Specifications

Removal and Replacement Procedures
DIMMs
To remove the component:
1. Power down the server. Refer to “System Power Down” in this chapter.
2. Remove the front bezel. Refer to “Front Bezel” in this chapter.
3. Remove the access panel. Refer to “Access Panel” in this chapter.
4. Remove the air baffle. Refer to “Air Baffle” in this chapter.
5. Remove the DIMM:
a. Press outward on both latches of the memory module socket at the same time to
release the DIMM and push it partially out of the socket.
b. Lift the memory module from the socket.
CAUTION: When handling a memory module, be careful not to touch any of the contacts.
Doing so may damage the module.
CAUTION: Do not mix ECC and non-ECC SDRAM DIMMs. If different types of memory
modules are mixed, the server does not properly function.
IMPORTANT: DIMMs must be industry-standard, ECC Registered PC2100 DDR SDRAM DIMMs and
support CAS Latency 2.5 (CL=2.5).
NOTE: HP recommends that the DIMMs be installed sequentially in slots 1, 2, 3, and then 4.
To replace the component, reverse the removal procedure.
HP ProLiant ML330 Generation 3 Server Maintenance and Service Guide 2-9