics) capability for a server blade, regardless of the state of the host OS or host server blade.
Deployment overview When a PXE-enabled target server blade boots, it obtains an IP address from a DHCP server. The target server blade obtains the name of the NBP from the appropriate boot server. Then, the target server blade uses TFTP to download the NBP from the boot server and executes the image. IMPORTANT: To connect to a network with a Pass-Thru module, always connect the Pass-Thru module to a network device that supports Gigabit speed.
• • o 64 MB of RAM o 64 MB of free hard drive space o 10-Mb/s network adapter PXE deployment server (storing boot images) o AMD Athlon™ XP processor (700 MHz or greater recommended), AMD Athlon™ 64 processor, or Intel® Pentium® III or higher processor (500 MHz recommended) o 256 MB of RAM o 10-Mb/s network adapter o CD-ROM drive Windows® repository server (Windows® or Linux deployment) o Windows® 2000 or Windows Server® 2003 OS installed o Network connection o CD-ROM drive o 1.
PXE deployment PXE enables server blades to load an image over the network from a PXE server, and then execute it in memory. The first NIC on the server blade is the default PXE boot NIC, but any of the other NC series NICs can be configured to boot PXE. For more information, see "Network-based PXE deployment (on page 75)." Actual NIC numeration depends on several factors, including the OS installed on the server blade.
• USB CD-ROM (on page 79) iLO virtual CD-ROM To deploy with a boot CD: 1. Do one of the following: o Insert the boot CD into the client PC using the iLO 3 Remote Console. o Use iLO 3 to create an image file of the boot CD. o Copy the image of the boot CD to a location on the network or the client PC hard drive. 2. Remotely access the server blade through iLO 3. See "HP BladeSystem c-Class advanced management (on page 75)." 3. Open Integrated Remote console or Java Remote console. 4.
Before beginning the deployment process, connect the server blade to the network. NOTE: For more information about hardware and cabling configurations, see the documents that ship with the enclosure. Two methods are available for diskette image deployment: • iLO virtual floppy (on page 80) • PXE ("PXE deployment" on page 78) Creating a boot diskette The SmartStart Scripting Toolkit provides the tools and information for creating a boot diskette.
• The server blade enclosure management module firmware is up-to-date. Refer to the HP Business Support Center website (http://www.hp.com/support). • The server blade is cabled properly to a supported SAN. • SAN storage drivers are loaded. Refer to supporting white papers and the HP website (http://www.hp.com/servers/rdp). For SAN configuration information for the server blade, refer to the HP StorageWorks SAN Design Reference Guide on the HP website (http://h18000.www1.hp.
HP ROM-Based Setup Utility RBSU is a configuration utility embedded in ProLiant servers that performs a wide range of configuration activities that can include the following: • Configuring system devices and installed options • Enabling and disabling system features • Displaying system information • Selecting the primary boot controller • Configuring memory options • Language selection For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD or the HP
Drives installed Drives used RAID level 1 1 RAID 0 2 2 RAID 1 3, 4, 5, or 6 3, 4, 5, or 6 RAID 5 More than 6 0 None To change any ORCA default settings and override the auto-configuration process, press the F8 key when prompted. For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD or the HP website (http://www.hp.com/support/smartstart/documentation). Boot options Near the end of the boot process, the boot options screen is displayed.
• RAID Memory Mode—Provides protection levels similar to Mirrored Memory Mode, and it requires less memory allocation than full redundancy.
1. During the server blade startup sequence, press the F9 key to access RBSU. 2. Select the Advanced Options menu. 3. Select Service Options. 4. Select Serial Number. The following warnings appear: WARNING! WARNING! WARNING! The serial number is loaded into the system during the manufacturing process and should NOT be modified. This option should only be used by qualified service personnel. This value should always match the serial number sticker located on the chassis.
http://www.hp.com/support/dl360g6 iLO 3 Standard Blade Edition technology The iLO 3 subsystem is a standard component of selected ProLiant servers that provides server health and remote server manageability. The iLO 3 subsystem includes an intelligent microprocessor, secure memory, and a dedicated network interface. This design makes iLO 3 independent of the host server and its operating system.
