Getting Started Guide

Site requirements 11
The following is a list of component requirements for grounding and bonding:
• Grounding of the HP POD 240e NA must comply with the requirements of Article 250 of the NEC,
NFPA 70-2011 (NA/JPN), and with local and regional regulations (IEC for EMEA and AP).
• Bonding of the piping systems and any exposed structural steel, installed to support the HP POD 240e
NA, must be in accordance with NEC (NA) and with local and regional regulations (IEC for EMEA and
APJ).
Grounding feature Specification
Grounding electrode
conductor pad
•
The grounding electrode conductor connection bus pad is located on the outside of
the HP POD 240e NA on the cold aisle adjacent to the power cabinet.
•
The grounding pad must be connected to the grounding electrode system or
building steel in accordance with Article 250 of the NEC or equivalent regional
regulations.
Grounding lugs
•
Grounding lugs cannot be attached to any painted surface.
•
Grounding lugs must be compression-type 2-hole lugs and UL listed specifically for
grounding.
Ground rod system or
ground well
You must provide an effective grounding system with a ground rod or a ground well.
IMPORTANT: Before installing the HP POD 240e NA, consult your local AHJ for applicable
regulations and to review site-specific location guidelines. If needed, obtain any necessary
permits.
The grounding electrode conductor connections are located on IT sections A and B of the HP POD 240e NA.
The following figure shows the location for both of the IT sections.
Side view shown