HP ProLiant BL465c Gen8 Server Blade User Guide Abstract This document is for the person who installs, administers, and troubleshoots servers and storage systems. HP assumes you are qualified in the servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels.
© Copyright 2012 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein. Microsoft® and Windows® are U.S. registered trademarks of Microsoft Corporation.
Contents Component identification ............................................................................................................... 6 Front panel components ............................................................................................................................. 6 Front panel LEDs and buttons ...................................................................................................................... 7 Drive LED definitions .........................................
Mezzanine card option ............................................................................................................................ 40 Capacitor pack option ............................................................................................................................. 42 HP Trusted Platform Module option ............................................................................................................ 44 Installing the Trusted Platform Module board ....................
FCC rating label ............................................................................................................................ 66 FCC Notice, Class A Equipment ...................................................................................................... 66 FCC Notice, Class B Equipment ...................................................................................................... 66 Declaration of conformity for products marked with the FCC logo, United States only ...........
Component identification Front panel components Item Description 1 Serial label pull tab 2 HP c-Class Blade SUV connector* (behind the serial label pull tab) 3 Drive bay 4 Server blade release lever 5 Server blade release button *The SUV connector and the HP c-Class Blade SUV Cable are used for some server blade configuration and diagnostic procedures.
Front panel LEDs and buttons Item Description Status 1 Health status LED bar Solid Green = Normal (System is powered on.) Flashing Green = Power On/Standby Button service is being initialized. Flashing Amber = Degraded condition Flashing Red = Critical condition Off = Normal (System is in standby.) 2 Power On/Standby Solid Green = System is powered on. button and System Flashing Green = System is waiting to power on; Power On/Standby button is power LED pressed.
Drive LED definitions Item LED Status 1 Locate Solid blue The drive is being identified by a host application. Flashing blue The drive carrier firmware is being updated or requires an update. Rotating green Drive activity Off No drive activity Solid white Do not remove the drive. Removing the drive causes one or more of the logical drives to fail. Off Removing the drive does not cause a logical drive to fail. Solid green The drive is a member of one or more logical drives.
Item Description 1 Processor 2 DIMM slots 2 Processor 1 DIMM slots 3 Internal USB connector 4 Pass-thru board 5 TPM connector 6 Mezzanine connector 1 (Type A mezzanine only) 7 MicroSD card slot 8 Mezzanine connector 2 (Type A or type B mezzanine) 9 Enclosure connector 10 System maintenance switch 11 FlexibleLOM connectors (2) 12 Drive power cable connector 13 Processor socket 1 (populated) 14 Processor socket 2 15 System battery 16 HP c-Class Blade SUV cable connector The s
CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to properly configure the server or data loss could occur. Mezzanine connector definitions A PCIe x8 mezzanine connector supports x16 cards at up to x8 speeds. Item PCIe Mezzanine connector 1 x8, Type A mezzanine card only Mezzanine connector 2 x16, Type A or B mezzanine card DIMM slot locations DIMM slots are numbered sequentially (1 through 8) for each processor.
Tool location A Torx T-15 screwdriver is located on the DIMM baffle.
Operations Power up the server blade The Onboard Administrator initiates an automatic power-up sequence when the server blade is installed. If the default setting is changed, use one of the following methods to power up the server blade: • Use a virtual power button selection through iLO. • Press and release the Power On/Standby button. When the server blade goes from the standby mode to the full power mode, the system power LED changes from amber to solid green.
o poweroff server [bay number] force This form of the command forces the server blade to enter standby mode without properly exiting applications and the OS. If an application stops responding, this method forces a shutdown. • Use the Onboard Administrator GUI to initiate a shutdown: a. Select the Enclosure Information tab. b. In the Device Bays item, select the Overall checkbox. c.
Remove the access panel To remove the component: 1. Power down the server blade (on page 12). 2. Remove the server blade (on page 13). 3. Press the access panel release button. 4. Slide the access panel towards the rear of the server blade, and then lift to remove the panel. Install the access panel 1. Place the access panel on top of the server blade. 2. Slide the access panel forward until it clicks into place. Remove the DIMM baffle 1. Power down the server blade (on page 12). 2.
