HP StorageWorks XP20000 Disk Array Site Preparation Guide (AE190-96002, September 2007)
Temperature spe
cifications
Temperature range type Range
Recommended op
erating temperature
21 to 24 degrees C
70
to 75 degrees F
Specified operating temperature
16 to 32 degrees C
61
to 89 degrees F
Nonoperating temperature
–10 to +43 degrees C
14
to 109 degrees F
Shipping and s
torage temperature (product packed
in
factory packing)
–25 to +60 degrees C
–13to+140degrees F
Temperature shock immunity (maximum rate of
temperature change)
10 degrees C per hour
18
degrees F per hour
Humidity spe
cifications
Maintain pr
oper
humidity levels. High humidity levels cause galvanic actions to occur between some
dissimilar metals. This eventually causes a high resistance between connections, leading to equipment
failure.
Low humidity contributes to undesirably high levels of electrostatic charges. This increases the electrostatic
discharg e (
ESD) voltage potential. ESD can cause component damage during ser vicing operations.
Low humidi
ty levels are often the result of the facility heating system and occur during the cold season.
Most heati
ng
systems provide air with a low humidity level, unless the system has a bu ilt-in humidifier.
You should not see any condensation in or around the disk array under any conditions. There is no
procedure for recovery fro m moisture c ondensation.
Humidity range type Noncondensing relative humidity (RH)
Operation humidity range at 22 de grees C (71
degrees F)
20%to80%
Not in operation humidity range
8% to 90%
Shipment and storage humidity range (product
packed in factory packing)
5% to 95%
Operati
on maximum wet bulb temperature
26 degrees C
79
degrees F
Not in operation maximum wet bulb temperature
27 degrees C
81
degrees F
Shipment and storage maximum wet bulb temperature
29 degrees C
84
degrees F
Mechanical vibration specifications
Continuous vibration can cause a slow degradation of mechanical parts and, when severe, can cause
data errors in disk drives. Mechanical connections such as printed circuit assembly (PCA) conductors,
cable
connectors, and processor backplane wiring can also b e affected by vibrations. Vibration
speci
fications apply to all three axes. For vibration testing m ethods, see AST M D4728-01 Test Methods
for R
andom Vibration Testing of Shipping Containers.
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