HP ProLiant BL660c Gen8 Server Blade User Guide Abstract This document is for the person who installs, administers, and troubleshoots servers and storage systems. HP assumes you are qualified in the servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels.
© Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft® and Windows® are U.S. registered trademarks of Microsoft Corporation.
Contents Component identification ............................................................................................................... 6 Front panel components ............................................................................................................................. 6 Front panel LEDs and buttons ...................................................................................................................... 6 Drive LED definitions .........................................
Mezzanine card option ............................................................................................................................ 40 HP Trusted Platform Module option ............................................................................................................ 42 Installing the Trusted Platform Module board ..................................................................................... 43 Retaining the recovery key/password ..............................................
Declaration of conformity for products marked with the FCC logo, United States only ....................................... 65 Modifications .......................................................................................................................................... 65 Cables ................................................................................................................................................... 65 Canadian notice (Avis Canadien) .......................................
Component identification Front panel components Item Description 1 HP c-Class Blade SUV cable connector (behind the serial label pull tab) 2 Serial label pull tab 3 Drive bay 1 4 Drive bay 2 5 Server blade release lever 6 Server blade release button Front panel LEDs and buttons Item Description Status 1 Health status LED bar Solid Green = Normal (System is powered on.) Flashing Green = Power On/Standby Button service is being initialized.
Item Description 4 FlexibleLOM LED Status Green = Network linked Flashing Green = Network activity Off = No link or activity Drive LED definitions Item LED Status Definition 1 Locate Solid blue The drive is being identified by a host application. Flashing blue The drive carrier firmware is being updated or requires an update. Rotating green Drive activity Off No drive activity Solid white Do not remove the drive. Removing the drive causes one or more of the logical drives to fail.
System board components Item Description 1 HP c-Class Blade SUV cable connector 2 Processor 3 DIMM slots (8) 3 Processor socket 3 (populated) 4 Processor 1 DIMM slots (8) 5 Processor socket 1 (populated) 6 System board thumbscrew 7 System maintenance switch 8 TPM connector 9 Mezzanine assembly guide pins 10 Enclosure connector 11 Mezzanine connector 1 (Type A mezzanine only) 12 Mezzanine connector 2 (Type A or Type B mezzanine) 13 FlexibleLOM 2 connectors (2) 14 Internal USB co
Mezzanine connector definitions A PCIe x8 mezzanine connector supports x16 cards at up to x8 speeds. Item PCIe Mezzanine connector 1 x8, Type A mezzanine card only Mezzanine connector 2 x16, Type A or B mezzanine card Mezzanine connector 3 x16, Type A or B mezzanine card DIMM slot locations DIMM slots are numbered sequentially (1 through 8) for each processor. The supported AMP modes use the alpha assignments for population order and the slot numbers designate the DIMM slot ID for spare replacement.
Tool locations Item Description 1 DIMM tool 2 T-15 Torx screwdriver HP c-Class Blade SUV Cable Item Connector Description 1 Server blade For connecting to the SUV connector on the server blade front panel 2 Video For connecting a video monitor 3 USB For connecting up to two USB devices Component identification 10
Item Connector Description 4 Serial For trained personnel to connect a null modem serial cable and perform advanced diagnostic procedures Component identification 11
Operations Power up the server blade The Onboard Administrator initiates an automatic power-up sequence when the server blade is installed. If the default setting is changed, use one of the following methods to power up the server blade: • Use a virtual power button selection through iLO. • Press and release the Power On/Standby button. When the server blade goes from the standby mode to the full power mode, the system power LED changes from amber to solid green.
o poweroff server [bay number] force This form of the command forces the server blade to enter standby mode without properly exiting applications and the OS. If an application stops responding, this method forces a shutdown. • Use the Onboard Administrator GUI to initiate a shutdown: a. Select the Enclosure Information tab. b. In the Device Bays item, select the Overall checkbox. c.
Remove the access panel To remove the component: 1. Power down the server blade (on page 12). 2. Remove the server blade (on page 13). 3. Press the access panel release button. 4. Slide the access panel towards the rear of the server blade, and then lift to remove the panel. Remove a drive 1. Back up all server blade data on the drive. 2. Remove the drive.
5. Remove the center DIMM baffle. Remove the left DIMM baffle To remove the component: 1. Power down the server blade (on page 12). 2. Remove the server blade (on page 13). 3. Remove the access panel (on page 14). 4. Disconnect any cables that may be routed across the DIMM baffle. 5. Remove the left DIMM baffle.