NOTE: The server ships with the same version programmed on each side of the ROM. Safety and security benefits When you flash the system ROM, ROMPaq writes over the backup ROM and saves the current ROM as a backup, enabling you to switch easily to the alternate ROM version if the new ROM becomes corrupted for any reason. This feature protects the existing ROM version, even if you experience a power failure while flashing the ROM. USB support and functionality USB support HP provides both standard USB 2.
Diagnostic tools HP Insight Diagnostics HP Insight Diagnostics is a proactive server blade management tool, available in both offline and online versions, that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server blade installations, troubleshoot problems, and perform repair validation. HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS is not running. To run this utility, launch the SmartStart CD.
Remote support and analysis tools HP Insight Remote Support software HP strongly recommends that you install HP Insight Remote Support software to complete the installation or upgrade of your product and to enable enhanced delivery of your HP Warranty, HP Care Pack Service, or HP contractual support agreement.
In place of , enter the server name. For example: http://www.hp.com/support/dl360g6 (http://www.hp.com/support/dl360g6) Version control The VCRM and VCA are Web-enabled Insight Management Agents tools that HP SIM uses to facilitate and schedule software update tasks to the entire enterprise. • VCRM manages the repository for Windows and Linux PSPs as well as online firmware.
HP SUM enables system administrators to upgrade ROM images efficiently across a wide range of server blades and options.
Troubleshooting Troubleshooting resources The HP ProLiant Servers Troubleshooting Guide provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, error message interpretation, issue resolution, and software maintenance on ProLiant servers and server blades. This guide includes problem-specific flowcharts to help you navigate complex troubleshooting processes. To view the guide, select a language: • English (http://www.hp.
Important safety information Before servicing this product, read the Important Safety Information document provided with the server. Symbols on equipment The following symbols may be placed on equipment to indicate the presence of potentially hazardous conditions. This symbol indicates the presence of hazardous energy circuits or electric shock hazards. Refer all servicing to qualified personnel. WARNING: To reduce the risk of injury from electric shock hazards, do not open this enclosure.
WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that: • • • • • The leveling feet are extended to the floor. The full weight of the rack rests on the leveling feet. The stabilizing feet are attached to the rack if it is a single-rack installation. The racks are coupled together in multiple-rack installations. Only one component is extended at a time. A rack may become unstable if more than one component is extended for any reason.
o HP recommends you have access to the server documentation for server-specific information. o HP recommends you have access to the SmartStart CD for value-added software and drivers required during the troubleshooting process. Download the current version of SmartStart from the HP website (http://www.hp.com/servers/smartstart).
Always use the recommended minimum configuration above before removing any processors. If you are unable to isolate the issue with the configuration above, you will then remove all but one of the additional processors. CAUTION: Before removing or replacing any processors, be sure to follow the guidelines provided in "Performing processor procedures in the troubleshooting process (on page 95).
do not provide a troubleshooting solution, follow the diagnostic steps in "General diagnosis flowchart (on page 98)." The General diagnosis flowchart is a generic troubleshooting process to be used when the problem is not server-specific or is not easily categorized into the other flowcharts.
General diagnosis flowchart The General diagnosis flowchart provides a generic approach to troubleshooting. If you are unsure of the problem, or if the other flowcharts do not fix the problem, use the following flowchart.
Item See 4 The most recent version of a particular server blade or option firmware is available on the HP Support website (http://www.hp.com/support). 5 "General memory problems are occurring" in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or see "Troubleshooting resources (on page 92)" 6 • • 7 • • • Maintenance and service guides for p-Class server blades, located on the Documentation CD or the HP website (http://www.hp.
Server blade power-on problems flowchart Symptoms: • The server does not power on. • The system power LED is off or amber.
• The health LED is red or amber. NOTE: For the location of server LEDs and information on their statuses, refer to the server documentation.
POST problems flowchart Symptoms: • Server does not complete POST NOTE: The server has completed POST when the system attempts to access the boot device.
