HP Integrity BL860c i2, BL870c i2 & BL890c i2 Server Blade User Service Guide HP Part Number: AD399-9003A Published: April 2010 Edition: 1
Copyright © 2010, Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.
Table of Contents 1 Overview.........................................................................................................................9 Server blade overview............................................................................................................................9 Server blade dimensions and weight................................................................................................9 Server blade components...........................................................
Interconnect bay numbering and device mapping...............................................................42 Installing the server blade into the enclosure..................................................................................43 Installing the Scaleable BladeLink...................................................................................................45 Server blade power states.............................................................................................................
Troubleshooting the management subsystem .....................................................................................68 Firmware...............................................................................................................................................68 Identifying and troubleshooting firmware issues...........................................................................68 Verify and Install the Latest Firmware..................................................................
Before you contact HP.....................................................................................................................87 HP contact information...................................................................................................................87 Subscription service.........................................................................................................................87 Documentation feedback.................................................................
Creating a logical drive..................................................................................................................118 Deleting a logical drive..................................................................................................................119 Useful UEFI command checks.......................................................................................................120 Index.........................................................................................
List of Tables 3-1 3-2 3-3 5-1 5-2 5-3 5-4 A-1 B-1 D-1 8 DIMM pair load order...................................................................................................................33 DIMM quad load order.................................................................................................................34 Power States...................................................................................................................................47 Troubleshooting Entry Points ....
1 Overview The HP Integrity BL860c i2 Server Blade is a dense, low-cost, Intel® Itanium® processor server blade. Using a Scaleable Blade Link hardware assembly, multiple BL860c i2 Server Blades can be conjoined to create dual-blade, four socket and quad-blade eight socket variants.
Server blade components 1 2 3 4 5 6 7 CPU0 CPU0 power connector Mezzanine connector 1 (type 1) Mezzanine connector 2 (type 1 or 2) System board thumbscrew Battery (CR2032) System board thumbscrew 8 9 10 11 12 13 ICH mezzanine connector Mezzanine connector 3 (type 1 or 2) CPU1 power connector CPU1 SAS backplane Pull tab SAS disk drives The BL860c i2 Server Blade has SAS disk drive slots on the BL860c i2 server blade. The SAS disk drives have identical LEDs that display the drive status.
For the location of the SAS disk LEDs, see “SAS disk drive LEDs” (page 16). SAS disk backplane The SAS disk backplane supports two small form factor hard disk drives. The backplane supports hot-plugging a single SAS drive at a time. The activity LEDs and drive present LEDs are controlled by a preprogrammed system-on-chip. The system board hosts the SAS controller and supplies 12 V, 5 V, and 3.3 V standby power to the backplane.
DIMMs The memory subsystem supports only DDR3 SDRAM technology using industry-standard 1.2” high DIMMs. Single DIMM sizes BL860c i2 Min / Max BL870c i2 Min / Max Memory size Memory size BL890c i2 Min / Max Memory size 2 GB 8 GB / 48 GB Not supported Not supported 4 GB 8 GB / 96 GB 16 GB / 192 GB 32 GB / 384 GB 8 GB 16 GB / 192 GB 32 GB / 384 GB 32 GB / 768 GB For more DIMM information, see “Installing DIMMs” (page 32). Power subsystem The power subsystem is located on the system board.
2. Use the indent to pull the door open. For more information see “Installing the Scaleable BladeLink” (page 45). Enclosure information All three blade configurations are supported in c7000 and c3000 Enclosures. For more enclosure information see: http://h71028.www7.hp.com/enterprise/cache/316735-0-0-0-121.html.
Controls, ports, and LEDs Front panel view 1 2 3 4 Monarch blade indicator UID LED Blade health LED NICs 1, 2, 3, 4 CAUTION: 5 6 7 8 Monarch power button HDD bay 1 HDD bay 2 Blade power LED 9 10 11 Partition Identifier Physical Presence Button SUV connector The SUV cable is not designed to be used as a permanent connection. Use caution when walking near the server blade when the SUV cable is installed. Hitting or bumping the cable might cause the port on the server blade to break.
Front panel LEDs Item Description Status 1 Monarch blade indicator Green = Blade is acting as monarch blade Off = Blade is not monarch or is not conjoined 2 UID LED Blue = Identified Blue flashing = Active remote management Off = No active remote management 3 Blade health LED Green = Normal operation Amber flashing = Degraded condition Red flashing = Critical condition 4 NICs 1, 2, 3, 4 Green = Network linked Green flashing = Network activity Off = No link or activity 5 Monarch power button
Item Description Status 9 Blade power LED Green = Server blade is powered on Amber = standby (auxiliary power available)* Off = Off iLO Heartbeat (behind grill) Green flashing = iLO Active Amber flashing = iLO failure Off = no standby voltage *If the Onboard Administrator denies power to the server blade, the server blade returns to Standby mode. SAS disk drive LEDs There are two disk drives on the BL860c i2 Server Blade. They have identical LEDs that display the drive status.
Online/activity LED (green) Fault/UID LED (amber/blue) Interpretation Flashing regularly (1 Hz) Amber, flashing regularly (1 Hz) Do not remove the drive. Removing a drive might terminate the current operation and cause data loss. The drive is part of an array that is undergoing capacity expansion or stripe migration, but a predictive failure alert has been received for this drive. To minimize the risk of data loss, do not replace the drive until the expansion or migration is complete.