Remove the right DIMM baffle To remove the component: 1. Power down the server blade (on page 12). 2. Remove the server blade (on page 13). 3. Remove the access panel (on page 14). 4. Disconnect any cables that may be routed across the DIMM baffle. 5. Remove the right DIMM baffle. Remove the front panel/drive cage assembly To remove the component: 1. Power down the server blade (on page 12). 2. Remove the server blade (on page 13). 3. Remove the access panel (on page 14). 4.
8. Extend the serial label pull tab. 9. Remove the front panel/drive cage assembly. Remove the FBWC capacitor pack To remove the component: 1. Power down the server blade (on page 12). 2. Remove the server blade (on page 13). 3. Remove the access panel (on page 14). 4. Locate the capacitor pack on the drive cage. For more information, see "FBWC capacitor pack cabling (on page 46).
5. Remove the capacitor pack from the carrier.
Setup Installing an HP BladeSystem c-Class enclosure Before performing any server blade-specific procedures, install an HP BladeSystem c-Class enclosure. The most current documentation for server blades and other HP BladeSystem components is available at the HP website (http://www.hp.com/go/bladesystem/documentation). Documentation is also available in the following locations: • Documentation CD that ships with the enclosure • HP website (http://www.hp.
Removing a c7000 device bay divider 1. Slide the device bay shelf locking tab to the left to open it. 2. Push the device bay shelf back until it stops, lift the right side slightly to disengage the two tabs from the divider wall, and then rotate the right edge downward (clockwise).
3. Lift the left side of the device bay shelf to disengage the three tabs from the divider wall, and then remove it from the enclosure. Removing a c3000 device bay mini-divider or device bay divider 1. Slide the locking tab down. 2.
Push the divider toward the back of the enclosure until the divider drops out of the chassis. o c3000 divider: a. Push the divider toward the back of the enclosure until it stops. b. Slide the divider to the left to disengage the tabs from the wall. c. Rotate the divider clockwise. d. Remove the divider from the enclosure. Installing interconnect modules For specific steps to install interconnect modules, see the documentation that ships with the interconnect module.
Interconnect bay numbering and device mapping • HP BladeSystem c7000 Enclosure • HP BladeSystem c3000 Enclosure To support network connections for specific signals, install an interconnect module in the bay corresponding to the embedded adapter or mezzanine signals.
Server blade signal c7000 interconnect bay c3000 interconnect bay Mezzanine 3 5 and 6** 3 and 4 7 and 8* 3 and 4 Interconnect bay labels * Dual port mezzanine card ports and four-port mezzanine card ports 1 and 2 ** Four-port mezzanine card ports 3 and 4 For detailed port mapping information, see the HP BladeSystem enclosure installation poster or the HP BladeSystem enclosure setup and installation guide on the HP website (http://www.hp.com/go/bladesystem/documentation).
2. Install the server blade. Assembling a full height blank CAUTION: To prevent improper cooling and thermal damage, do not operate the server blade or the enclosure unless all drive and device bays are populated with either a component or a blank. 1. Obtain the coupler plate: o If you are using a device bay blank that came with the enclosure, the coupler plate can be found with the contents of the full-height device shipping box.
2. Fit the coupler plate into the slots on top of the blank, and then slide the coupler plate back until it snaps into place. 3. Fit the slots on the bottom of the second blank on to the tabs on the coupler plate, and then slide the second blank forward until it snaps in place. 4. Install the full-height blank into the device bay. Completing the configuration To complete the server blade and HP BladeSystem configuration, see the overview card that ships with the enclosure.
Hardware options installation Introduction If more than one option is being installed, read the installation instructions for all the hardware options and identify similar steps to streamline the installation process. WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, properly ground the server before beginning any installation procedure.
2. Prepare the drive. 3. Install the drive. 4. Determine the status of the drive from the drive LED definitions (on page 7). Processor option WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent possible server blade malfunction and damage to the equipment, multiprocessor configurations must contain processors with the same part number.
3. Remove the server blade (on page 13). 4. Remove the access panel (on page 14). 5. Remove all drives ("Remove a drive" on page 14). 6. Remove all DIMM baffles ("Removing DIMM baffles" on page 14). 7. Remove all FBWC capacitor packs ("FBWC capacitor pack options" on page 39). 8. Remove the front panel/drive cage assembly (on page 16). 9. Remove the heatsink blank. Retain the heatsink blank for future use. 10.
