Specifications

ATX Reference Thermal Solution
46 Thermal/Mechanical Design Guide
6.6 Heatsink Mass and Center of Gravity
• Total assembly mass ≤ 550 gm (grams), excluding clip and fasteners
• Total mass including clip and fasteners < 595 g
• Assembly center of gravity ≤ 25.4 mm, measured from the top of the IHS
6.7 Thermal Interface Material
A thermal interface material (TIM) provides conductivity between the IHS and heat
sink. The reference thermal solution uses Shin-Etsu G751*. The TIM application is
0.25 g, which will be a nominal 26 mm diameter (~1.0 inches).
6.8 Absolute Processor Temperature
Intel does not test any third party software that reports absolute processor
temperature. As such, Intel cannot recommend the use of software that claims this
capability. Since there is part-to-part variation in the TCC (thermal control circuit)
activation temperature, use of software that reports absolute temperature can be
misleading.
See the processor datasheet for details regarding use of IA32_TEMPERATURE_TARGET
register to determine the minimum absolute temperature at which the TCC will be
activated and PROCHOT# will be asserted.
§
Figure 6-8. Critical Core Dimensions
R 0.40 mm max
R 0.40 mm max
Gap required to avoid
core surface blemish
during clip assembly.
Recommend 0.3 mm min.
1.00 mm min
1.00 +/- 0.10 mm
Core
2.45 +/- 0.10 mm
Dia 38.68 +/- 0.30mm
Dia 36.14 +/- 0.10 mm