HP StorageWorks XP20000 Disk Array Site Preparation Guide (AE190-96002, September 2007)

In dex
A
AC
plugs,35
power,33
AC cabling
European,36
North American,35
acoustics,27
additional comp onents ,17
air conditioning,24
and metallic par ticulate contamination,28
dust control,28
air pressure, 21, 24, 28
airborne contaminants,28
altitude,24
antistatic
carpeting,23
containers,21
floor wax,21
flooring,21
furniture,21
area
delivery,20
audience, 7
B
basic configuration,15
branch circuit requirements,36, 36
breakers,29, 33
building codes,21, 22,29
C
cables,22, 35
as safety hazards,22
Cat 5,28
floor cutouts for,23
in floor plans,22
mechanical vibration,26
power,33
raised floors,22
routing,28
sealing,21
shielded,28
unpacking,40
circuit breakers,29, 33
clearances,23
components, additional,17
computer room
air pressure,21
data comm requirements,28
electrical requirements,28
environmental requirements,24
general requirements,20
vapor barrier,21
windows,21
conductive
flooring,21
furniture,21
wax,21
conventions
text symbols, 8
conventions, document, 7
cords,35
power,33
current,33
customer, site prep responsibilities of,11
D
damage, shipping,39
data comm requirements,28
See also cables,28
delivery
area requirements,20
equipment,39
dimensions,17
disk array
acoustic specifications,27
basic configuration,15
delivery of,39
dimensions,17
electrical specifications,33
heat dissipation,26
humidity specifications,25
power connections,29, 33
power consumption,26
primary rack,15
second rack,15
unpacking,39
vibration specifications,25
disk chassis,15
disk controller,15
document
related documentation, 7
document conventions, 7
documentation
HP website, 7
providing feedback, 9
dust control,28
XP20000 Disk Array Site Preparation Guide
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