5. Remove the DIMM baffle. Install the DIMM baffle 1. Install the DIMM baffle.
2. Connect the drive cable connectors to the SAS controller. 3. Install the access panel (on page 14). 4. Install the server blade ("Installing a server blade" on page 25). Remove the front panel/drive cage assembly 1. Power down the server blade (on page 12). 2. Remove the server blade (on page 13). 3. Remove the access panel (on page 14). CAUTION: Always disconnect the drive cables from the SAS controller before removing the DIMM baffle.
6. Extend the serial label pull tab from the front of the server blade. CAUTION: Always disconnect the drive cable before removing the front panel/drive cage assembly. 7. Remove the front panel/drive cage assembly. Install the front panel/drive cage assembly 1. Extend the serial label pull tab from the front of the base pan.
2. Install the front panel/drive cage assembly and reconnect the drive cables. 3. Close the serial label pull tab. 4. Install the DIMM baffle (on page 15). 5. Install the access panel (on page 14). 6. Install the server blade ("Installing a server blade" on page 25). Remove the SAS controller 1. Power down the server blade (on page 12). 2. Remove the server blade (on page 13). 3. Remove the access panel (on page 14). 4.
CAUTION: Always disconnect the drive cables from the SAS controller before removing the DIMM baffle. Failure to do so may result in damage to the SAS controller. 5. Disconnect the drive cables from the SAS controller ("Drive cabling" on page 49). 6. Remove the DIMM baffle (on page 14). 7. Remove the SAS controller. Install the SAS controller 1. Remove the DIMM baffle (on page 14). 2. Install the SAS controller.
4. Connect the drive cables and the capacitor pack cables to the SAS controller. For more information, see "Cabling (on page 48)." 5. Install the access panel (on page 14). 6. Install the server blade ("Installing a server blade" on page 25). Remove all drives 1. Remove drive 1. 2. Release the drive tray, slide it forward until it locks, and then press drive carrier 1 down to access drive 2.
3. Remove drive 2. 4. Lift drive carrier 1 into position in the drive tray. 5. Slide the drive tray into the server blade. Close the drive tray lever until it locks into place.
Setup Overview Installation of a server blade requires the following steps: 1. Install and configure an HP BladeSystem c-Class enclosure. 2. Install any server blade options. 3. Install interconnect modules in the enclosure. 4. Connect the interconnect modules to the network. 5. Install a server blade. 6. Complete the server blade configuration. Installing an HP BladeSystem c-Class enclosure Before performing any server blade-specific procedures, install an HP BladeSystem c-Class enclosure.
Interconnect bay numbering and device mapping • HP BladeSystem c7000 Enclosure To support network connections for specific signals, install an interconnect module in the bay corresponding to the FlexibleLOM or mezzanine signals.
• HP BladeSystem c3000 Enclosure and Tower Enclosure Server blade signal Interconnect bay number Interconnect bay label Notes FlexibleLOM 1 — Mezzanine 1 2 Four port cards connect to bay 2. Mezzanine 2 3 and 4 • • • Four port cards Ports 1 and 3 connect to bay 3. Ports 2 and 4 connect to bay 4.
Two types of interconnect modules are available for HP BladeSystem c-Class enclosures: Pass-Thru modules and switch modules. For more information about interconnect module options, see the HP website (http://www.hp.com/go/bladesystem/interconnects). IMPORTANT: To connect to a network with a Pass-Thru module, always connect the Pass-Thru module to a network device that supports Gigabit or 10 Gb speed, depending on the corresponding Pass-Thru model.
2. Remove the enclosure connector cover. 3. Install the server blade. Completing the configuration To complete the server blade and HP BladeSystem configuration, see the overview card that ships with the enclosure.
Hardware options installation Introduction If more than one option is being installed, read the installation instructions for all the hardware options and identify similar steps to streamline the installation process. WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent damage to electrical components, properly ground the server before beginning any installation procedure.
2. Release the drive tray, slide it forward until it locks, and then press drive carrier 1 down to access drive bay 2. 3. Prepare the drive.
4. Install the drive in drive bay 2. 5. Slide the drive tray into the server blade. Close the drive tray lever until it locks into place. 6. Install the drive.
Processor option WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To avoid damage to the system board: • Do not touch the processor socket contacts. • Always install the processor socket cover after removing the processor from the socket. • Do not tilt or slide the processor when lowering the processor into the socket.
8. Remove the heatsink blank. Retain the heatsink blank for future use. 9. Open the processor socket locking lever and the retaining bracket, and then remove the processor socket protective cover. IMPORTANT: Be sure the processor remains inside the processor installation tool.
