Specifications
Table Of Contents
- Product Features
- Activating and Customizing the Software
- Computer Setup (F10) Utility
- Illustrated parts catalog
- Serial ATA (SATA) Drive Guidelines and Features
- Routine Care and Disassembly Preparation
- Removal and Replacement Procedures – Microtower (MT) Chassis
- Removal and Replacement Procedures – Small Form Factor (SFF) Chassis
- Troubleshooting Without Diagnostics
- Safety and Comfort
- Before You Call for Technical Support
- Helpful Hints
- Solving General Problems
- Solving Power Problems
- Solving Hard Drive Problems
- Solving Media Card Reader Problems
- Solving Display Problems
- Solving Audio Problems
- Solving Printer Problems
- Solving Keyboard and Mouse Problems
- Solving Hardware Installation Problems
- Solving Network Problems
- Solving Memory Problems
- Solving Processor Problems
- Solving CD-ROM and DVD Problems
- Solving USB Flash Drive Problems
- Solving Front Panel Component Problems
- Solving Internet Access Problems
- Solving Software Problems
- Contacting Customer Support
- HP PC Hardware Diagnostics
- Backup and Recovery
- Power Cord Set Requirements
- POST Error Messages
- Password Security and Resetting CMOS
- Specifications
- Index

Figure 7-7 DIMM Socket Locations — HP Pro 3335/3385
Table 7-3 DIMM Socket Locations — HP Pro 3335/3385
Description Socket Color Insertion Order
XMM3 socket, Channel A (populate first) Black 1
XMM4 socket, Channel B Black 2
NOTE: A DIMM must occupy the XMM1 socket.
For proper system operation, the DDR3-SDRAM DIMMs must be:
● industry-standard 240-pin
●
unbuffered non-ECC PC3-10600 DDR3-1333 MHz-compliant
●
1.5 volt DDR3-SDRAM DIMMs
The DDR3-SDRAM DIMMs must also:
●
support CAS latency 9 DDR3 1333 MHz (9-9-9 timing)
●
contain the mandatory JEDEC SPD information
In addition, the computer supports:
●
512-Mbit, 1-Gbit, and 2-Gbit non-ECC memory technologies
●
single-sided and double-sided DIMMs
●
DIMMs constructed with x8 and x16 DDR devices; DIMMs constructed with x4 SDRAM are not
supported
Memory 55










