Specifications

USB Bot Mass Storage Driver: 00000020
Generic USB Mass Storage Driver: 00000020
CLPrelay App: 00000100
* Indicates active system firmware image. In this case =>3.02 indicates that this server does not
need system firmware updated to use the memory modules described in this document.
The firmware upgrade instructions are included in the Release Notes on the firmware package
download page for your server product. To locate the Release Notes and download the firmware:
1. Go to http://www.hp.com/bizsupport.
2. Select Download Drivers and Software.
3. Select HP Integrity Servers.
4. Select the link for your server product.
After the firmware has been downloaded, you can install the memory. To install DIMMs, see
“Installing DIMMs” (page 32).
Power Subsystem
The power subsystem is located on the system board. Each server blade receives bulk DC voltage
from the enclosure. The server blade power block converts the DC voltage from the enclosure to
the voltage required by the server blade. The server blade receives 12 V directly from the enclosure.
The voltage passes through E-Fuse circuitry that resides in the blade. The 12 V supply is always
on as long as a power supply is installed in the enclosure. A control line from the enclosure onboard
administrator (OA) can turn the E-Fuse on or off to supply or cut power to the blade. The 12 V gets
distributed to various point-of-load (POL) converters. The switched POL voltage rails are: 0.9 V,
1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5.0 V, 3.3 V standby, and 5.0 V standby.
Processor and Core Electronics Complex
The processor subsystem holds one or two Intel Itanium dual-core processor modules. It consists of
the zx2 core electronics complex (CEC), a front side bus, a memory and I/O controller, system
clock generation and distribution, multiple POL converters, and I
2
C circuitry for manageability and
fault detection.
The front side bus speed is 267 MHz. The zx2 CEC and the processor modules are located on
the system board. A Zero Insertion Force (ZIF) socket connects the processors to the system board.
Heatsinks, processor metal frames, and bolster plates are part of the mechanical attach requirements
for the processors and the zx2.
Enclosure Information
This installation document covers only the HP Integrity BL860c server blade, and does not include
specific server blade enclosure information. For the server blade c-Class enclosure information,
see http://h71028.www7.hp.com/enterprise/cache/316735-0-0-0-121.html.
Controls, Ports, and LEDs
This section describes the controls, ports, and LEDs found on the front panel and rear panel of your
HP Integrity server blade.
For more information on LED functions and descriptions, see Chapter 5: “Troubleshooting”
(page 86).
Enclosure Information 19