10. If the processor has separated from the installation tool, carefully re-insert the processor in the tool. Handle the processor by the edges only, and do not touch the bottom of the processor, especially the contact area. 11. The processor fits one way into the socket. Use the alignment guides on the processor and socket to properly align the processor with the socket. Install the spare processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.
12. Press the tabs on the processor tool to release the processor, and then remove the processor tool. 13. Close the processor socket retaining bracket and the processor locking lever. CAUTION: Be sure to close the processor socket retaining bracket before closing the processor locking lever. The lever should close without resistance. Forcing the lever closed can damage the processor and socket, requiring system board replacement.
14. Remove the thermal interface protective cover from the heatsink. CAUTION: To avoid damage to the system board, processor socket, and screws, do not overtighten the heatsink screws. Use the wrench supplied with the system to reduce the possibility of overtightening the screws. 15. Align and install the heatsink. Alternate tightening the screws until the heatsink is seated properly. 16. Install the front panel/drive cage assembly. 17. Install the DIMM baffle (on page 15). 18.
IMPORTANT: This server blade does not support mixing LRDIMMs or RDIMMs. Attempting to mix any combination of these DIMMs can cause the server to halt during BIOS initialization. The memory subsystem in this server blade can support LRDIMMs or RDIMMs: • RDIMMs offer lower latency in one DIMM per channel configurations and (relatively) low power consumption. They include address parity protection.
Qualified memory is performance-tuned for HP ProLiant and BladeSystem servers and provides future enhanced support through HP Active Health and manageability software. Memory subsystem architecture The memory subsystem in this server blade is divided into channels. Each processor supports four channels, and each channel supports two DIMM slots, as shown in the following table.
DIMM identification To determine DIMM characteristics, use the label attached to the DIMM and the following illustration and table. Item Description Definition 1 Size — 2 Rank 1R = Single-rank 2R = Dual-rank 4R = Quad-rank 3 Data width x4 = 4-bit x8 = 8-bit 4 Voltage rating L = Low voltage (1.35v) U = Ultra low voltage (1.
is degrading. This allows DIMMs that have a higher probability of receiving an uncorrectable memory error (which would result in system downtime) to be removed from operation. Advanced Memory Protection options are configured in RBSU. If the requested AMP mode is not supported by the installed DIMM configuration, the server blade boots in Advanced ECC mode. For more information, see "HP ROM-Based Setup Utility (on page 57).
• When one processor is installed, install DIMMs in sequential alphabetic order: A, B, C, D, E, F, and so forth. • When two processors are installed, install the DIMMs in sequential alphabetic order balanced between the two processors: P1-A, P2-A, P1-B, P2-B, P1-C, P2-C, and so forth. • For DIMM spare replacement, install the DIMMs per slot number as instructed by the system software.
3. Remove the access panel (on page 14). 4. Remove the DIMM baffle (on page 14). 5. Open the DIMM slot latches. 6. Install the DIMM. 7. Install all DIMM baffles ("Install the DIMM baffle" on page 15). 8. Install the access panel (on page 14). 9. Install the server blade ("Installing a server blade" on page 25). 10. Power up the server blade (on page 12). Mezzanine card option Optional mezzanine cards are classified as Type A mezzanine cards and Type B mezzanine cards.
4. Remove the mezzanine assembly from the server blade. 5. Align the mezzanine card with the guide pins on the mezzanine assembly.
6. Install the mezzanine card in the mezzanine assembly, and then tighten the mezzanine card screws to secure the card to the mezzanine assembly. 7. Align the mezzanine assembly with the guide pins on the system board, and then install the mezzanine assembly on the system board. 8. Press down firmly on the mezzanine assembly handles, and then close the mezzanine assembly latch. 9. Install the access panel (on page 14). 10. Install the server blade ("Installing a server blade" on page 25).
3. Remove the access panel (on page 14). 4. Remove the DIMM baffle (on page 14). 5. Install the FBWC capacitor pack: 6. o FBWC capacitor pack for a mezzanine option o FBWC capacitor pack for the SAS controller Route the FBWC capacitor pack cable. The DIMM baffles may be removed to route the cables, if necessary.
o Route the cable between the DIMMs and the heatsinks or heatsink blank. Connect the cable to the mezzanine option. o Route the cable along the DIMM baffle and connect the cable to the SAS controller. 7. Install the DIMM baffle (on page 15). 8. Install the access panel (on page 14). 9. Install the server blade ("Installing a server blade" on page 25). HP Trusted Platform Module option Use these instructions to install and enable a TPM on a supported server blade.