11. Remove the clear processor socket cover. Retain the processor socket cover for future use. 12. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
CAUTION: Do not press down on the processor. Pressing down on the processor may cause damage to the processor socket and the system board. Press only in the area indicated on the processor retaining bracket. 14. Press and hold the processor retaining bracket in place, and then close each processor locking lever. Press only in the area indicated on the processor retaining bracket. 15. Remove the thermal interface protective cover from the heatsink.
CAUTION: Heatsink retaining screws should be tightened in diagonally opposite pairs (in an "X" pattern). 16. Install the heatsink. 17. Install all DIMM baffles. 18. Install the front panel/drive cage assembly. 19. Install all FBWC capacitor packs ("FBWC capacitor pack options" on page 39). 20. Install all drives ("Drive option" on page 27). 21. Install the access panel. Memory options IMPORTANT: This server blade does not support mixing LRDIMMs or RDIMMs.
Speed, voltage, and capacity DIMM type DIMM rank DIMM capacity Native speed (MT/s) Voltage RDIMM Single-rank 4 GB 1333 LV RDIMM Single-rank 4 GB 1600 STD RDIMM Single-rank 8 GB 1600 STD RDIMM Dual-rank 8 GB 1333 LV RDIMM Dual-rank 8 GB 1600 STD RDIMM Dual-rank 16 GB 1333 LV RDIMM Dual-rank 16 GB 1600 STD LRDIMM Quad-rank 32 GB 1333 LV Memory operating data rate is dependent on processor capability, DIMM capability, operating voltage, and the number of DIMMs insta
Channel Slot Slot number 3 C G 8 7 4 D H 6 5 For the location of the slot numbers, see "DIMM slot locations (on page 9)." This multi-channel architecture provides enhanced performance in Advanced ECC mode. This architecture also enables the Lockstep memory mode. DIMM slots in this server are identified by number and by letter. Letters identify the population order. Slot numbers indicate the DIMM slot ID for spare replacement.
DIMM identification To determine DIMM characteristics, use the label attached to the DIMM and the following illustration and table. Item Description Definition 1 Size — 2 Rank 1R = Single-rank 2R = Dual-rank 4R = Quad-rank 3 Data width x4 = 4-bit x8 = 8-bit 4 Voltage rating L = Low voltage (1.35v) U = Ultra low voltage (1.
is degrading. This allows DIMMs that have a higher probability of receiving an uncorrectable memory error (which would result in system downtime) to be removed from operation. Advanced Memory Protection options are configured in RBSU. If the requested AMP mode is not supported by the installed DIMM configuration, the server blade boots in Advanced ECC mode. For more information, see "HP ROM-Based Setup Utility (on page 55).
General DIMM slot population guidelines Observe the following guidelines for all AMP modes: • Install DIMMs only if the corresponding processor is installed. • Balance the DIMMs across the installed processors. • White DIMM slots denote the first slot of a channel (Ch 1-A, Ch 2-B, Ch 3-C, Ch 4-D). • Do not mix RDIMMs and LRDIMMs.
• In multi-processor configurations, each processor must have a valid Lockstep Memory configuration. • In multi-processor configurations, each processor may have a different valid Lockstep Memory configuration.
FBWC capacitor pack options To install the component: 1. Power down the server blade (on page 12). 2. Remove the server blade (on page 13). 3. Remove the access panel (on page 14). 4. Install the FBWC capacitor pack in one of the three capacitor pack carriers. 5. Route the FBWC capacitor pack cable. The DIMM baffles may be removed to route the cables, if necessary.
6. o Routing and connecting the FBWC capacitor pack cable to the cache module option o Routing and connecting the FBWC capacitor pack cable to the mezzanine 3 connector option Install the access panel. Mezzanine card option Optional mezzanine cards are classified as Type A mezzanine cards and Type B mezzanine cards. The type of the mezzanine card determines where it can be installed in the server blade.
For mezzanine card mapping, see the HP ProLiant BL660c Gen8 Server Blade Installation Instructions or see "Interconnect bay numbering and device mapping (on page 23)." To install the component: 1. Power down the server blade (on page 12). 2. Remove the server blade (on page 13). 3. Remove the access panel (on page 14). 4. Remove the mezzanine assembly from the server blade. 5. Align the mezzanine card with the guide pins on the mezzanine assembly.