Scaleable BladeLink LEDs 18 Description Status Busy LED Green = Scaleable BladeLink is currently active. Do not remove. Off = Scaleable BladeLink is not currently active. Safe to remove.
SUV Cable and Ports The SUV port on the front of the server blade is used in conjunction with an SUV cable to connect the server to external devices such as a terminal emulator or monitor. CAUTION: The SUV cable is not designed to be used as a permanent connection. Use caution when walking near the server blade when the SUV cable is installed. Hitting or bumping the cable might cause the port on the server blade to break. This can damage the system board.
2 General site preparation guidelines The HP Integrity BL860c i2 Server Blade does not have cooling or power systems. Cooling and power is provided by the c-Class enclosure. Enclosure environmental specifications NOTE: This information is for both c3000 and c7000 Enclosures. Specification Value Temperature range* Operating 10°C to 35°C (50°F to 95°F) Non-operating -30°C to 60°C (-22°F to 140°F) Wet bulb temperature Operating 28ºC (82.4ºF) Non-operating 38.7ºC (101.
3 Installing the server blade into the enclosure Safety information WARNING! Wear an ESD wrist strap when handling internal server components. Acceptable ESD wrist straps include: • The wrist strap that is included in the ESD kit with circuit checker (part number 9300-1609). • The wrist strap that is included in the ESD kit without circuit checker (part number 9300-1608). • The throw away strap that ships with HP memory products.
• • • • Gather LAN information. Determine the two IP addresses for the iLO 3 MP LAN and the server blade LAN. Establish a method to connect to the server blade console. For more information on console connection methods, see Section : “Using iLO” (page 47) for more information. Verify electrical requirements. Ensure that grounding specifications and power requirements are met. Confirm environmental requirements.
Installing a hot-plug SAS disk drive The server blade supports up to two hot-plug SAS drives. CAUTION: To prevent improper cooling and thermal damage, do not operate the server blade or the enclosure unless all hard drive and device bays are populated with either a component or a blank. IMPORTANT: The disk drive will not seat properly when 180 degrees out of alignment. Check the orientation before insertion. NOTE: For a list of supported disk drives for the server blade, see: http://h18004.www1.hp.
4. Close the lever to lock the drive into place. Installing internal components Removing the access panel 1. 2. 3. 4. 5. Power down the server blade (“Powering off the server blade”) Remove the server blade. (“Removing the server blade”). Unlock the cam on the access panel latch (if necessary) by turning the lock on the access panel latch counter-clockwise with a Torx T-15 or flathead screwdriver. Pull up on the access panel latch. This causes the access panel to slide back about 2 cm (0.75 in).
Installing a processor and heatsink module Processor load order Observe the following guidelines when installing additional processors: • In a BL860c i2, CPU0 is installed before CPU1. • In a BL870 i2 or BL890 i2, each blade must have CPU0 installed. • When adding additional CPUs in a conjoined configuration: — Load both CPU0 and CPU1 in the monarch blade first — Load additional CPUs in sequence, from lowest slot-numbered blade to highest. CAUTION: The pins on the processor socket are very fragile.
2. Transfer the duplicate part/serial numbers label from the processor module to the processor's heatsink. a. Remove the duplicate yellow tear-away label that lists the part and serial numbers from the processor module. b. Place the label on the top of the heatsink. 3. Install the processor over the load posts. NOTE: Ensure pin 1, indicated on the empty socket with an embossed triangle, matches the pin 1 marker on the processor module, the chamfered corner of its attached voltage regulator heatsink. 4.
CAUTION: During installation, after removing the protective cover from the heatsink: • Do not touch or come into contact with the thermal interface material. • Immediately install the heatsink. CAUTION: To avoid damage to the server blade and processor, ensure the processor heatsink's locking handle is fully back against the stops, rotated about 120° back. Also verify that the plastic tabs on the processor's heatsink are pulled fully out before installation. 5. Install the heatsink over the load posts.
CAUTION: To prevent thermal instability and damage to the server blade, do not separate the processor module from the processor's heatsink after they have been coupled. NOTE: Positive engagement clicking should occur during mating of the processor heat sink and processor module onto the socket to ensure proper seating.
6. Secure the heatsink to the processor a. Slide both plastic locking tabs into place (see callout 1 in the image below). b. Flip the latch down (see callout 2 in the image below). WARNING! The heatsink locking lever can constitute a pinch hazard, keep your hands on top of the lever during installation to avoid personal injury. CAUTION: To prevent thermal instability and damage to the server, do not separate the processor module from the processor's heatsink after they have been coupled. 7.
8. Tie wrap the processor cable to the right tie point on the processor assembly. CAUTION: When the CPU is installed, dress all slack in the power cable to the connector end of the cable. Failure to do so could result in pinched or damaged CPU power cables. NOTE: If you are adding an additional processor to your server blade, the DIMMs in the server blade must be reconfigured to support both CPUs. See “DIMM pair load order” (page 33) for more information.