Item See 1 Server blade power-on problems flowchart (on page 100) 2 "POST error messages and beep codes (on page 108)" 3 "Video problems" in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or see "Troubleshooting resources (on page 92)" 4 "General memory problems are occurring" in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or see "Troubleshooting resources (on page 92)" 5 "Breaking the server down to the minimum hardware configurati
OS boot problems flowchart There are two ways to use SmartStart when diagnosing OS boot problems on a server blade: • Use iLO to remotely attach virtual devices to mount the SmartStart CD onto the server blade. • Use a local I/O cable and drive to connect to the server blade, and then restart the server blade.
Possible causes: • Corrupted OS • Hard drive subsystem problem • Incorrect boot order setting in RBSU Item See 1 HP ROM-Based Setup Utility User Guide (http://www.hp.
* See the server blade OS boot problems flowchart (on page 104) Server fault indications flowchart Symptoms: • Server boots, but a fault event is reported by Insight Management Agents • Server boots, but the internal health LED, external health LED, or component health LED is red or amber Troubleshooting 106
NOTE: For the location of server LEDs and information on their statuses, refer to the server documentation.
POST error messages and beep codes For a complete listing of error messages, refer to the "POST error messages" in the HP ProLiant Servers Troubleshooting Guide located on the Documentation CD or on the HP website (http://www.hp.com/support).
WARNING: To avoid potential problems, ALWAYS read the warnings and cautionary information in the server documentation before removing, replacing, reseating, or modifying system components.
System battery If the server blade no longer automatically displays the correct date and time, you may need to replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years. WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce the risk of personal injury: • • • • Do not attempt to recharge the battery.
Regulatory compliance notices Regulatory compliance identification numbers For the purpose of regulatory compliance certifications and identification, this product has been assigned a unique regulatory model number. The regulatory model number can be found on the product nameplate label, along with all required approval markings and information. When requesting compliance information for this product, always refer to this regulatory model number.
radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver.
This Class A digital apparatus meets all requirements of the Canadian Interference-Causing Equipment Regulations. Cet appareil numérique de la classe A respecte toutes les exigences du Règlement sur le matériel brouilleur du Canada. Class B equipment This Class B digital apparatus meets all requirements of the Canadian Interference-Causing Equipment Regulations. Cet appareil numérique de la classe B respecte toutes les exigences du Règlement sur le matériel brouilleur du Canada.
This symbol on the product or on its packaging indicates that this product must not be disposed of with your other household waste. Instead, it is your responsibility to dispose of your waste equipment by handing it over to a designated collection point for the recycling of waste electrical and electronic equipment.
Class B equipment Chinese notice Class A equipment Laser compliance This product may be provided with an optical storage device (that is, CD or DVD drive) and/or fiber optic transceiver. Each of these devices contains a laser that is classified as a Class 1 Laser Product in accordance with US FDA regulations and the IEC 60825-1. The product does not emit hazardous laser radiation. Each laser product complies with 21 CFR 1040.10 and 1040.11 except for deviations pursuant to Laser Notice No.
For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider. Taiwan battery recycling notice The Taiwan EPA requires dry battery manufacturing or importing firms in accordance with Article 15 of the Waste Disposal Act to indicate the recovery marks on the batteries used in sales, giveaway or promotion. Contact a qualified Taiwanese recycler for proper battery disposal.
Japanese notices Taiwan notices Regulatory compliance notices 117
Electrostatic discharge Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device. To prevent electrostatic damage: • Avoid hand contact by transporting and storing products in static-safe containers.
Specifications Environmental specifications Specification Value — Temperature range* Operating 10°C to 35°C (50°F to 95°F) Non-operating -30°C to 60°C (-22°F to 140°F) Relative humidity (noncondensing)** — Operating 10% to 90% @ 28°C (82.4°F) Non-operating 5% to 95% @ 38.7°C (101.7°F) Altitude† — Operating 3050 m (10,000 ft) Non-operating 9144 m (30,000 ft) * The following temperature conditions and limitations apply: - All temperature ratings shown are for sea level.
Technical support Before you contact HP Be sure to have the following information available before you call HP: • Technical support registration number (if applicable) • Product serial number • Product model name and number • Product identification number • Applicable error messages • Add-on boards or hardware • Third-party hardware or software • Operating system type and revision level HP contact information For the name of the nearest HP authorized reseller: • See the Contact HP worldwi
• Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product. NOTE: Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that an authorized service provider replace the part.