6. Install the mezzanine card in the mezzanine assembly, and then tighten the mezzanine card screws to secure the card to the mezzanine assembly. 7. Align the mezzanine assembly with the guide pins on the system board, and then install the mezzanine assembly on the system board. 8. Press down firmly on the mezzanine assembly handles, and then close the mezzanine assembly latch. 9. Install the access panel. 10. Install the server blade ("Installing a server blade" on page 24).
3. Enabling the Trusted Platform Module (on page 45). Enabling the TPM requires accessing RBSU ("HP ROM-Based Setup Utility" on page 55). For more information about RBSU, see the HP website (http://www.hp.com/go/ilomgmtengine/docs). TPM installation requires the use of drive encryption technology, such as the Microsoft Windows BitLocker Drive Encryption feature. For more information on BitLocker, see the Microsoft website (http://www.microsoft.com). CAUTION: Always observe the guidelines in this document.
5. Install the TPM board. Press down on the connector to seat the board ("System board components" on page 8). 6. Install the TPM security rivet by pressing the rivet firmly into the system board. 7. Install the access panel. 8. Install the server blade ("Installing a server blade" on page 24). 9. Power up the server blade (on page 12). Retaining the recovery key/password The recovery key/password is generated during BitLocker™ setup, and can be saved and printed after BitLocker™ is enabled.
• Always store copies of the recovery key/password away from the server blade. • Do not save the recovery key/password on the encrypted hard drive. Enabling the Trusted Platform Module 1. When prompted during the start-up sequence, access RBSU by pressing the F9 key. 2. From the Main Menu, select Server Security. 3. From the Server Security Menu, select Trusted Platform Module. 4. From the Trusted Platform Module Menu, select TPM Functionality. 5.
Cabling Cabling resources Cabling configurations and requirements vary depending on the product and installed options. For more information about product features, specifications, options, configurations, and compatibility, see the QuickSpecs on the HP website (http://www.hp.com/go/productbulletin). At the website, choose the geographic region, and then locate the product by name or product category.
• FBWC capacitor pack cable to the cache module option • FBWC capacitor pack cabling to the mezzanine 3 connector option For capacitor pack and cabling instructions, see "FBWC capacitor pack options (on page 39)." Using the HP c-Class Blade SUV Cable The HP c-Class Blade SUV Cable enables the user to perform server blade administration, configuration, and diagnostic procedures by connecting video and USB devices directly to the server blade.
Connecting locally to a server blade with video and USB devices Use the SUV cable to connect a monitor and any of the following USB devices: • USB hub • USB keyboard • USB mouse • USB CD/DVD-ROM drive Numerous configurations are possible. This section offers two possible configurations. For more information, see "USB support (on page 59)." Accessing a server blade with local KVM For this configuration, a USB hub is not necessary. To connect additional devices, use a USB hub.
Accessing local media devices Use the following configuration when configuring a server blade or loading software updates and patches from a USB CD/DVD-ROM. Use a USB hub when connecting a USB CD-ROM drive to the server blade. The USB hub provides additional connections. 1. Open the serial label pull tab and connect the HP c-Class Blade SUV cable to the server blade. 2. Connect the video connector to a monitor. 3. Connect a USB hub to one USB connector. 4.
Software and configuration utilities Server mode The software and configuration utilities presented in this section operate in online mode, offline mode, or in both modes.
iLO enables and manages the Active Health System (on page 51) and also features Agentless Management. All key internal subsystems are monitored by iLO. SNMP alerts are sent directly by iLO regardless of the host operating system or even if no host operating system is installed. HP Insight Remote Support software (on page 54) is also available in HP iLO with no operating system software, drivers, or agents.
The data that is collected is managed according to the HP Data Privacy policy. For more information see the HP website (http://www.hp.com/go/privacy). The Active Health System log, in conjunction with the system monitoring provided by Agentless Management or SNMP Pass-thru, provides continuous monitoring of hardware and configuration changes, system status, and service alerts for various server components. The Agentless Management Service is available in the SPP, which is a disk image (.
HP Insight Diagnostics HP Insight Diagnostics is a proactive server blade management tool, available in both offline and online versions, that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server blade installations, troubleshoot problems, and perform repair validation. HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS is not running.
HP Insight Remote Support software HP strongly recommends that you install HP Insight Remote Support software to complete the installation or upgrade of your product and to enable enhanced delivery of your HP Warranty, HP Care Pack Service, or HP contractual support agreement.