DIMM pair load order Table 3-1 DIMM pair load order CPU0 CPU1 1st 3A 4A — — 2nd 9B 10B — — 3rd 1C 6C — — 4th 7D 12D — — 5th 2E 5E — — 6th 8F 11F — — 1st 3A 4A — — 2nd — — 1A 7A 3rd 9B 10B — — 4th — — 6B 10B 5th 1C 6C — — 6th — — 3C 9C 7th 7D 12D — — 8th — — 4D 12D 9th 2E 5E — — 10th — — 2E 8E 11th 8F 11F — — 12th — — 5F 11F CPU0 only Both CPUs loaded Installing additional components 33
DIMM quad load order rules Table 3-2 DIMM quad load order CPU0 Both CPUs loaded 34 CPU1 1st 3A 4A 9B 10B — — — — 2nd — — — — 1A 7A 6B 10B 3rd 1C 6C 7D 12D — — — — 4th — — — — 3C 9C 4D 12D 5th 2E 5E 8F 11F — — — — 6th — — — — 2E 8E 5F 11F Installing the server blade into the enclosure
DIMM locations To install the DIMMs: 1. 2. Remove the DIMM baffle (“Removing the DIMM baffle”). Locate the DIMM slots on the server blade system board.
NOTE: 3. The server blade ships with at least two DIMMs installed in slots 3A and 4A. Ensure the DIMM slot latches are open. CAUTION: Use only HP low profile (1.2 in.) DIMMs. DIMMs from other sources might adversely affect data integrity. DIMMs do not seat fully if turned the wrong way. DIMMs in a pair or quad must be identical. 4. Insert a DIMM in a slot and push down firmly until the latches click shut.
4. 5. Align the mezzanine connector on the option card with the mezzanine connector on the system board. Install the mezzanine card. Press down on the connector to seat the card: CAUTION: To prevent damage to the server blade, apply pressure over the mezzanine connector when installing the mezzanine card. Do not apply pressure to the edges of the card. 6. 7. 8. 9. Install the access panel (“Replacing the access panel”). Install the server blade (“Installing the server blade into the enclosure”).
3. 4. Slide the access panel toward the front of the server blade, and push down on the access panel latch until it is flush with the access panel. Lock the access panel cam (if necessary) by turning the cam clockwise with the Torx T–15 or flathead screwdriver. Installing and powering on the server blade Preparing the enclosure HP BladeSystem enclosures ship with device bay dividers to support half-height devices. To install a full height device, remove the blanks and the corresponding device bay divider.
Removing a c7000 device bay divider 1. Slide the device bay shelf locking tab to the left to open it. 2. Push the device bay shelf back until it stops, lift the right side slightly to disengage the two tabs from the divider wall, and then rotate the right edge downward (clockwise).
3. Lift the left side of the device bay shelf to disengage the three tabs from the divider wall, and then remove it from the enclosure. Removing a c3000 device bay mini-divider or device bay divider 1. 40 Slide the locking tab down.
2. Remove the mini-divider or divider: • c3000 mini-divider: Push the divider toward the back of the enclosure until the divider drops out of the enclosure. • a. b. c. d. c3000 divider Push the divider toward the back of the enclosure until it stops. Slide the divider to the left to disengage the tabs from the wall. Rotate the divider clockwise. Remove the divider from the enclosure.
Interconnect bay numbering and device mapping • HP BladeSystem c7000 Enclosure • HP BladeSystem c3000 Enclosure To support network connections for specific signals, install an interconnect module in the bay corresponding to the embedded NIC or mezzanine signals.
Server blade signal c7000 interconnect bay c3000 interconnect bay Mezzanine 2 5 and 6 3 and 4 7 and 8 3 and 4 5 and 6 3 and 4 7 and 8 3 and 4 Mezzanine 3 Interconnect bay labels For detailed port mapping information, see the HP BladeSystem enclosure installation poster or the HP BladeSystem enclosure setup and installation guide for your product on the HP website (http://www.hp.com/go/bladesystem/documentation).
3. Install the server blade. The server blade should come up to standby power. The server blade is at standby power if the blade power LED is amber.
Installing the Scaleable BladeLink NOTE: Before installing the Scaleable BladeLink for BL870c or BL890c, make sure the following statements are true: • All blades have the same CPU SKUs. • All blades have the same hardware revision • All blades have CPU0 installed. • All blades follow the memory loading rules for your configuration, see “Installing DIMMs” (page 32). • The enclosure OA firmware is compatible with the blade firmware. • The monarch blade has an ICH mezzanine card installed.
Partner blade bay location rules in half-height blade device bays Class Scaleable BladeLink part number Number of conjoined Supported blades enclosures Blade location rules SBL4 AD399-60006 4 (BL890c i2) c7000 only Bays 1, 2, 3, 4 or No 5, 6, 7, 8 N/A AD399-60007 4 (BL890c i2) c3000 only Bays 1, 2, 3, 4 N/A Partner blade support? No To install the Scaleable BladeLink: 1. 2. Log on to the OA.
Server blade power states The server blade has three power states: standby power, full power, and off. Install the server blade into the enclosure to achieve the standby power state. Server blades are set to power on to standby power when installed in a server blade enclosure. Verify the power state by viewing the LEDs on the front panel, and using Table 3-3. For more front panel LED information, see “Front panel LEDs” (page 15).
host server and operating system. The iLO subsystem provides remote access to any authorized network client, sends alerts, and provides other server management functions. Using iLO, you can: • • • Remotely power up, power down, or reboot the host server. Send alerts from iLO regardless of the state of the host server. Access advanced troubleshooting features through the iLO interface. For more information about iLO basic features, refer to the iLO documentation on the HP website (http://www.hp.