CAUTION: Always observe the guidelines in this document. Failure to follow these guidelines can cause hardware damage or halt data access. When installing or replacing a TPM, observe the following guidelines: • Do not remove an installed TPM. Once installed, the TPM becomes a permanent part of the system board. • When installing or replacing hardware, HP service providers cannot enable the TPM or the encryption technology. For security reasons, only the customer can enable these features.
7. Install the TPM board. Press down on the connector to seat the board ("System board components" on page 8). 8. Install the TPM security rivet by pressing the rivet firmly into the system board. 9. Install the mezzanine assembly. 10. Install the access panel (on page 14). 11. Install the server blade ("Installing a server blade" on page 25).
• Always store copies of the recovery key/password away from the server blade. • Do not save the recovery key/password on the encrypted hard drive. Enabling the Trusted Platform Module 1. When prompted during the start-up sequence, access RBSU by pressing the F9 key. 2. From the Main Menu, select Server Security. 3. From the Server Security Menu, select Trusted Platform Module. 4. From the Trusted Platform Module Menu, select TPM Functionality. 5.
Cabling Cabling resources Cabling configurations and requirements vary depending on the product and installed options. For more information about product features, specifications, options, configurations, and compatibility, see the QuickSpecs on the HP website (http://www.hp.com/go/productbulletin). At the website, choose the geographic region, and then locate the product by name or product category.
Drive cabling Using the HP c-Class Blade SUV Cable The HP c-Class Blade SUV Cable enables the user to perform server blade administration, configuration, and diagnostic procedures by connecting video and USB devices directly to the server blade. For SUV cable connectors, see "HP c-Class Blade SUV Cable (on page 11).
3. Connect a USB mouse to one USB connector. 4. Connect a USB keyboard to the second USB connector. Item Description 1 Monitor 2 USB mouse 3 USB keyboard 4 HP c-Class Blade SUV Cable Accessing local media devices Use the following configuration when configuring a server blade or loading software updates and patches from a USB CD/DVD-ROM. Use a USB hub when connecting a USB CD-ROM drive to the server blade. The USB hub provides additional connections. 1.
o USB mouse Item Description 1 Monitor 2 USB CD/DVD-ROM drive 3 USB keyboard 4 USB hub 5 USB mouse 6 HP c-Class Blade SUV Cable Cabling 51
Software and configuration utilities Server mode The software and configuration utilities presented in this section operate in online mode, offline mode, or in both modes.
iLO enables and manages the Active Health System (on page 53) and also features Agentless Management. All key internal subsystems are monitored by iLO. SNMP alerts are sent directly by iLO regardless of the host operating system or even if no host operating system is installed. HP Insight Remote Support software (on page 56) is also available in HP iLO with no operating system software, drivers, or agents.
The data that is collected is managed according to the HP Data Privacy policy. For more information see the HP website (http://www.hp.com/go/privacy). The Active Health System log, in conjunction with the system monitoring provided by Agentless Management or SNMP Pass-thru, provides continuous monitoring of hardware and configuration changes, system status, and service alerts for various server components. The Agentless Management Service is available in the SPP, which is a disk image (.
HP Insight Diagnostics HP Insight Diagnostics is a proactive server blade management tool, available in both offline and online versions, that provides diagnostics and troubleshooting capabilities to assist IT administrators who verify server blade installations, troubleshoot problems, and perform repair validation. HP Insight Diagnostics Offline Edition performs various in-depth system and component testing while the OS is not running.
HP Insight Remote Support software HP strongly recommends that you install HP Insight Remote Support software to complete the installation or upgrade of your product and to enable enhanced delivery of your HP Warranty, HP Care Pack Service, or HP contractual support agreement.
HP Service Pack for ProLiant SPP is a release set that contains a comprehensive collection of firmware and system software components, all tested together as a single solution stack for HP ProLiant servers, their options, BladeSystem enclosures, and limited HP external storage. SPP has several key features for updating HP ProLiant servers.