HP Service Pack for ProLiant SPP is a release set that contains a comprehensive collection of firmware and system software components, all tested together as a single solution stack for HP ProLiant servers, their options, BladeSystem enclosures, and limited HP external storage. SPP has several key features for updating HP ProLiant servers.
• Configuring memory options • Language selection For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD or the HP website (http://www.hp.com/support/rbsu). Using RBSU To use RBSU, use the following keys: • To access RBSU, press the F9 key during power-up when prompted. • To navigate the menu system, use the arrow keys. • To make selections, press the Enter key. • To access Help for a highlighted configuration option, press the F1 key.
Boot options Near the end of the boot process, the boot options screen is displayed. This screen is visible for several seconds before the system attempts to boot from a supported boot device. During this time, you can do the following: • Access RBSU by pressing the F9 key. • Access Intelligent Provisioning Maintenance Menu by pressing the F10 key. • Access the boot menu by pressing the F11 key. • Force a PXE Network boot by pressing the F12 key.
Utilities and features Array Configuration Utility ACU is a utility with the following features: • Runs as a local application or remote service accessed through the HP System Management Homepage • Supports online array capacity expansion, logical drive extension, assignment of online spares, and RAID or stripe size migration • Suggests the optimum configuration for an unconfigured system • For supported controllers, provides access to licensed features, including: o Moving and deleting individual
Option ROM Configuration for Arrays Before installing an operating system, you can use the ORCA utility to create the first logical drive, assign RAID levels, and establish online spare configurations.
Legacy USB support provides USB functionality in environments where USB support is not available normally. Specifically, HP provides legacy USB functionality for the following: • POST • RBSU • Diagnostics • DOS • Operating environments which do not provide native USB support Redundant ROM support The server blade enables you to upgrade or configure the ROM safely with redundant ROM support. The server blade has a single ROM that acts as two separate ROM images.
Software and firmware Software and firmware should be updated before using the server for the first time, unless any installed software or components require an older version. For system software and firmware updates, download the SPP ("HP Service Pack for ProLiant" on page 55) from the HP website (http://www.hp.com/go/spp). Version control The VCRM and VCA are web-enabled Insight Management Agents tools that HP SIM uses to schedule software update tasks to the entire enterprise.
Troubleshooting Troubleshooting resources The HP ProLiant Gen8 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, issue resolution, and software maintenance on ProLiant servers and server blades. To view the guide, select a language: • English (http://www.hp.com/support/ProLiant_TSG_v1_en) • French (http://www.hp.com/support/ProLiant_TSG_v1_fr) • Spanish (http://www.hp.
Battery replacement If the server blade no longer automatically displays the correct date and time, you might have to replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years. WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled.
Regulatory compliance notices Regulatory compliance identification numbers For the purpose of regulatory compliance certifications and identification, this product has been assigned a unique regulatory model number. The regulatory model number can be found on the product nameplate label, along with all required approval markings and information. When requesting compliance information for this product, always refer to this regulatory model number.
radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver.
This Class A digital apparatus meets all requirements of the Canadian Interference-Causing Equipment Regulations. Cet appareil numérique de la classe A respecte toutes les exigences du Règlement sur le matériel brouilleur du Canada. Class B equipment This Class B digital apparatus meets all requirements of the Canadian Interference-Causing Equipment Regulations. Cet appareil numérique de la classe B respecte toutes les exigences du Règlement sur le matériel brouilleur du Canada.
This symbol on the product or on its packaging indicates that this product must not be disposed of with your other household waste. Instead, it is your responsibility to dispose of your waste equipment by handing it over to a designated collection point for the recycling of waste electrical and electronic equipment.
Class B equipment Chinese notice Class A equipment Vietnam compliance marking notice This marking is for applicable products only. Ukraine notice Laser compliance This product may be provided with an optical storage device (that is, CD or DVD drive) and/or fiber optic transceiver. Each of these devices contains a laser that is classified as a Class 1 Laser Product in accordance with US FDA regulations and the IEC 60825-1. The product does not emit hazardous laser radiation.
WARNING: Use of controls or adjustments or performance of procedures other than those specified herein or in the laser product's installation guide may result in hazardous radiation exposure. To reduce the risk of exposure to hazardous radiation: • Do not try to open the module enclosure. There are no user-serviceable components inside. • Do not operate controls, make adjustments, or perform procedures to the laser device other than those specified herein.
Nach ISO 7779:1999 (Typprüfung) Regulatory compliance notices 70
Electrostatic discharge Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device. To prevent electrostatic damage: • Avoid hand contact by transporting and storing products in static-safe containers.
