Product Data Sheet / Brochure

Physical characteristics Dimensions 17.4(w) x 9.7(d) x 1.75(h) in (44.2 x 24.64 x 4.45
cm) (1U height)
Weight 6.3 lb (2.86 kg)
Memory and processor Processor ARM9E @ 800 MHz, 128 MB flash, 256 MB DDR3
DIMM; packet buffer size: 3 MB dynamically
allocated
Mounting Mounts in an EIA-standard 19-inch telco rack or equipment cabinet (rack-
mounting kit available); horizontal surface mounting; wall mounting
Performance IPv6 Ready Certified
100 Mb Latency < 6.6 µs (LIFO 64-byte packets)
1000 Mb Latency < 2.2 µs (LIFO 64-byte packets)
Throughput up to 13 million pps (64-byte packets)
Switching capacity 17.6 Gbps
MAC address table size 16000 entries
Environment Operating temperature 32°F to 113°F (0°C to 45°C)
Operating relative
humidity
15% to 95% @ 104°F (40°C), noncondensing
Non-operating/
Storage temperature
-40°F to 158°F (-40°C to 70°C)
Non-operating/Storage
relative humidity
15% to 90% @ 149°F (65°C), noncondensing
Altitude up to 10,000 ft (3 km)
Acoustic Power: 0 dB, Pressure: 0 dB
Electrical characteristics Frequency 50/60 Hz
Maximum heat
dissipation
102 BTU/hr (107.61 kJ/hr)
AC voltage 100-127/200-240 VAC
Current 0.7/0.4 A
Maximum power rating 29.9 W
Idle power 17.1 W
Safety UL 60950-1; CAN/CSA 22.2 No. 60950-1; EN 60825; IEC 60950-1; EN 60950-1
Emissions FCC Class A; EN 55022/CISPR-22 Class A; VCCI Class A
Immunity Generic EN 55024, CISPR 24
EN EN 55024, CISPR 24
ESD IEC 61000-4-2
Radiated IEC 61000-4-3
EFT/Burst IEC 61000-4-4
Surge IEC 61000-4-5
Conducted IEC 61000-4-6
Power frequency
magnetic field
IEC 61000-4-8
QuickSpecs
HP 2530 Switch Series
Technical Specifications
DA - 14447 Worldwide — Version 6 — December 9, 2013 Page 37