To view boot options, or launch a specific boot option, press B or b to launch the Boot Manager. To configure specific devices, press D or d to launch the Device Manager. This is an advanced feature and should only be performed when directed.
To perform maintenance on the system such as adding, deleting, or reordering boot options, press M or m to launch the Boot Maintenance Manager. To perform more advanced operations, press S or s to launch the UEFI Shell. To view the iLO LAN configuration, press I or i to launch the iLO Setup Tool. Saving UEFI configuration settings There are other UEFI settings you can configure at this time. For more UEFI configuration options, see Appendix B (page 93).
Installing the latest firmware using HP Smart Update Manager The HP Smart Update Manager utility enables you to deploy firmware components from either an easy-to-use interface or a command line. It has an integrated hardware discovery engine that discovers the installed hardware and the current versions of firmware in use on target servers. This prevents extraneous network traffic by only sending the required components to the target.
4 Installing, booting and shutting down the operating system Operating systems supported on the server blade HP-UX 11i v3 HWE 1003 Installing the operating system onto the server blade The following procedures describe generalized operating system installation. For more details, see the operating system documentation. Installing the OS from the external USB DVD device 1. 2. Connect the Integrity SUV cable to the front of the server blade.
To install the OS onto the server blade using Ignite-UX, go to www.hp.com/go/ignite-ux. Installing the OS using vMedia NOTE: Installing the OS using vMedia might be significantly slower than installing using other methods. Virtual Media (vMedia) enables connections of a DVD physical device or image file from the local client system to the remote server. The virtual device or image file can be used to boot the server with an operating system that supports USB devices.
1. Access the UEFI Shell environment. a. Log in to iLO for Integrity and enter CO to access the system console. When accessing the console, confirm that you are at the UEFI Front Page. If you are at another UEFI menu, then choose the Exit option or press X or x to exit the menu. Exit until you return to the screen that lists the keys that can be pressed to launch various Managers. b. 2. Press S or s to launch the UEFI shell.
Booting HP-UX from the UEFI Boot Manager 1. 2. 3. 4. 5. From the UEFI Boot Manager menu, choose an item from the boot options list to boot HP-UX. Access the UEFI Boot Manager menu for the server on which you want to boot HP-UX. Log in to iLO MP and enter CO to choose the system console. Confirm you are at the UEFI Front Page. If you are at another UEFI menu, then choose the Exit option or press X or x to exit the menu.
Booting HP-UX in LVM-maintenance mode The procedure for booting HP-UX into LVM Maintenance Mode is the same as for booting into single user mode (“Booting HP-UX in single-user mode”), except use the -lm boot option instead of the -is boot option: HPUX> boot -lm vmunix Shutting down HP-UX For more information, see the shutdown( 1M) manpage. To shut down HP-UX running on a server: 1. 2.
5 Troubleshooting This chapter provides strategies, procedures, and tools for troubleshooting server blade error and fault conditions. Methodology General troubleshooting methodology 1. Review the following list of symptoms: • Front Panel LED blinking • System Alert present on system console • Server blade will not power-up • Server blade will not boot • Error/Event Message received • MCA occurred 2. Narrow down the observed issue to the specific troubleshooting procedure required.
If the LEDs and SEL do not give you enough information for you to identify the issue you are experiencing, HP also provides diagnostic tools with each operating system (see “Troubleshooting tools” (page 64) for more details). NOTE: Always check the iLO MP SEL in the case of a blinking yellow or red front panel health LED, before replacing any hardware. Executing recommended troubleshooting methodology The recommended methodology for troubleshooting a server blade error or fault is as follows: 1. 2. 3. 4.
Table 5-2 Basic Low End Troubleshooting Step Condition Action 1 Server blade appears “dead” -- no front panel Nothing is logged for this condition. LEDs are on, and no fans are running. iLO MP 1. For new server installations, review the installation is running. procedures. 2. Verify that the enclosure power cords are connected to both the power supplies and to the AC receptacles. 3. Verify that AC power, at the proper AC voltage levels, is available to the receptacles. 4.
Table 5-2 Basic Low End Troubleshooting (continued) Step Condition Action 4b Cannot see UEFI prompt on system console. iLO Nothing can be logged for this condition. MP is running. 1. Examine the iLO MP logs for entries related to processors, processor power modules, and shared memory, and core I/O devices (see “Errors and error logs” (page 65) for more details). 2. As a last resort, replace the server blade. This issue is fixed when the UEFI menu appears on the system console.
Table 5-2 Basic Low End Troubleshooting (continued) Step Condition Action 6f “POWER_FAIL_IMPROPER_SBL” - Power command failed because the SBL currently installed is not appropriate for the blade slot (even/odd) and enclosure (c7000/c3000) being used 1. Ensure that the Scalable BladeLink installed in the correct slot and enclosure, see “Installing the Scaleable BladeLink” (page 45) 2. Ensure that the Scalable BladeLink is properly installed and fully seated. 3.