Specifications Environmental specifications Specification Value — Temperature range* Operating 10°C to 35°C (50°F to 95°F) Non-operating -30°C to 60°C (-22°F to 140°F) Relative humidity (noncondensing)** — Operating 10% to 90% @ 28°C (82.4°F) Non-operating 5% to 95% @ 38.7°C (101.7°F) Altitude† — Operating 3050 m (10,000 ft) Non-operating 9144 m (30,000 ft) * The following temperature conditions and limitations apply: - All temperature ratings shown are for sea level.
Support and other resources Before you contact HP Be sure to have the following information available before you call HP: • Active Health System log Download and have available an Active Health System log for 3 days before the failure was detected. For more information, see the HP iLO 4 User Guide or HP Intelligent Provisioning User Guide on the HP website (http://www.hp.com/go/ilo/docs).
providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts: • Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service. • Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair.
Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus d'informations sur ce programme en Amérique du Nord, consultez le site Web HP (http://www.hp.com/go/selfrepair). Riparazione da parte del cliente Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente dal cliente (CSR, Customer Self Repair).
HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet. CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert. Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen Aufpreis verfügbar.
sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio. Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite la página web de HP siguiente (http://www.hp.com/go/selfrepair).
Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto. OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça.
Support and other resources 79
Support and other resources 80
Acronyms and abbreviations ABEND abnormal end ACU Array Configuration Utility ADM Advanced Data Mirroring AMP Advanced Memory Protection ASR Automatic Server Recovery FBWC flash-backed write cache iLO Integrated Lights-Out IML Integrated Management Log LRDIMM load reduced dual in-line memory module ORCA Option ROM Configuration for Arrays POST Power-On Self Test PXE preboot execution environment Acronyms and abbreviations 81
RBSU ROM-Based Setup Utility RDIMM registered dual in-line memory module SAS serial attached SCSI SATA serial ATA SIM Systems Insight Manager UDIMM unregistered dual in-line memory module UID unit identification USB universal serial bus VCA Version Control Agent Acronyms and abbreviations 82
Documentation feedback HP is committed to providing documentation that meets your needs. To help us improve the documentation, send any errors, suggestions, or comments to Documentation Feedback (mailto:docsfeedback@hp.com). Include the document title and part number, version number, or the URL when submitting your feedback.
Index A access panel 14 acoustics statement for Germany 69 ACU (Array Configuration Utility) 50, 58 Advanced ECC memory 36, 37, 57 AMP (Advanced Memory Protection) 57 AMP modes 57 Array Configuration Utility (ACU) 58 ASR (Automatic Server Recovery) 59 authorized reseller 73 auto-configuration process 56 Automatic Server Recovery (ASR) 59 B Basic Input/Output System (BIOS) 50, 59 batteries, replacing 63, 69 battery 8, 63, 69 battery disposal 66, 69 battery replacement notice 63, 69 before you contact HP 73
error messages 62 European Union notice 66 European Union regulatory notice 66 F FBWC capacitor cabling 46 FBWC capacitor pack 39, 46 FBWC procedures 17 FCC (Federal Communications Commission) notice 64, 65 FCC rating label 64 features 6, 58 Federal Communications Commission (FCC) notice 64, 65 firmware 61 firmware update 55, 61 firmware upgrade utility, troubleshooting 62 firmware, updating 55, 61 flash-backed write cache capacitor pack 46 front panel components 6 front panel LEDs 6 front panel/drive cage
memory, online spare 36, 57 mezzanine card 40 mezzanine connectors 8, 9 modifications, FCC notice 65 N network connections 24 NIC (network interface card) 8 O online spare memory 36, 37, 57 operating system version support 61 operating systems 61 operating systems supported 61 operations 12 Option ROM Configuration for Arrays (ORCA) 50, 59 options 24, 50 options installation 24, 27 ORCA (Option ROM Configuration for Arrays) 50, 59 P passwords 44 phone numbers 73 population order, memory 37, 38 powering d
Trusted Platform Module (TPM) 42, 43, 44, 45 U Ukraine notice 68 updating the system ROM 60 USB connectors 10 USB devices 48, 49 USB support 59 utilities 50, 58 utilities, deployment 50, 54, 55 V Version Control 61 Version Control Agent (VCA) 61 Version Control Repository Manager (VCRM) 61 video connector cabling 10 Vietnam compliance marking notice 68 W website, HP 73 weight 72 Index 87