• Configuring memory options • Language selection For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD or the HP website (http://www.hp.com/support/rbsu). Using RBSU To use RBSU, use the following keys: • To access RBSU, press the F9 key during power-up when prompted. • To navigate the menu system, use the arrow keys. • To make selections, press the Enter key. • To access Help for a highlighted configuration option, press the F1 key.
Boot options Near the end of the boot process, the boot options screen is displayed. This screen is visible for several seconds before the system attempts to boot from a supported boot device. During this time, you can do the following: • Access RBSU by pressing the F9 key. • Access Intelligent Provisioning Maintenance Menu by pressing the F10 key. • Access the boot menu by pressing the F11 key. • Force a PXE Network boot by pressing the F12 key.
Utilities and features Array Configuration Utility ACU is a utility with the following features: • Runs as a local application or remote service accessed through the HP System Management Homepage • Supports online array capacity expansion, logical drive extension, assignment of online spares, and RAID or stripe size migration • Suggests the optimum configuration for an unconfigured system • For supported controllers, provides access to licensed features, including: o Moving and deleting individual
Option ROM Configuration for Arrays Before installing an operating system, you can use the ORCA utility to create the first logical drive, assign RAID levels, and establish online spare configurations.
Legacy USB support provides USB functionality in environments where USB support is not available normally. Specifically, HP provides legacy USB functionality for the following: • POST • RBSU • Diagnostics • DOS • Operating environments which do not provide native USB support Redundant ROM support The server blade enables you to upgrade or configure the ROM safely with redundant ROM support. The server blade has a single ROM that acts as two separate ROM images.
Software and firmware Software and firmware should be updated before using the server for the first time, unless any installed software or components require an older version. For system software and firmware updates, download the SPP ("HP Service Pack for ProLiant" on page 57) from the HP website (http://www.hp.com/go/spp). Version control The VCRM and VCA are web-enabled Insight Management Agents tools that HP SIM uses to schedule software update tasks to the entire enterprise.
Troubleshooting Troubleshooting resources The HP ProLiant Gen8 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, issue resolution, and software maintenance on ProLiant servers and server blades. To view the guide, select a language: • English (http://www.hp.com/support/ProLiant_TSG_v1_en) • French (http://www.hp.com/support/ProLiant_TSG_v1_fr) • Spanish (http://www.hp.
Battery replacement If the server blade no longer automatically displays the correct date and time, you might have to replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years. WARNING: The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled.
Regulatory compliance notices Regulatory compliance identification numbers For the purpose of regulatory compliance certifications and identification, this product has been assigned a unique regulatory model number. The regulatory model number can be found on the product nameplate label, along with all required approval markings and information. When requesting compliance information for this product, always refer to this regulatory model number.
radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver.
This Class A digital apparatus meets all requirements of the Canadian Interference-Causing Equipment Regulations. Cet appareil numérique de la classe A respecte toutes les exigences du Règlement sur le matériel brouilleur du Canada. Class B equipment This Class B digital apparatus meets all requirements of the Canadian Interference-Causing Equipment Regulations. Cet appareil numérique de la classe B respecte toutes les exigences du Règlement sur le matériel brouilleur du Canada.
This symbol on the product or on its packaging indicates that this product must not be disposed of with your other household waste. Instead, it is your responsibility to dispose of your waste equipment by handing it over to a designated collection point for the recycling of waste electrical and electronic equipment.
Class B equipment Chinese notice Class A equipment Vietnam compliance marking notice This marking is for applicable products only. Ukraine notice Laser compliance This product may be provided with an optical storage device (that is, CD or DVD drive) and/or fiber optic transceiver. Each of these devices contains a laser that is classified as a Class 1 Laser Product in accordance with US FDA regulations and the IEC 60825-1. The product does not emit hazardous laser radiation.
WARNING: Use of controls or adjustments or performance of procedures other than those specified herein or in the laser product's installation guide may result in hazardous radiation exposure. To reduce the risk of exposure to hazardous radiation: • Do not try to open the module enclosure. There are no user-serviceable components inside. • Do not operate controls, make adjustments, or perform procedures to the laser device other than those specified herein.
Nach ISO 7779:1999 (Typprüfung) Regulatory compliance notices 72
Electrostatic discharge Preventing electrostatic discharge To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device. To prevent electrostatic damage: • Avoid hand contact by transporting and storing products in static-safe containers.