Table 5-3 Advanced Low End Troubleshooting (continued) Step Symptom/Condition 8a MCA occurs during server blade Front panel LEDs indicate that the server blade detected a fatal error operation. The server blade that it cannot recover from through OS recovery routines (for example, reboots the OS. health is flashing red and power is steady green). Note: The server blade reboots OS if enabled. Action 1. Capture the MCA dump with the UEFI command, errdump mca.
For more information, regarding the use of the Offline Diagnostics Environment, see the Offline Diagnostics Environment Administrator's and User's Guide (http://docs.hp.com/en/5992-6605/ 5992-6605.pdf).
• • • Event logs are the equivalent of the old chassis logs for status or error information output. Symbolic names are used in the source code; for example, MC_CACHE_CHECK. The hex code for each event log is 128 bits long with an architected format: — Some enumerated fields can be mapped to defined text strings. — All can be displayed in hex, keyword, or text mode. • Events are created by firmware or the OS and are stored in either or both of the SEL and forward progress event logs.
• • 5. Live Events Clear SELs Enter Ctrl–B to return to the MP Main Menu. SEL review 1. 2. Access the iLO MP command prompt. Run the sl command.
3 5 7 Enter -> 5. : Warning : Critical : Fatal alert level threshold or [Q] to quit filter setup: 3 Alert threshold level 3 filter will be applied. To decode the blinking state of a blade server LED, review the entire SEL and look at events with alert level 2 and above. Troubleshooting processors Processor installation order For a minimally loaded server blade, one processor must be installed in processor slot 0. Install a processor of the same version into processor slot 1 (if purchased).
To troubleshoot firmware issues: 1. 2. Verify that all server blade firmware components are from the same release (use the MP sysrev command). Reinstall server blade firmware. Verify and Install the Latest Firmware HP recommends that all firmware on all devices in your c-Class Ecosystem be updated to the latest version anytime a new Integrity Server Blade or other hardware component is added. HP also encourages you to check back often for any updates that may have been posted.
6 Removing and replacing components Preparing the server blade for servicing To service an internal server blade component, power down the server blade and remove it from the server blade enclosure. WARNING! Before proceeding with maintenance or service on a server blade that requires physical contact with electrical or electronic components, ensure that power is removed or safety precautions are followed to prevent electric shock and equipment damage. Observe all warning and caution labels on equipment.
Removing and replacing the server blade from the enclosure Removing the server blade CAUTION: After you press the release button, the server blade is unlocked from the enclosure. Use both hands to support the server blade when you remove it from the rack. The server blade weighs approximately 9 kg (20 lb). CAUTION: The enclosure fans might still be running when the server blade is in standby mode. Opening the lever removes all power from the server blade. 1. 2. 3. Power off the server blade.
2. 3. Unlock the cam on the access panel latch by turning the lock on the latch counterclockwise with a 2.5 mm Allen wrench. Pull up on the access panel latch. This causes the access panel to slide back about 1.75 cm (0.75 in). 4. Remove the access panel by lifting it straight up and off the server blade. Replacing the server blade access panel 1. 2. 3. 4. 5. 6. Ensure the access panel latch is in the open position (pointing up) before replacing the access cover.
Removing and replacing a disk drive To assess hard drive status, observe the SAS disk drive status LEDs. For an explanation of these LEDs, see “Front panel LEDs” (page 15). IMPORTANT: Before removing a SAS disk drive, perform a complete data backup. If disk drive mirroring is enabled, you do not have to power down the server blade before removing or replacing a SAS disk drive. If mirroring is not enabled, perform an OS shutdown before removing a disk drive to protect data.
Removing and replacing the Scaleable BladeLink NOTE: If you are replacing a faulty Scalable BladeLink, you must transfer the label with the blade serial number from the failed Scalable BladeLink to the replacement. Removing the Scaleable BladeLink Removing the Scaleable BladeLink from the BL860c i2 CAUTION: To prevent damage to the Scaleable BladeLink, make sure that the activity light is off before proceeding.
5. Place a plastic protector over the connector on the back of the Scaleable BladeLink and place it in an antistatic bag. NOTE: Plastic protectors are only provided with replacement Scaleable BladeLinks. Replacing the Scaleable BladeLink Replacing the Scaleable BladeLink on a BL860c i2 Server Blade 1. 2. 3. 4. 5. Power off the server blade and remove it from the enclosure (“Preparing the server blade for servicing”).
Removing and replacing the DIMM baffle CAUTION: To avoid damage to the server blade and the enclosure, install the DIMM baffle in the proper location after adding or replacing DIMMs. DIMM baffles that are missing or installed incorrectly can compromise server blade and enclosure cooling. Removing the DIMM baffle 1. 2. 3. Power down the server blade and remove it from the server blade enclosure (“Preparing the server blade for servicing”). Remove the access panel (“Removing the server blade access panel”).
3. 4. Install the access panel (“Replacing the server blade access panel”). Place the server blade back into the enclosure and power it up (“Replacing the server blade”). Removing and replacing DIMMs CAUTION: When a single DIMM is removed it must either be replaced with a new matching DIMM, or the DIMM load order must be adjusted. For the proper load order for DIMMs, see “Installing DIMMs” (page 32) . Removing DIMMs 1. 2. 3. 4. 5. 6.
