Specifications

Mechanical Drawings
52 Thermal/Mechanical Design Guide
Figure B-1. Socket / Heatsink / ILM Keepout Zone Primary Side (Top)
8 7 6 5 4 3 2
H G F E D C B A
8 7 6 5 4 3 2 1
H G F E D C B A
4X NPTH
LOCATION 0.1 RADIAL TRUE POSITION RELATIVE TO SOCKET CENTER.
4.03
+0.05 -0.03
4X NO ROUTE6.00
(104.00 )
40.00 40.00
30.60
30.60
0.00
18.00 18.00 40.00 40.00
0.00
26.00 37.01 29.71 2X 41.06 2X 49.55 29.71 2X 43.51
28.51
2X 41.06 2X 49.55
52.00 48.70 35.80 32.50 28.51
2X 43.51
52.00
52.00
2X 49.55
45.50
2X 43.51
2X 41.06
38.20
27.31
5.40
10.50
37.00
40.21
2X 41.06
2X 43.51
2X 49.55
9.40
9.40
7.15 7.15
19.51
19.51
28.00
30.00
21.51
32.28
2X 40.77
32.28
40.77
32.28
18.23
43.51
38.92
29.64
2X 42.72
42.72
29.64
38.92
29.64
38.92
38.92
35.62
4X NPTH
LOCATION 0.1 RADIAL TRUE POSITION RELATIVE TO SOCKET CENTER.
3.80
+0.05 -0.03
(36.00 )
4X NO ROUTE ( 5.95 +0.05 -0.03 COPPER SURFACE ON PAD) 5 6
6.00
(104.00 )
(80.00 )
(80.00 )
()104.00
(80.00 )
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
REVISION HISTORY
ZONE REV DESCRIPTION DATE APPROVED
- 01 PRODUCTION RELEASE (NPI REV J) 04/23/08 -
- 02
ADDED CLEARANCE FOR
FASTNERS CAPS IN 27MM ZONE
11/20/08 -
PG2
A8
03
ADDED SECONDARY SIDE 2.54 MM MAX
COMPONENT HEIGHT ZONE
02/5/09
cMTE090601-03
D4 04
INCREASED 1.8MM ZONE TO 1.97.
ADDED NOTE 7
02/23/09
T. BYQUIST
D82245 1 04
DWG. NO SHT. REV
DEPARTMENT
R
2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119
TITLE
LGA 1366 SOCKET B ATX KEEP-INS
SIZE DRAWING NUMBER REV
A1 D82245 04
SCALE: NONE
DO NOT SCALE DRAWING
SHEET
1
OF
2
N.A.N.A.
FINISHMATERIAL -D.CARTER DATEAPPROVED BY -P.BORNEMANN -T.BYQUIST DATECHECKED BY 11/09/06S.LOFLAND DATEDRAWN BY 08/25/06S.LOFLAND DATEDESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MILLIMETERS
ALL UNTOLERANCED LINEAR
DIMENSIONS ±0.3
ANGLES ±0.5
THIRD ANGLE PROJECTION
PARTS LIST
DESCRIPTIONPART NUMBERITEM NOQTY
SOCKETB_ATX_MB_KEEPIN
TOP
NOTES: 1. DIMENSIONS ARE IN MILLIMETERS.
2 GEOMETRIC CENTER OF CPU PACKAGE / SOCKET HOUSING CAVITY.
3. BOARD COMPONENT KEEP-INS AND MECHANICAL COMPONENT KEEP-OUTS TO BE UTILIZED WITH SUFFICIENT ALLOWANCES FOR PLACEMENT AND SIZE TOLERANCES, ASSEMBLY PROCESS ACCESS, AND DYNAMIC EXCURSIONS. 4. ASSUME SYMMETRY FOR UNDIMENSIONED CORNERS AND EDGES.
5 REFER TO INTEL PART DRAWING D82246 FOR ILM AND SOCKET KEEPIN VOLUME DIMENSIONS. 6 NON-GROUNDED COPPER SURFACE ADDED TO INCREASE PCB DURABILITY. 7 . COMBINED COMPONENT AND SOLDER PASTE HEIGHT INCLUDING TOLERANCES AFTER REFLOW.
BOARD PRIMARY SIDE
2
2
PACKAGE BOUNDARY
ILM BOUNDARY 5
LEVER UNHOOKED POSITION
LEGEND
SOCKET/THERMO/MECHANICAL COMPONENT KEEP-INS 10.10 MM MAX COMPONENT HEIGHT 7 2.5 MM MAX COMPONENT HEIGHT 7 1.2 MM MAX COMPONENT HEIGHT 7 1.97 MM MAX COMPONENT HEIGHT 7 BOARD ROUTING KEEP-OUT 27 MM MAX COMPONENT HEIGHT 7 26 MM MAX COMPONENT HEIGHT 7