Specifications

Thermal/Mechanical Design Guide 41
ATX Reference Thermal Solution
6.3 Geometric Envelope for the Intel
®
Reference ATX
Thermal Mechanical Design
Figure 6-2 shows a 3-D representation of the board component keep out for the
reference ATX thermal solution. A fully dimensioned drawing of the keepout information
is available at Figure B-1 and Figure B-2 in Appendix B. A DXF version of these
drawings is available as well as the 3-D model of the board level keep out zone is
available. Contact your field sales representative for these documents.
The maximum height of the reference thermal solution above the motherboard is
71.12 mm [2.8 inches], and is compliant with the motherboard primary side height
constraints defined in the ATX Specification and the microATX Motherboard Interface
Specification found at http://www.formfactors.org.
The reference solution requires a chassis obstruction height of at least 81.28 mm
[3.2 inches], measured from the top of the motherboard. This allows for appropriate
fan inlet airflow to ensure fan performance, and therefore overall cooling solution
performance. This is compliant with the recommendations found in both ATX
Specification and microATX Motherboard Interface Specification documents.
.
Figure 6-2. ATX KOZ 3-D Model Primary (Top) Side
10.10 mm
Maximum
Component
Height
(4 – places)
1.80 mm Maximum
Component Height
27.0 mm
Maximum Component
Height (3 – places)
2.50 mm Maximum
Component Height
(5 – places)
1.20 mm Maximum
Component Height
Socket / ILM
Keep In Zone