Removing and replacing the CPU baffle Removing the CPU baffle CAUTION: To prevent damage to the server blade, never power on a server blade without a CPU baffle or processor in each processor socket. The CPU baffle is needed for proper system cooling CAUTION: Immediately install a CPU baffle in an empty CPU socket. To avoid damage to the socket pins, the socket should never be uncovered for more than 5 seconds. If the socket is damaged, the entire base blade must be replaced. 1. 2. 3.
Removing and replacing a processor and heatsink module WARNING! To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them. CAUTION: To prevent possible server malfunction, do not mix processors of different speeds or cache sizes. CAUTION: Removing a processor will cause the DIMM loading rules to change. See “Installing DIMMs” (page 32) and use the loading rules for two CPUs.
7. If the processor is not being replaced, install a CPU baffle (“Replacing the CPU baffle”). CAUTION: To avoid damage to processor socket pins and ensure proper system cooling, install a CPU baffle in an empty CPU socket. Replacing a processor See “Installing a processor and heatsink module” (page 27). Removing and replacing the SAS backplane Removing the SAS backplane 1. 2. 3. Power off the server blade and remove it from the enclosure (“Preparing the server blade for servicing”).
4. Lift the SAS back plane straight out of the server by the backplane handle. Replacing the SAS backplane 82 1. Slide the SAS backplane into the slot on the system board. 2. Install the disk drives or disk drive blanks (“Replacing a disk drive” or “Replacing a disk drive blank”).
Removing and replacing the server battery Removing the server battery If the server blade no longer automatically displays the correct date and time, you might have to replace the battery that provides power to the real-time clock. Under normal use, battery life is 5 to 10 years. WARNING! The computer contains an internal lithium manganese dioxide, a vanadium pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled.
3. Remove the mezzanine card. Replacing a mezzanine card See “Installing mezzanine cards” (page 36). Removing and replacing the ICH mezzanine board One ICH mezzanine board is required per system. The ICH is required in the BL860c i2. In the BL870 i2 and BL890 i2, the ICH mezzanine board is only required in the monarch blade. Removing the ICH mezzanine board 1. 2. 3. 84 Power off the server and remove it from the enclosure (“Preparing the server blade for servicing”).
Replacing the ICH mezzanine board 1. 2. Align the mezzanine connector on the option card with the mezzanine connector on the system board. Install the ICH mezzanine card. Press down on the connector to seat the card. CAUTION: To prevent damage to the server blade, apply pressure over the mezzanine connector when installing the mezzanine card. Do not apply pressure to the edges of the card.
Mezzanine covers 4 Backplane connector covers 2 Removing and replacing components
7 Support and other resources Contacting HP Before you contact HP Be sure to have the following information available before you call contact HP: • Technical support registration number (if applicable) • Product serial number • Product model name and number • Product identification number • Applicable error message • Add-on boards or hardware • Third-party hardware or software • Operating system type and revision level HP contact information For the name of the nearest HP authorized reseller: • • In the U
%, $, or # A percent sign represents the C shell system prompt. A dollar sign represents the system prompt for the Bourne, Korn, and POSIX shells. A number sign represents the superuser prompt. audit(5) A manpage. The manpage name is audit, and it is located in Section 5. Command A command name or qualified command phrase. Computer output Text displayed by the computer. Ctrl+X A key sequence.
Standard terms, abbreviations, and acronyms B BBWC Battery Backed Write Cache C CE Customer engineer CRU Customer replaceable unit E EFI Extensible Firmware Interface See also UEFI.
PCI Peripheral component interface PCI-X Peripheral component interconnect extended PCIe Peripheral component interconnect express POL Point-of-load POSSE Pre-OS system startup environment POST Power-On Self-Test Q QPI Intel QuickPath Interconnect S SAL System abstraction layer SAS Serial attached SCSI SATA Serial ATA SBA System bus adapter SEL System event log SFM System fault management SGPIO Serial general purpose input/output SMH System management homepage SSH Secure Shell
A Parts information Server blade components list NOTE: Part numbers are found by using the part nomenclature from this list to select the correct part from HP Partsurfer (http://www.partsurfer.hp.com/search.aspx). Table A-1 CRU List Description Memory 2 GB DDR3 memory 4 GB DDR3 memory 8 GB DDR3 memory Processors Intel Itanium Processor Quad Core 1.86GHz/24MB (DBS) Intel Itanium Processor Quad Core 1.73GHz/20MB (DBS) Intel Itanium Processor Quad Core 1.46GHz/16MB (No DBS) Intel Itanium Processor Dual Core 1.
Table A-1 CRU List (continued) Description CoP2E-M CoP2E-S Miscellaneous Memory Airflow Baffle ICH Mezz Card w/ TPM ICH Mezz Card w/o TPM CPU Heatsink Blade Top Cover System Chassis BL8x0c i2 Base Unit CPU Socket Dust Cover (& airflow baffle) 92 Parts information
B Utilities UEFI UEFI is an OS and platform-independent boot and preboot interface. UEFI resides between the OS and platform firmware, allowing the OS to boot without having details about the underlying hardware and firmware. UEFI supports boot devices, uses a flat memory model, and hides platform and firmware details from the OS. NOTE: Unified EFI Forum, Inc. defines the specification used to implement UEFI.