Specifications Environmental specifications Specification Value — Temperature range* Operating 10°C to 35°C (50°F to 95°F) Non-operating -30°C to 60°C (-22°F to 140°F) Relative humidity (noncondensing)** — Operating 10% to 90% @ 28°C (82.4°F) Non-operating 5% to 95% @ 38.7°C (101.7°F) Altitude† — Operating 3050 m (10,000 ft) Non-operating 9144 m (30,000 ft) * The following temperature conditions and limitations apply: - All temperature ratings shown are for sea level.
Support and other resources Before you contact HP Be sure to have the following information available before you call HP: • Active Health System log Download and have available an Active Health System log for 3 days before the failure was detected. For more information, see the HP iLO 4 User Guide or HP Intelligent Provisioning User Guide on the HP website (http://www.hp.com/go/ilo/docs).
providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts: • Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service. • Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair.
Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus d'informations sur ce programme en Amérique du Nord, consultez le site Web HP (http://www.hp.com/go/selfrepair). Riparazione da parte del cliente Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente dal cliente (CSR, Customer Self Repair).
HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet. CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert. Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen Aufpreis verfügbar.
sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio. Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite la página web de HP siguiente (http://www.hp.com/go/selfrepair).
Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto. OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça.
Support and other resources 81
Support and other resources 82
Acronyms and abbreviations ABEND abnormal end ACU Array Configuration Utility ADM Advanced Data Mirroring AMP Advanced Memory Protection ASR Automatic Server Recovery FBWC flash-backed write cache iLO Integrated Lights-Out IML Integrated Management Log LRDIMM load reduced dual in-line memory module LV DIMM Low voltage DIMM ORCA Option ROM Configuration for Arrays POST Power-On Self Test Acronyms and abbreviations 83
PXE preboot execution environment RBSU ROM-Based Setup Utility RDIMM registered dual in-line memory module SAS serial attached SCSI SATA serial ATA SIM Systems Insight Manager UDIMM unregistered dual in-line memory module UID unit identification USB universal serial bus VCA Version Control Agent Acronyms and abbreviations 84
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Index A access panel 14 acoustics statement for Germany 71 ACU (Array Configuration Utility) 52, 60 Advanced ECC memory 38, 39, 59 Array Configuration Utility (ACU) 60 ASR (Automatic Server Recovery) 61 authorized reseller 75 auto-configuration process 58 Automatic Server Recovery (ASR) 61 B Basic Input/Output System (BIOS) 52, 61 batteries, replacing 65, 71 battery 8, 65, 71 battery replacement notice 65, 71 beep codes 64 before you contact HP 75 BIOS (Basic Input/Output System) 52, 61 BIOS upgrade 52, 61
FBWC capacitor pack 42, 48 FCC (Federal Communications Commission) notice 66, 67 FCC rating label 66 features 6, 60 Federal Communications Commission (FCC) notice 66, 67 firmware 63 firmware update 57, 63 firmware upgrade utility, troubleshooting 64 firmware, updating 57, 63 flash-backed write cache capacitor pack 48 FlexibleLOM connectors 8 FlexibleLOM LED 7 front panel buttons 7 front panel components 6 front panel LEDs 7 front panel/drive cage assembly 17 front panel/hard drive cage assembly 17 G HP, c
memory, Advanced ECC 38, 59 memory, configuration requirements 37 memory, configuring 37, 38 memory, online spare 38, 59 mezzanine board connectors 8 mezzanine boards 40 mezzanine card 40 mezzanine connector covers 40 mezzanine connectors 8, 10 modifications, FCC notice 67 N network connections 24 NIC (network interface card) 8 O online spare memory 38, 39, 59 online spare population guidelines 39 operating systems 63 operations 12 Option ROM Configuration for Arrays (ORCA) 52, 61 options 22, 52 options i
system maintenance switch 8, 9 system, keeping current 62 T T-15 Torx screwdriver 11 Taiwan battery recycling notice 71 technical support 75 telephone numbers 75 tool locations 11 tool, DIMM 11 tools 11 Torx screwdriver 11 TPM (Trusted Platform Module) 44, 45, 46, 47 troubleshooting 64 troubleshooting resources 64 troubleshooting, firmware upgrade utility 64 Trusted Platform Module (TPM) 44, 45, 46, 47 U Ukraine notice 70 updating the system ROM 62 USB connectors 11 USB devices 49 USB support 61 utilities