Riparazione da parte del cliente Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro di servizi o di assistenza HP) identifica il guasto come riparabile mediante un ricambio CSR, HP lo spedirà direttamente al cliente per la sostituzione.
CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert. Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen Aufpreis verfügbar. Wenn Sie Hilfe benötigen, können Sie das HP technische Support Center anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSR-Ersatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss.
Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite la página web de HP siguiente (http://www.hp.com/go/selfrepair). Customer Self Repair Veel onderdelen in HP producten zijn door de klant zelf te repareren, waardoor de reparatieduur tot een minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte onderdelen groter is.
Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto. OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça.
Technical support 126
Technical support 127
Acronyms and abbreviations ACU Array Configuration Utility AES-NI advanced encryption standard new instructions AMP Advanced Memory Protection ASR Automatic Server Recovery BBWC battery-backed write cache BMC baseboard management controller CSR Customer Self Repair DDR3 double data rate-3 ESD electrostatic discharge FBWC flash-backed write cache IEC International Electrotechnical Commission iLO 3 Integrated Lights-Out 3 Acronyms and abbreviations 128
IML Integrated Management Log KVM keyboard, video, and mouse LV DIMM Low voltage DIMM NUMA Non-Uniform Memory Architecture ORCA Option ROM Configuration for Arrays POST Power-On Self Test PSP ProLiant Support Pack PXE Preboot Execution Environment QPI QuickPath Interconnect RBSU ROM-Based Setup Utility RDIMM Registered Dual In-line Memory Module RPM Red Hat Package Manager SAS serial attached SCSI SATA serial ATA Acronyms and abbreviations 129
SD Secure Digital SDDC Single Device Data Correction SDHC Secure Digital High-Capacity SIM Systems Insight Manager SMB scalable memory buffer SMI scalable memory interconnect SUV serial, USB, video TPM trusted platform module TXT trusted execution technology UID unit identification USB universal serial bus VCA Version Control Agent Acronyms and abbreviations 130
Index A access panel 18 accessing a server blade with local KVM 71, 72 ACU (Array Configuration Utility) 83 additional information 91 Advanced ECC memory 82 Advanced ECC population guidelines 55 Advanced Memory Protection (AMP) 55 AMP (Advanced Memory Protection) 82 AMP modes 82 Array Configuration Utility (ACU) 83 ASR (Automatic Server Recovery) 84 authorized reseller 119 auto-configuration process 81 Automatic Server Recovery (ASR) 84 B Basic Input/Output System (BIOS) 82, 84 batteries, replacing 109, 11
Double Device Data Correction (DDDC) downloading files 119 drivers 74, 88 drives, installing 59 55 E electrostatic discharge 117 enabling the Trusted Platform Module 69 enabling, Trusted Platform Module (TPM) 69 enclosure, installing 26 environmental specifications 118 Erase Utility 85 error messages 107 error messages, POST 107 European Union notice 112 European Union regulatory notice 112 external USB functionality 86 F FCC (Federal Communications Commission) notice 110, 111 FCC rating label 110 featur
options 32 options installation 32, 34 ORCA (Option ROM Configuration for Arrays) OS boot problems flowchart 103 overview 26 J Japanese notice 113, 116 K Korean notices 113 P L laser compliance 114 laser devices 114 LED, health 8, 95 LEDs 7, 8 LEDs, front panel 8 LEDs, hard drive 8 LEDs, troubleshooting 91 Lights-Out network-based deployment loose connections 95 passwords 69 phone numbers 119 POST error messages 107 POST problems flowchart 101 powering down 16 powering up 16, 81 power-on problems flo
retaining the recovery key/password 69 ROM legacy USB support 86 ROM redundancy 12, 85 ROM-Based Setup Utility (RBSU) 69, 81 ROMPaq utility 84, 85 System Erase Utility 85 system maintenance switch 11 system, keeping current 88 S Taiwan battery recycling notice 115 Taiwan notice 116 technical support 119 telephone numbers 119 tool, processor 41 TPM (Trusted Platform Module) 67, 69, 70 troubleshooting 91, 95 troubleshooting flowcharts 95 troubleshooting resources 91 troubleshooting, firmware upgrade utilit