Table B-1 UEFI Shell Commands (continued) 94 UEFI Shell Command Definition cpuconfig Deconfigure/Reconfigure CPU sockets and threads date Displays or changes the current system date dblk Displays one or more blocks from a block device dbprofile Manage direct boot profiles default Set default values devices Displays the list of devices managed by UEFI drivers devtree Displays the UEFI Driver Model compliant device tree dh Displays UEFI handle information disconnect Disconnects one or mor
Table B-1 UEFI Shell Commands (continued) UEFI Shell Command Definition map Displays or defines mappings memconfig Set/View memory configuration settings memmap Displays the memory map mkdir Creates one or more directories mm Displays or modifies MEM/MMIO/IO/PCI/PCIE address space mode Displays or changes the console output device mode mount Mounts a file system on a block device mv one or more files or directories to another location openinfo Displays the protocols and agents associated
Drive paths in UEFI Devices in the server blade are represented by device paths in the UEFI shell. Each internal SAS drive could be configured either as: • RAID mode • HBA (raw) mode NOTE: A SAS drive in RAID mode is identified by "Scsi" in the device path A SAS drive in HBA mode is identified by “SAS” in the device path. NOTE: Unlike parallel SCSI, you cannot correlate UEFI device paths to internal SAS disk drive bays with SAS regardless of RAID/HBA mode.
Boot Options the Boot Options menu contains the following options: • Add Boot Option • Delete Boot Option • Change Boot Order Add Boot Option Use this option to add items to the Boot Options list.
1. Select a boot device type. 2. File Explorer menu to locate the correct boot device. NOTE: File Explorer will load with the appropriate devices for the selected boot device. Delete Boot Option Use this option to remove boot options from the Boot Options list. NOTE: This does not delete any files, applications or drivers from your server.
1. 2. Press spacebar to toggle the checkbox for each boot options that you want to delete. Select Commit Changes and Exit to save the new settings and return to the Boot Maintenance Manager. Change Boot Order Use this option to change the order of boot options. If the first boot option fails, the server tries booting the second, then the third, and so forth, until a boot option succeeds or until all options have failed.
• • • Add Driver Option Delete Driver Option Change Driver Order Add Driver Option Use this option to add driver options. To add a driver option: 1. Select Add Driver Using File.
2. Use the File Explorer menu to locate the correct driver. Delete Driver Option Use this option to remove driver options. NOTE: This does not delete any files, applications or drivers from your server. To remove driver options: 1. Press spacebar to toggle the checkbox for each driver that you want to delete. 2. Select Commit Changes and Exit to save the new settings and return to the Boot Maintenance Manager. Change Driver Order Use this option to change the load order of driver options.
NOTE: This option boots the selected application or driver one time only. When you exit the application, you return to this menu. 1. Select a boot device type. 2. Use the File Explorer menu to locate the correct driver or file. Set Boot Next Value Use this option to run the selected boot option immediately upon entering the main Boot Manager menu. This option is useful for booting an option that only needs to be booted once, without changing any other setting in the main Boot Manager menu.
Reset System Use this option to perform a system reset. iLO MP The iLO MP is an independent support system for the server. It provides a way for you to connect to a server and perform administration or monitoring tasks for the server hardware. The iLO MP controls power, reset, ToC capabilities, provides console access, displays and records system events, and displays detailed information about the various internal subsystems.
C HP Smart Array P700m/512 Controller IMPORTANT: The HP Smart Array P700m Controller for HP ProLiant Servers User Guide includes a battery replacement procedure that uses the two driveless HDD trays included in the kit. This procedure is not supported on the Integrity i2 server blades. The HP Smart Array P700m/512 is a PCIe card supporting direct attach and shared SAS Storage. It includes additional components that are covered in section.
For installing the BBWC battery onto the bracket, the mounting bracket has: • A C-hook to restrain the battery cable • Two battery restraining clips to restrain the BBWC battery 1 2 Mezzanine foot Mezzanine post loop 3 Battery restraining clips 4 C-hook Installing the Controller Board Mezzanine slot support and preference: The HP Smart Array P700m/512 Controller is only supported in slots 1 or 3 in Integrity i2 server blades, it is not supported in mezzanine slot 2.
4. 5. Remove any mezzanine cards blocking access to the HP Smart Array P700m/512 Controller (“Removing a mezzanine card”). Plug the smaller battery cable plug into the cache module battery connector. IMPORTANT: NOTE: down. 6. 7. Only use the 11.5 inch battery cable (408658-001).
4. Temporarily remove any mezzanine card installed in slot 2 (“Removing a mezzanine card”). NOTE: If you will be installing the BBWC battery, ensure that the cache module is installed and the battery cable is plugged into the cache module (“Replacing the 512MB cache module”). NOTE: If you are not installing the p700m into slot 1, slot 1 must contain either another mezzanine card or mezzanine card blank. 5. Clip the mounting bracket onto the mezzanine card or mezzanine card blank.
3. 4. Remove the DIMM baffle (“Removing the DIMM baffle”). If the P700m controller is in mezzanine 1, and the battery cable is not already plugged into the cache module: a. Remove any mezzanine card installed in slot 2 so you can access the P700m's cache module (“Removing a mezzanine card”). b. Temporarily remove the cache module so you can access the module's battery connector (“Removing the 512MB cache module”). 5. IMPORTANT: Only use the 11.5 inch battery cable (408658-001).
9. Mount the battery onto the battery mounting bracket: a. Position the battery with the print side down and push the end of the battery cable that is plugged into the battery down under the battery mounting bracket's C-hook, routing the cable so its battery end is on the side of the hook that is away from slot 3. b. Push the other end of the battery down between the two restraining clips. c.
2. 3. • 6. 7. Lift the battery straight up to remove it from the battery mounting bracket. Push the battery cable down and towards the rear of the server blade to push it out of the battery bracket's C-hook. 4. Remove the battery mounting bracket from the mezzanine card or mezzanine card blank by pulling straight up on the bracket and lifting the bracket out of the server. Slot 3 1. Lift the BBWC battery straight up to remove it from the battery mounting bracket. 2.
6. Remove the battery mounting bracket Removing the BBWC battery CAUTION: If you need to remove the cache module to transfer data, the battery must remain connected so that the data is preserved. If you need to keep the battery connected to the cache module, follow the steps for 512MB cache module removal (“Removing the 512MB cache module”) instead of using this procedure. 1. 2. 3. 4. 5. 6. 7. 112 Back up all data. Close all applications.
8. Push the battery plug out of the battery connector.
D Configuring a Smart Array Controller Using the saupdate command The saupdate command is used to query or change the mode of the Smart Array P410i and Smart Array P411 controllers to HBA or RAID. Querying or changing modes is not supported for other controllers. The following are the newly added commands to SAUPDATE: • Get Mode • Set Mode Get Mode This command displays the current mode of the controllers.
Set Mode IMPORTANT: If you are using HBA mode, do not install any disk that has previously been a part of a RAID volume into the system. Set mode is used to change the mode of the controller. If the controller is already in the required mode the following message appears: The controller at is already in HBA|RAID mode Syntax saupdate set_mode [-f] can be any one of the strings listed in Table D-1 (page 115).
1. 2. 3. 4. At the UEFI shell, use the drivers command. Find the SAS Host Bus Adapter in the list of drivers, and make a note of the Driver ID from the left column. Use the drvcfg command. Find the SAS Host Bus Adapter’s Driver ID in the list, and make a note of the corresponding Ctrl ID. Configuring RAID volumes using the ORCA menu-driven interface NOTE: HP-UX software mirroring, RAID support for external storage and RAID support for the SB40c storage blade are currently available.
The ORCA main menu contains the following options: • Create Logical Drive • View Logical Drive • Delete Logical Drive NOTE: If you are configuring the HP Smart Array P700m/512 Controller or the HP StorageWorks SB40c storage blade (P400 controller), then you can enter ORCA from POST by pressing the F8 key when prompted. Creating a logical drive 1. At the ORCA main menu, select Create Logical Drive. 2. Select the physical disks to be included in the logical drive in the Available Physical Drives section.
6. 7. To save the configuration, press F8. To acknowledge that the configuration was saved and return to the ORCA Main Menu, press Enter. Deleting a logical drive WARNING! Back up all necessary data before deleting the logical drive. When you delete a logical drive, data on the drive is not preserved. 1. At the ORCA main menu, select Delete Logical Drive. 2. Select a logical drive to be deleted.
3. F3 to delete the logical drive. 4. To acknowledge that the configuration was saved and return to the ORCA Main Menu, press Enter. Useful UEFI command checks saupdate.efi list Use saupdate.efi list to list controller information such as the controller version. drivers Use drivers to find the driver version and DRV #.
pci–i Use pci–i to find vendor information.
Index A access panel removing, 72 replacing, 37, 73 antistatic wrist strap, 23 autoboot, 54 B battery mounting bracket parts, 105 boot option add, 97 change boot order, 99 delete, 98 Set Boot Next Value, 102 boot option maintenance manager menu, 96 boot options list, 54 add HP-UX, 54 booting from file, 101 HP-UX (LVM maintenance mode), 57 HP-UX (UEFI boot manager), 56 HP-UX (UEFI Shell), 56 HP-UX in single-server mode, 56 UEFI boot manager, 93 C c-Class enclosure (see enclosure) checking the inventory, 24
replacment, 108 controller board installation, 106 HP Smart Update Manager, 51 HP-UX booting in LVM maintenance mode, 57 booting in single-user mode, 56 Fault Management, 65 shutting down, 57 standard boot, 55 HP-UX Ignite, 50 HPSUM (see HP Smart Update Manager) NVRAM configuration utility, 50 I P I/O subsystem overview, 11 ICH Mezzanine board removing, 84 replacing, 85 ICH mezzanine card overview, 12 iLO MP, 103 accessing UEFI from, 48 event log, 66 inspecting the shipping container, 24 installation or
disk drive blank, 73 ICH Mezzanine board, 85 removing, 80 SAS backplane, 82 server battery, 83 server blade access panel, 73 returning a damaged server blade, 24 S safety information, 23 SAS backplane overview, 11 removing, 81 replacing, 82 SAS disk drives LEDs, 16 mirroring, 74 removing, 74 slot locations, 10 saupdate, 115, 116 firmware updates, 116 get mode, 115 set mode, 116 Scaleable BladeLink installing, 45 LEDs, 18 overview, 12 removing, 75 replacing, 76 server battery removing, 83 replacing, 83 serv
